{"id":"https://openalex.org/W4403138318","doi":"https://doi.org/10.3390/s24196428","title":"Investigation of the Bending Process and Theory in Free-Boundary Pneumatic Film-Forming for Curved Image Sensors","display_name":"Investigation of the Bending Process and Theory in Free-Boundary Pneumatic Film-Forming for Curved Image Sensors","publication_year":2024,"publication_date":"2024-10-04","ids":{"openalex":"https://openalex.org/W4403138318","doi":"https://doi.org/10.3390/s24196428","pmid":"https://pubmed.ncbi.nlm.nih.gov/39409467"},"language":"en","primary_location":{"id":"doi:10.3390/s24196428","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s24196428","pdf_url":"https://www.mdpi.com/1424-8220/24/19/6428/pdf?version=1728030298","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/24/19/6428/pdf?version=1728030298","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056571959","display_name":"Weihan Zheng","orcid":"https://orcid.org/0000-0001-5885-0217"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210088164","display_name":"Changchun Institute of Optics, Fine Mechanics and Physics","ror":"https://ror.org/012rct222","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210088164"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Weihan Zheng","raw_affiliation_strings":["Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","institution_ids":["https://openalex.org/I4210088164","https://openalex.org/I19820366"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5107145325","display_name":"Chunlai Li","orcid":"https://orcid.org/0009-0004-9197-0578"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210088164","display_name":"Changchun Institute of Optics, Fine Mechanics and Physics","ror":"https://ror.org/012rct222","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210088164"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chunlai Li","raw_affiliation_strings":["Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":"https://orcid.org/0009-0004-9197-0578","affiliations":[{"raw_affiliation_string":"Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","institution_ids":["https://openalex.org/I4210088164","https://openalex.org/I19820366"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051637456","display_name":"Jiangcheng Hu","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210088164","display_name":"Changchun Institute of Optics, Fine Mechanics and Physics","ror":"https://ror.org/012rct222","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210088164"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiangcheng Hu","raw_affiliation_strings":["Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","institution_ids":["https://openalex.org/I4210088164","https://openalex.org/I19820366"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111958105","display_name":"Liang Guo","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210088164","display_name":"Changchun Institute of Optics, Fine Mechanics and Physics","ror":"https://ror.org/012rct222","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210088164"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Liang Guo","raw_affiliation_strings":["Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China","institution_ids":["https://openalex.org/I4210088164","https://openalex.org/I19820366"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5111958105"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210088164"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":0.1911,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":{"value":0.51265862,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"24","issue":"19","first_page":"6428","last_page":"6428"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.989799976348877,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9897000193595886,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.6568955779075623},{"id":"https://openalex.org/keywords/bent-molecular-geometry","display_name":"Bent molecular geometry","score":0.6077739000320435},{"id":"https://openalex.org/keywords/curvature","display_name":"Curvature","score":0.6036904454231262},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.5560130476951599},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.524190366268158},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.482043594121933},{"id":"https://openalex.org/keywords/forming-processes","display_name":"Forming processes","score":0.4766567349433899},{"id":"https://openalex.org/keywords/boundary","display_name":"Boundary (topology)","score":0.457818865776062},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4563404619693756},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4239344596862793},{"id":"https://openalex.org/keywords/diagonal","display_name":"Diagonal","score":0.41607820987701416},{"id":"https://openalex.org/keywords/plane","display_name":"Plane (geometry)","score":0.4152364432811737},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.31663209199905396},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.24338579177856445},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22551986575126648},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08891952037811279}],"concepts":[{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.6568955779075623},{"id":"https://openalex.org/C138211643","wikidata":"https://www.wikidata.org/wiki/Q675211","display_name":"Bent molecular geometry","level":2,"score":0.6077739000320435},{"id":"https://openalex.org/C195065555","wikidata":"https://www.wikidata.org/wiki/Q214881","display_name":"Curvature","level":2,"score":0.6036904454231262},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.5560130476951599},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.524190366268158},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.482043594121933},{"id":"https://openalex.org/C139321929","wikidata":"https://www.wikidata.org/wiki/Q1363994","display_name":"Forming processes","level":2,"score":0.4766567349433899},{"id":"https://openalex.org/C62354387","wikidata":"https://www.wikidata.org/wiki/Q875399","display_name":"Boundary (topology)","level":2,"score":0.457818865776062},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4563404619693756},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4239344596862793},{"id":"https://openalex.org/C130367717","wikidata":"https://www.wikidata.org/wiki/Q189791","display_name":"Diagonal","level":2,"score":0.41607820987701416},{"id":"https://openalex.org/C17825722","wikidata":"https://www.wikidata.org/wiki/Q17285","display_name":"Plane (geometry)","level":2,"score":0.4152364432811737},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.31663209199905396},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.24338579177856445},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22551986575126648},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08891952037811279},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.3390/s24196428","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s24196428","pdf_url":"https://www.mdpi.com/1424-8220/24/19/6428/pdf?version=1728030298","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:39409467","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/39409467","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:pubmedcentral.nih.gov:11479379","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/11479379","pdf_url":"https://pmc.ncbi.nlm.nih.gov/articles/PMC11479379/pdf/sensors-24-06428.pdf","source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"},{"id":"pmh:oai:doaj.org/article:00fef5a6a1334afd875616a7804fe6f6","is_oa":false,"landing_page_url":"https://doaj.org/article/00fef5a6a1334afd875616a7804fe6f6","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 24, Iss 19, p 6428 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.3390/s24196428","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s24196428","pdf_url":"https://www.mdpi.com/1424-8220/24/19/6428/pdf?version=1728030298","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/16","display_name":"Peace, Justice and strong institutions","score":0.6000000238418579}],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":false},"content_urls":{"pdf":"https://content.openalex.org/works/W4403138318.pdf"},"referenced_works_count":22,"referenced_works":["https://openalex.org/W1964267217","https://openalex.org/W1982892642","https://openalex.org/W1995316486","https://openalex.org/W2069013687","https://openalex.org/W2087729698","https://openalex.org/W2148710454","https://openalex.org/W2157763436","https://openalex.org/W2297356828","https://openalex.org/W2514682546","https://openalex.org/W2616610097","https://openalex.org/W2619862143","https://openalex.org/W2792873444","https://openalex.org/W2913620593","https://openalex.org/W2962232268","https://openalex.org/W2971783372","https://openalex.org/W3023243491","https://openalex.org/W3027065653","https://openalex.org/W3030487910","https://openalex.org/W3031851080","https://openalex.org/W4200036252","https://openalex.org/W4200333791","https://openalex.org/W4225116243"],"related_works":["https://openalex.org/W2335716720","https://openalex.org/W2071445534","https://openalex.org/W2329706164","https://openalex.org/W2949764448","https://openalex.org/W2063795661","https://openalex.org/W2801493204","https://openalex.org/W2123763346","https://openalex.org/W2370151567","https://openalex.org/W2375399520","https://openalex.org/W2592432379"],"abstract_inverted_index":{"To":[0],"explore":[1],"the":[2,8,44,56,70,76,81,86,118,125,140,147,154,160,168,172,180],"bending":[3,97],"process":[4,65,170],"and":[5,26,35,92,108,139],"theory":[6,52,98],"of":[7,58,61,99,127,156],"free-boundary":[9],"aerodynamic":[10],"film":[11,128],"forming":[12,21,51,64],"method":[13,101],"for":[14,113],"curved":[15],"detectors,":[16],"this":[17,100,121],"study":[18,122],"integrates":[19],"practical":[20],"structures":[22],"with":[23],"theoretical":[24],"analysis":[25,41],"establishes":[27],"a":[28,110,136],"simulation":[29],"model":[30],"to":[31,48,55,135,176],"investigate":[32],"stress,":[33],"strain,":[34],"morphological":[36],"changes":[37],"during":[38,167],"bending.":[39],"The":[40,63,95],"indicates":[42],"that":[43,124,174],"shift":[45],"from":[46,75],"\"projection\"":[47],"\"wrapping\"":[49,96],"in":[50,89,117,159,179],"is":[53,150,171],"due":[54],"release":[57],"boundary":[59],"degrees":[60],"freedom.":[62],"can":[66,130],"be":[67,177],"summarized":[68],"as":[69],"mold's":[71],"arc":[72],"characteristics,":[73],"originating":[74],"chip's":[77,82],"corners,":[78],"gradually":[79],"replacing":[80],"rectangular":[83],"characteristics":[84],"along":[85],"diagonal,":[87],"resulting":[88],"corresponding":[90],"stress":[91],"strain":[93],"changes.":[94],"has":[102],"significant":[103],"advantages":[104],"over":[105],"traditional":[106],"methods":[107],"represents":[109],"crucial":[111],"direction":[112,173],"achieving":[114],"higher":[115],"curvature":[116],"future.":[119,181],"However,":[120],"found":[123],"use":[126,155],"pressure":[129],"only":[131],"inhibit":[132],"out-of-plane":[133,165],"deformation":[134,166],"certain":[137],"extent,":[138],"buckling":[141],"phenomenon":[142],"will":[143],"still":[144],"occur":[145],"when":[146],"thinner":[148,157],"chip":[149],"bent.":[151],"It":[152],"prevents":[153],"chips":[158],"thinning-bending":[161],"method,":[162],"so":[163],"avoiding":[164],"molding":[169],"needs":[175],"broken":[178]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2025-10-10T00:00:00"}