{"id":"https://openalex.org/W4282972983","doi":"https://doi.org/10.3390/s22124511","title":"Considerations and Limits of Embedding Sensor Nodes for Structural Health Monitoring into Fiber Metal Laminates","display_name":"Considerations and Limits of Embedding Sensor Nodes for Structural Health Monitoring into Fiber Metal Laminates","publication_year":2022,"publication_date":"2022-06-14","ids":{"openalex":"https://openalex.org/W4282972983","doi":"https://doi.org/10.3390/s22124511","pmid":"https://pubmed.ncbi.nlm.nih.gov/35746291"},"language":"en","primary_location":{"id":"doi:10.3390/s22124511","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22124511","pdf_url":"https://www.mdpi.com/1424-8220/22/12/4511/pdf?version=1655274147","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/22/12/4511/pdf?version=1655274147","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015955926","display_name":"Sarah Bornemann","orcid":"https://orcid.org/0000-0002-1840-3591"},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Sarah Bornemann","raw_affiliation_strings":["Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077352854","display_name":"Walter Lang","orcid":"https://orcid.org/0000-0002-9813-5231"},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Walter Lang","raw_affiliation_strings":["Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5015955926"],"corresponding_institution_ids":["https://openalex.org/I180437899"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":1.0315,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.72558386,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":98},"biblio":{"volume":"22","issue":"12","first_page":"4511","last_page":"4511"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10534","display_name":"Structural Health Monitoring Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10534","display_name":"Structural Health Monitoring Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12682","display_name":"Smart Materials for Construction","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2310","display_name":"Pollution"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/embedding","display_name":"Embedding","score":0.7067886590957642},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6761184930801392},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6266798973083496},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6228969097137451},{"id":"https://openalex.org/keywords/structural-health-monitoring","display_name":"Structural health monitoring","score":0.5924100875854492},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5881588459014893},{"id":"https://openalex.org/keywords/wireless-sensor-network","display_name":"Wireless sensor network","score":0.5081281661987305},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5007047653198242},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.49070489406585693},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.4577559232711792},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.44504451751708984},{"id":"https://openalex.org/keywords/environmental-tests","display_name":"Environmental tests","score":0.43501368165016174},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42732298374176025},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4233609437942505},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40016090869903564},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.39075008034706116},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33749669790267944},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29750803112983704},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.25205546617507935},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22314882278442383},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.20421326160430908},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.16766682267189026},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12484753131866455}],"concepts":[{"id":"https://openalex.org/C41608201","wikidata":"https://www.wikidata.org/wiki/Q980509","display_name":"Embedding","level":2,"score":0.7067886590957642},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6761184930801392},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6266798973083496},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6228969097137451},{"id":"https://openalex.org/C2776247918","wikidata":"https://www.wikidata.org/wiki/Q1423713","display_name":"Structural health monitoring","level":2,"score":0.5924100875854492},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5881588459014893},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.5081281661987305},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5007047653198242},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.49070489406585693},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.4577559232711792},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.44504451751708984},{"id":"https://openalex.org/C7576483","wikidata":"https://www.wikidata.org/wiki/Q5381371","display_name":"Environmental tests","level":2,"score":0.43501368165016174},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42732298374176025},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4233609437942505},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40016090869903564},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.39075008034706116},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33749669790267944},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29750803112983704},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.25205546617507935},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22314882278442383},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20421326160430908},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.16766682267189026},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12484753131866455},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[{"descriptor_ui":"D004553","descriptor_name":"Electric Conductivity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004553","descriptor_name":"Electric Conductivity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004553","descriptor_name":"Electric Conductivity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004581","descriptor_name":"Electronics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004581","descriptor_name":"Electronics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004581","descriptor_name":"Electronics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008670","descriptor_name":"Metals","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008670","descriptor_name":"Metals","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008670","descriptor_name":"Metals","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D013696","descriptor_name":"Temperature","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D013696","descriptor_name":"Temperature","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D013696","descriptor_name":"Temperature","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false}],"locations_count":5,"locations":[{"id":"doi:10.3390/s22124511","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22124511","pdf_url":"https://www.mdpi.com/1424-8220/22/12/4511/pdf?version=1655274147","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:35746291","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/35746291","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:d3734dd485f94abc91672dd586676e23","is_oa":true,"landing_page_url":"https://doaj.org/article/d3734dd485f94abc91672dd586676e23","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 22, Iss 12, p 4511 (2022)","raw_type":"article"},{"id":"pmh:oai:mdpi.com:/1424-8220/22/12/4511/","is_oa":true,"landing_page_url":"https://dx.doi.org/10.3390/s22124511","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors; Volume 22; Issue 12; Pages: 4511","raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:9227643","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/9227643","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s22124511","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22124511","pdf_url":"https://www.mdpi.com/1424-8220/22/12/4511/pdf?version=1655274147","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6782881301","display_name":null,"funder_award_id":"418311604","funder_id":"https://openalex.org/F4320320879","funder_display_name":"Deutsche Forschungsgemeinschaft"}],"funders":[{"id":"https://openalex.org/F4320320879","display_name":"Deutsche Forschungsgemeinschaft","ror":"https://ror.org/018mejw64"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4282972983.pdf","grobid_xml":"https://content.openalex.org/works/W4282972983.grobid-xml"},"referenced_works_count":18,"referenced_works":["https://openalex.org/W1965468485","https://openalex.org/W1992527153","https://openalex.org/W2001124413","https://openalex.org/W2047982368","https://openalex.org/W2050248078","https://openalex.org/W2068708188","https://openalex.org/W2094701213","https://openalex.org/W2297328586","https://openalex.org/W2557925458","https://openalex.org/W2789532283","https://openalex.org/W2914316664","https://openalex.org/W2964098147","https://openalex.org/W2964174530","https://openalex.org/W2995431906","https://openalex.org/W3117962093","https://openalex.org/W4200094634","https://openalex.org/W4205473754","https://openalex.org/W4212978404"],"related_works":["https://openalex.org/W2188146187","https://openalex.org/W4372294755","https://openalex.org/W2036494154","https://openalex.org/W2379772394","https://openalex.org/W3123114176","https://openalex.org/W16482907","https://openalex.org/W2364791190","https://openalex.org/W3135784728","https://openalex.org/W2374335651","https://openalex.org/W1538083251"],"abstract_inverted_index":{"The":[0,40,69],"objective":[1],"of":[2,10,54,73,111,117,126,137,139,148,170,195],"this":[3,43,161],"article":[4],"is":[5,45,205,219],"to":[6,46,64,98,151,159,191,207,211,221],"present":[7],"the":[8,14,22,30,52,58,124,132,135,140,146,167,193,212,248],"results":[9],"our":[11],"investigations":[12],"concerning":[13],"environmental":[15],"conditions":[16,51,93,227],"that":[17,217,238,242],"can":[18,60],"be":[19,61,181,245],"expected":[20,206],"during":[21,247],"embedding":[23,175,196,249],"process":[24,176],"into":[25,57,224],"fibre":[26],"metal":[27,173],"laminates":[28],"and":[29,63,78,114,156,202],"consequences":[31],"for":[32,36,48,67,177,186],"a":[33,171],"sensor":[34,55,70,198],"node":[35],"structural":[37,178],"health":[38],"monitoring.":[39],"idea":[41],"behind":[42],"investigation":[44],"determine":[47,192],"which":[49],"manufacturing":[50,141],"integration":[53],"nodes":[56,71],"material":[59],"done":[62],"identify":[65],"limits":[66,194,241],"this.":[68],"consist":[72],"commercially":[74],"available":[75],"integrated":[76],"circuits":[77],"passive":[79],"components":[80,133,179],"soldered":[81],"onto":[82],"an":[83],"adhesive-less":[84],"flexible":[85],"printed":[86],"circuit":[87],"board.":[88],"They":[89],"are":[90,103,154,162,234,240],"tested":[91],"under":[92,134,226],"above":[94,229],"their":[95,230],"specified":[96],"limits,":[97],"find":[99],"out":[100],"if":[101],"they":[102],"still":[104],"working":[105],"reliably":[106],"after":[107],"experiencing":[108],"155":[109],"min":[110],"180":[112],"\u2218C":[113,185],"7":[115],"bar":[116],"pressure.":[118],"Apart":[119],"from":[120],"occurring":[121],"temperature":[122,203],"damage,":[123],"effect":[125],"surrounding":[127],"fibres":[128],"potentially":[129],"pushing":[130],"away":[131],"amount":[136],"pressure":[138],"process,":[142],"as":[143,145],"well":[144],"potential":[147],"shorts":[149],"due":[150],"conductive":[152],"fibers":[153],"investigated":[155],"suitable":[157],"solutions":[158],"prevent":[160],"evaluated.":[163],"One":[164],"experiment":[165],"exceeding":[166],"typical":[168],"requirements":[169],"fiber":[172],"laminate":[174],"will":[180],"conducted":[182],"at":[183],"250":[184],"10":[187],"h,":[188],"in":[189],"order":[190],"electronic":[197,213],"nodes.":[199],"This":[200],"time":[201],"combination":[204],"cause":[208],"irreversible":[209],"damage":[210],"system.":[214],"Results":[215],"show":[216],"it":[218],"possible":[220],"integrate":[222],"electronics":[223],"materials":[225],"far":[228],"specifications":[231],"when":[232],"precautions":[233],"taken":[235],"but":[236],"also":[237],"there":[239],"must":[243],"not":[244],"exceeded":[246],"process.":[250]},"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":4}],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2025-10-10T00:00:00"}