{"id":"https://openalex.org/W4221117574","doi":"https://doi.org/10.3390/s22062114","title":"Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter","display_name":"Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter","publication_year":2022,"publication_date":"2022-03-09","ids":{"openalex":"https://openalex.org/W4221117574","doi":"https://doi.org/10.3390/s22062114","pmid":"https://pubmed.ncbi.nlm.nih.gov/35336284"},"language":"en","primary_location":{"id":"doi:10.3390/s22062114","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22062114","pdf_url":"https://www.mdpi.com/1424-8220/22/6/2114/pdf?version=1646819121","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/22/6/2114/pdf?version=1646819121","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069562923","display_name":"Zuohuan Chen","orcid":"https://orcid.org/0000-0002-3795-5981"},"institutions":[{"id":"https://openalex.org/I75867142","display_name":"Xiamen University of Technology","ror":"https://ror.org/01285e189","country_code":"CN","type":"education","lineage":["https://openalex.org/I75867142"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zuohuan Chen","raw_affiliation_strings":["School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China"],"raw_orcid":"https://orcid.org/0000-0002-3795-5981","affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China","institution_ids":["https://openalex.org/I75867142"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101795019","display_name":"Daquan Yu","orcid":"https://orcid.org/0000-0001-8065-2612"},"institutions":[{"id":"https://openalex.org/I75867142","display_name":"Xiamen University of Technology","ror":"https://ror.org/01285e189","country_code":"CN","type":"education","lineage":["https://openalex.org/I75867142"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Daquan Yu","raw_affiliation_strings":["School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China"],"raw_orcid":"https://orcid.org/0000-0001-8065-2612","affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China","institution_ids":["https://openalex.org/I75867142"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100603615","display_name":"Yi Zhong","orcid":"https://orcid.org/0009-0003-0637-0985"},"institutions":[{"id":"https://openalex.org/I75867142","display_name":"Xiamen University of Technology","ror":"https://ror.org/01285e189","country_code":"CN","type":"education","lineage":["https://openalex.org/I75867142"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi Zhong","raw_affiliation_strings":["School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China","institution_ids":["https://openalex.org/I75867142"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5101795019"],"corresponding_institution_ids":["https://openalex.org/I75867142"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2673},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2673},"fwci":1.0415,"has_fulltext":true,"cited_by_count":20,"citation_normalized_percentile":{"value":0.73146119,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"22","issue":"6","first_page":"2114","last_page":"2114"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9753000140190125,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7831286787986755},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7507997751235962},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.612395703792572},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.6018205285072327},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5552955865859985},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.5223059058189392},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.4288023114204407},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.418912798166275},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27546706795692444},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.255343496799469},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.22710758447647095},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.21264418959617615},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1442977488040924}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7831286787986755},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7507997751235962},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.612395703792572},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.6018205285072327},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5552955865859985},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.5223059058189392},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.4288023114204407},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.418912798166275},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27546706795692444},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.255343496799469},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.22710758447647095},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.21264418959617615},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1442977488040924}],"mesh":[],"locations_count":5,"locations":[{"id":"doi:10.3390/s22062114","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22062114","pdf_url":"https://www.mdpi.com/1424-8220/22/6/2114/pdf?version=1646819121","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:35336284","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/35336284","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:181a3aa065fc4f6bb007dc0739e90400","is_oa":true,"landing_page_url":"https://doaj.org/article/181a3aa065fc4f6bb007dc0739e90400","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 22, Iss 6, p 2114 (2022)","raw_type":"article"},{"id":"pmh:oai:mdpi.com:/1424-8220/22/6/2114/","is_oa":true,"landing_page_url":"https://dx.doi.org/10.3390/s22062114","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors; Volume 22; Issue 6; Pages: 2114","raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:8950703","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/8950703","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s22062114","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s22062114","pdf_url":"https://www.mdpi.com/1424-8220/22/6/2114/pdf?version=1646819121","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4099999964237213,"id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G234384929","display_name":null,"funder_award_id":"61974121","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320314997","display_name":"Strong","ror":"https://ror.org/041vyzr56"},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4221117574.pdf","grobid_xml":"https://content.openalex.org/works/W4221117574.grobid-xml"},"referenced_works_count":32,"referenced_works":["https://openalex.org/W1645226208","https://openalex.org/W2012470391","https://openalex.org/W2023954631","https://openalex.org/W2047570766","https://openalex.org/W2064448503","https://openalex.org/W2067734750","https://openalex.org/W2080846299","https://openalex.org/W2087248616","https://openalex.org/W2088503377","https://openalex.org/W2095400294","https://openalex.org/W2095477372","https://openalex.org/W2100533101","https://openalex.org/W2126680329","https://openalex.org/W2130959386","https://openalex.org/W2132732167","https://openalex.org/W2142058736","https://openalex.org/W2144212787","https://openalex.org/W2144327728","https://openalex.org/W2146579635","https://openalex.org/W2151037485","https://openalex.org/W2545782688","https://openalex.org/W2555765941","https://openalex.org/W2558776981","https://openalex.org/W2793778823","https://openalex.org/W2895942339","https://openalex.org/W2907635886","https://openalex.org/W3164090770","https://openalex.org/W3166134175","https://openalex.org/W3177291871","https://openalex.org/W3181335894","https://openalex.org/W4205205593","https://openalex.org/W4205499821"],"related_works":["https://openalex.org/W2146366317","https://openalex.org/W2070188681","https://openalex.org/W2163435227","https://openalex.org/W2001945326","https://openalex.org/W2743147755","https://openalex.org/W2970498257","https://openalex.org/W2919565175","https://openalex.org/W3066247946","https://openalex.org/W1515965320","https://openalex.org/W4283066921"],"abstract_inverted_index":{"The":[0,86,103,198,211],"development":[1],"of":[2,17,36,142,160,164,208],"5G":[3],"mobile":[4],"communication":[5,11],"created":[6],"the":[7,34,75,80,100,113,151,161,165,170,190,202,206],"need":[8],"for":[9],"high-frequency":[10],"systems,":[12],"which":[13,63],"require":[14],"vast":[15],"quantities":[16],"radio":[18],"frequency":[19],"(RF)":[20],"filters":[21],"with":[22,40,79,107,127],"a":[23,41,51,60,94,128,158],"high-quality":[24],"factor":[25],"(Q)":[26],"and":[27,48,71,73,99,176,221],"low":[28,219],"inband":[29],"losses.":[30],"In":[31,156],"this":[32],"study,":[33],"packaging":[35],"an":[37],"RF":[38,104,166,213],"filter":[39,105,167,214],"through-glass":[42],"via":[43,83],"(TGV)":[44],"interposer":[45,88],"was":[46],"designed":[47],"fabricated":[49],"using":[50],"three-dimensional":[52],"wafer-level":[53],"package":[54,168],"(3D":[55],"WLP).":[56],"TGV":[57],"fabrication":[58],"is":[59,110],"high-yielding":[61],"process,":[62],"can":[64,146],"produce":[65],"high":[66,217],"precision":[67],"vias":[68],"without":[69],"masking":[70],"lithography":[72],"reduce":[74],"manufacturing":[76],"cost":[77],"compared":[78],"through":[81],"silicon":[82],"(TSV)":[84],"solution.":[85],"glass":[87],"capping":[89,114],"wafer":[90,115],"contains":[91],"Cu-filled":[92],"TGV,":[93],"metal":[95],"redistribution":[96],"layer":[97],"(RDL),":[98],"bonding":[101,123,134],"layer.":[102],"substrate":[106],"Au":[108],"bump":[109],"bonded":[111],"to":[112],"based":[116],"on":[117],"Au-Sn":[118],"transient":[119],"liquid":[120],"phase":[121],"(TLP)":[122],"at":[124],"280":[125],"\u00b0C":[126],"40":[129],"kN":[130],"(approximately":[131],"6.5":[132],"MPa)":[133],"force.":[135],"Experimental":[136],"results":[137],"show":[138],"that":[139],"shear":[140],"strengths":[141],"approx.":[143],"54.5":[144],"MPa":[145],"be":[147],"obtained,":[148],"higher":[149],"than":[150],"standard":[152,194],"requirement":[153],"(~6":[154],"MPa).":[155],"addition,":[157],"comparison":[159],"electrical":[162],"performance":[163],"after":[169],"pre-conditional":[171],"level":[172],"three":[173],"(Pre-Con":[174],"L3)":[175],"unbiased":[177],"highly":[178],"accelerated":[179],"stress":[180],"(uHAST)":[181],"tests":[182,204],"showed":[183],"no":[184],"difference":[185],"in":[186,205],"insertion":[187],"attenuation":[188],"across":[189],"passband":[191],"(<0.2":[192],"dB,":[193],"value:":[195],"<1":[196],"dB).":[197],"final":[199],"packages":[200],"passed":[201],"reliability":[203],"field":[207],"consumer":[209],"electronics.":[210],"proposed":[212],"WLP":[215],"achieves":[216],"performance,":[218],"cost,":[220],"superior":[222],"reliability.":[223]},"counts_by_year":[{"year":2026,"cited_by_count":6},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":3}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}