{"id":"https://openalex.org/W3000723942","doi":"https://doi.org/10.3390/s20020337","title":"A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology","display_name":"A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology","publication_year":2020,"publication_date":"2020-01-07","ids":{"openalex":"https://openalex.org/W3000723942","doi":"https://doi.org/10.3390/s20020337","mag":"3000723942","pmid":"https://pubmed.ncbi.nlm.nih.gov/31936069"},"language":"en","primary_location":{"id":"doi:10.3390/s20020337","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s20020337","pdf_url":"https://www.mdpi.com/1424-8220/20/2/337/pdf?version=1579413978","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/20/2/337/pdf?version=1579413978","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101075084","display_name":"Peishuai Song","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peishuai Song","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031616117","display_name":"Chaowei Si","orcid":"https://orcid.org/0000-0002-0093-9881"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Chaowei Si","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100349273","display_name":"Mingliang Zhang","orcid":"https://orcid.org/0000-0002-6421-7730"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Mingliang Zhang","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100982420","display_name":"Yongmei Zhao","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yongmei Zhao","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101821532","display_name":"Yurong He","orcid":"https://orcid.org/0000-0002-3242-986X"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yurong He","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112448091","display_name":"Wen Liu","orcid":"https://orcid.org/0000-0003-2729-1787"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wen Liu","raw_affiliation_strings":["Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100382697","display_name":"Xiaodong Wang","orcid":"https://orcid.org/0000-0003-0426-1358"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210089056","display_name":"Beijing Microelectronics Technology Institute","ror":"https://ror.org/007y7ej30","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]},{"id":"https://openalex.org/I4210149211","display_name":"Institute of Semiconductors","ror":"https://ror.org/048dd0611","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"id":"https://openalex.org/I4210150858","display_name":"Beijing Academy of Quantum Information Sciences","ror":"https://ror.org/04nqf9k60","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210150858"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiaodong Wang","raw_affiliation_strings":["Beijing Academy of Quantum Information Science, Beijing 100193, China","Beijing Engineering Research Center of Semiconductor Micro-Nano Integrated Technology, Beijing 100083, China","Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":"https://orcid.org/0000-0003-0426-1358","affiliations":[{"raw_affiliation_string":"Beijing Academy of Quantum Information Science, Beijing 100193, China","institution_ids":["https://openalex.org/I4210150858"]},{"raw_affiliation_string":"Beijing Engineering Research Center of Semiconductor Micro-Nano Integrated Technology, Beijing 100083, China","institution_ids":["https://openalex.org/I4210089056"]},{"raw_affiliation_string":"Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210149211"]},{"raw_affiliation_string":"The School of Microelectronics & Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5031616117","https://openalex.org/A5100349273","https://openalex.org/A5100382697","https://openalex.org/A5100982420"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210089056","https://openalex.org/I4210149211","https://openalex.org/I4210150858","https://openalex.org/I4210165038"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2673},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2673},"fwci":1.8719,"has_fulltext":true,"cited_by_count":44,"citation_normalized_percentile":{"value":0.85192799,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"20","issue":"2","first_page":"337","last_page":"337"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8034716844558716},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7190629243850708},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6943627595901489},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.642225444316864},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.6286436319351196},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.6014820337295532},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.5626189112663269},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.5569536089897156},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5424256324768066},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5347117185592651},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4973435699939728},{"id":"https://openalex.org/keywords/borosilicate-glass","display_name":"Borosilicate glass","score":0.4711189270019531},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.462462842464447},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.45713862776756287},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4469274878501892},{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.4445056617259979},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.443159818649292},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.422095388174057},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4086558222770691},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.2306043803691864}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8034716844558716},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7190629243850708},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6943627595901489},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.642225444316864},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.6286436319351196},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6014820337295532},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5626189112663269},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.5569536089897156},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5424256324768066},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5347117185592651},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4973435699939728},{"id":"https://openalex.org/C206802598","wikidata":"https://www.wikidata.org/wiki/Q1422588","display_name":"Borosilicate glass","level":2,"score":0.4711189270019531},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.462462842464447},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.45713862776756287},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4469274878501892},{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.4445056617259979},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.443159818649292},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.422095388174057},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4086558222770691},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.2306043803691864},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":5,"locations":[{"id":"doi:10.3390/s20020337","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s20020337","pdf_url":"https://www.mdpi.com/1424-8220/20/2/337/pdf?version=1579413978","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:31936069","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/31936069","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:56695bdf9480490db099d233b2748a27","is_oa":true,"landing_page_url":"https://doaj.org/article/56695bdf9480490db099d233b2748a27","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 20, Iss 2, p 337 (2020)","raw_type":"article"},{"id":"pmh:oai:europepmc.org:6003190","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/7013386","pdf_url":null,"source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Text"},{"id":"pmh:oai:mdpi.com:/1424-8220/20/2/337/","is_oa":true,"landing_page_url":"http://dx.doi.org/10.3390/s20020337","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s20020337","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s20020337","pdf_url":"https://www.mdpi.com/1424-8220/20/2/337/pdf?version=1579413978","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.41999998688697815,"id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G1482583877","display_name":null,"funder_award_id":"No.61704165;No. 5172015004","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G1951432885","display_name":null,"funder_award_id":"No. 5172015004","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3518225138","display_name":null,"funder_award_id":"GJJSTD20180004","funder_id":"https://openalex.org/F4320321133","funder_display_name":"Chinese Academy of Sciences"},{"id":"https://openalex.org/G3956351515","display_name":null,"funder_award_id":"No.61704165","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5172107133","display_name":null,"funder_award_id":"61704165","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5551216368","display_name":null,"funder_award_id":"2018YFF01010504","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G6470832416","display_name":null,"funder_award_id":"2018YFF01012705","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G7705162038","display_name":null,"funder_award_id":"5172015004","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8928118360","display_name":null,"funder_award_id":"No.2018YFF01012705 and No.2018YFF01010504","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321133","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3000723942.pdf","grobid_xml":"https://content.openalex.org/works/W3000723942.grobid-xml"},"referenced_works_count":24,"referenced_works":["https://openalex.org/W1733315115","https://openalex.org/W1971009553","https://openalex.org/W1974184470","https://openalex.org/W1980783419","https://openalex.org/W1989491796","https://openalex.org/W2002257666","https://openalex.org/W2009290646","https://openalex.org/W2035445439","https://openalex.org/W2037808705","https://openalex.org/W2043236823","https://openalex.org/W2051259438","https://openalex.org/W2124455605","https://openalex.org/W2133415997","https://openalex.org/W2159233708","https://openalex.org/W2165385587","https://openalex.org/W2218397347","https://openalex.org/W2296651299","https://openalex.org/W2556988293","https://openalex.org/W2570000638","https://openalex.org/W2609135226","https://openalex.org/W2790754523","https://openalex.org/W2797588490","https://openalex.org/W2896773124","https://openalex.org/W2908312775"],"related_works":["https://openalex.org/W2102326768","https://openalex.org/W1993178593","https://openalex.org/W2544735653","https://openalex.org/W2516869960","https://openalex.org/W2886814325","https://openalex.org/W2026923884","https://openalex.org/W2044075211","https://openalex.org/W2532494584","https://openalex.org/W1987038649","https://openalex.org/W2803955113"],"abstract_inverted_index":{"A":[0,135],"miniature":[1,156],"piezoresistive":[2],"pressure":[3,106,157,170],"sensor":[4,107,158],"fabricated":[5,105,155],"by":[6,72,90],"temporary":[7,85],"bonding":[8,45,86],"technology":[9],"was":[10,18,30,55,70,88,108,125,147],"reported":[11],"in":[12,141,163],"this":[13],"paper.":[14],"The":[15,52,83,100],"sensing":[16,98,123],"membrane":[17,124],"formed":[19],"on":[20],"the":[21,66,79,97,104,119,142,152,154,168],"device":[22,81],"layer":[23,54,87],"of":[24,103,109,121,126,138,144],"an":[25],"SOI":[26],"(Silicon-On-Insulator)":[27],"wafer,":[28],"which":[29],"bonded":[31,56],"to":[32,57,77,95],"borosilicate":[33],"glass":[34],"(Borofloat":[35],"33,":[36],"BF33)":[37],"wafer":[38,60,69],"for":[39,167],"supporting":[40],"before":[41],"releasing":[42],"with":[43],"Cu-Cu":[44],"after":[46,61,93],"boron":[47],"doping":[48],"and":[49,63,118],"electrode":[50],"patterning.":[51],"handle":[53],"another":[58],"BF33":[59,68],"thinning":[62],"etching.":[64],"Finally,":[65],"substrate":[67],"thinned":[71],"chemical":[73],"mechanical":[74],"polishing":[75],"(CMP)":[76],"reduce":[78],"total":[80],"thickness.":[82],"copper":[84],"removed":[89],"acid":[91],"solution":[92],"dicing":[94],"release":[96],"membrane.":[99],"chip":[101],"area":[102],"1600":[110],"\u03bcm":[111,114,128,131],"\u00d7":[112,115,129,132],"650":[113],"104":[116],"\u03bcm,":[117],"size":[120],"a":[122,164],"100":[127,130],"2":[133],"\u03bcm.":[134],"higher":[136],"sensitivity":[137],"36":[139],"\u03bcV/(V\u2219kPa)":[140],"range":[143],"0-180":[145],"kPa":[146],"obtained.":[148],"By":[149],"further":[150],"reducing":[151],"width,":[153],"could":[159],"be":[160],"easily":[161],"mounted":[162],"medical":[165],"catheter":[166],"blood":[169],"measurement.":[171]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":12},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":7},{"year":2021,"cited_by_count":10},{"year":2020,"cited_by_count":2}],"updated_date":"2026-08-01T09:00:35.917206","created_date":"2020-01-23T00:00:00"}