{"id":"https://openalex.org/W2782767002","doi":"https://doi.org/10.3390/s18010231","title":"Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors","display_name":"Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors","publication_year":2018,"publication_date":"2018-01-15","ids":{"openalex":"https://openalex.org/W2782767002","doi":"https://doi.org/10.3390/s18010231","mag":"2782767002","pmid":"https://pubmed.ncbi.nlm.nih.gov/29342923"},"language":"en","primary_location":{"id":"doi:10.3390/s18010231","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18010231","pdf_url":"https://www.mdpi.com/1424-8220/18/1/231/pdf?version=1516246543","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/18/1/231/pdf?version=1516246543","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086506586","display_name":"Chenzhong Shao","orcid":"https://orcid.org/0000-0001-8913-9807"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Chenzhong Shao","raw_affiliation_strings":["Department of Robotics, Tohoku University, Miyagi 980-8579, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024253162","display_name":"Shuji Tanaka","orcid":"https://orcid.org/0000-0002-2663-3266"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shuji Tanaka","raw_affiliation_strings":["Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035083249","display_name":"Takahiro Nakayama","orcid":"https://orcid.org/0000-0001-8114-7618"},"institutions":[{"id":"https://openalex.org/I4210137853","display_name":"Toyota Motor Corporation (Japan)","ror":"https://ror.org/02zqm6r10","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210137853"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takahiro Nakayama","raw_affiliation_strings":["Partner Robot Div., Toyota Motor Corporation, Toyota, Aichi 470-0309, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Partner Robot Div., Toyota Motor Corporation, Toyota, Aichi 470-0309, Japan","institution_ids":["https://openalex.org/I4210137853"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049362175","display_name":"Yoshiyuki Hata","orcid":"https://orcid.org/0000-0001-8150-3678"},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yoshiyuki Hata","raw_affiliation_strings":["System & Electronics Engineering Dept. III, Toyota Central R&D Labs., Inc., Nagakute, Aichi 480-1192, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System & Electronics Engineering Dept. III, Toyota Central R&D Labs., Inc., Nagakute, Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037940534","display_name":"Masanori Muroyama","orcid":"https://orcid.org/0000-0002-6808-5106"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Muroyama","raw_affiliation_strings":["Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan"],"raw_orcid":"https://orcid.org/0000-0002-6808-5106","affiliations":[{"raw_affiliation_string":"Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5086506586"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2673},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2673},"fwci":0.2768,"has_fulltext":true,"cited_by_count":5,"citation_normalized_percentile":{"value":0.49127883,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"18","issue":"1","first_page":"231","last_page":"231"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/serial-communication","display_name":"Serial communication","score":0.6444460153579712},{"id":"https://openalex.org/keywords/asynchronous-communication","display_name":"Asynchronous communication","score":0.5472722053527832},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.5188380479812622},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5075308084487915},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5025968551635742},{"id":"https://openalex.org/keywords/wireless-sensor-network","display_name":"Wireless sensor network","score":0.47887247800827026},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.4738726317882538},{"id":"https://openalex.org/keywords/control-bus","display_name":"Control bus","score":0.47079789638519287},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4487461447715759},{"id":"https://openalex.org/keywords/system-bus","display_name":"System bus","score":0.44412705302238464},{"id":"https://openalex.org/keywords/network-packet","display_name":"Network packet","score":0.4426489770412445},{"id":"https://openalex.org/keywords/pci-express","display_name":"PCI Express","score":0.4258885383605957},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3827410340309143},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37743425369262695},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32554590702056885},{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.19918808341026306},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.1702437698841095},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10786044597625732}],"concepts":[{"id":"https://openalex.org/C51707140","wikidata":"https://www.wikidata.org/wiki/Q518280","display_name":"Serial communication","level":2,"score":0.6444460153579712},{"id":"https://openalex.org/C151319957","wikidata":"https://www.wikidata.org/wiki/Q752739","display_name":"Asynchronous communication","level":2,"score":0.5472722053527832},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5188380479812622},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5075308084487915},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5025968551635742},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.47887247800827026},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4738726317882538},{"id":"https://openalex.org/C203315745","wikidata":"https://www.wikidata.org/wiki/Q2235486","display_name":"Control bus","level":3,"score":0.47079789638519287},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4487461447715759},{"id":"https://openalex.org/C136321198","wikidata":"https://www.wikidata.org/wiki/Q2377054","display_name":"System bus","level":2,"score":0.44412705302238464},{"id":"https://openalex.org/C158379750","wikidata":"https://www.wikidata.org/wiki/Q214111","display_name":"Network packet","level":2,"score":0.4426489770412445},{"id":"https://openalex.org/C64270927","wikidata":"https://www.wikidata.org/wiki/Q206924","display_name":"PCI Express","level":3,"score":0.4258885383605957},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3827410340309143},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37743425369262695},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32554590702056885},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.19918808341026306},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.1702437698841095},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10786044597625732},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":5,"locations":[{"id":"doi:10.3390/s18010231","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18010231","pdf_url":"https://www.mdpi.com/1424-8220/18/1/231/pdf?version=1516246543","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:29342923","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/29342923","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:61e01923552a4e1c8371ae61fb336881","is_oa":true,"landing_page_url":"https://doaj.org/article/61e01923552a4e1c8371ae61fb336881","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 18, Iss 1, p 231 (2018)","raw_type":"article"},{"id":"pmh:oai:mdpi.com:/1424-8220/18/1/231/","is_oa":true,"landing_page_url":"https://dx.doi.org/10.3390/s18010231","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors; Volume 18; Issue 1; Pages: 231","raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:5795540","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/5795540","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s18010231","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18010231","pdf_url":"https://www.mdpi.com/1424-8220/18/1/231/pdf?version=1516246543","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4300000071525574,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322622","display_name":"Toyota Motor Corporation","ror":"https://ror.org/02zqm6r10"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2782767002.pdf","grobid_xml":"https://content.openalex.org/works/W2782767002.grobid-xml"},"referenced_works_count":24,"referenced_works":["https://openalex.org/W1592387353","https://openalex.org/W1964501408","https://openalex.org/W1970495039","https://openalex.org/W2015678958","https://openalex.org/W2023614418","https://openalex.org/W2037597894","https://openalex.org/W2044097163","https://openalex.org/W2048058874","https://openalex.org/W2070401730","https://openalex.org/W2108777122","https://openalex.org/W2114628570","https://openalex.org/W2127045241","https://openalex.org/W2135024419","https://openalex.org/W2157214632","https://openalex.org/W2171130677","https://openalex.org/W2249709701","https://openalex.org/W2516314007","https://openalex.org/W2594087187","https://openalex.org/W2745049676","https://openalex.org/W2751667698","https://openalex.org/W2766106882","https://openalex.org/W3089108906","https://openalex.org/W4254020619","https://openalex.org/W6835991752"],"related_works":["https://openalex.org/W2391684099","https://openalex.org/W2349472495","https://openalex.org/W2379360430","https://openalex.org/W2369444745","https://openalex.org/W2060991147","https://openalex.org/W2162741033","https://openalex.org/W2118477237","https://openalex.org/W2389687411","https://openalex.org/W2392450020","https://openalex.org/W1897209152"],"abstract_inverted_index":{"For":[0,39],"installing":[1],"many":[2],"sensors":[3],"in":[4,83,107],"a":[5,9,28,45,93,108],"limited":[6,10],"space":[7],"with":[8,96,112,130],"computing":[11],"resource,":[12],"the":[13,16,20,113,121,131,147],"digitization":[14],"of":[15,22,31,136,151],"sensor":[17,98],"output":[18],"at":[19],"site":[21],"sensation":[23],"has":[24],"advantages":[25],"such":[26],"as":[27,55],"small":[29],"amount":[30],"wiring,":[32],"low":[33],"signal":[34],"interference":[35],"and":[36,71,81,146],"high":[37],"scalability.":[38],"this":[40,66,89],"purpose,":[41],"we":[42,91],"have":[43],"developed":[44,92],"dedicated":[46],"Complementary":[47],"Metal-Oxide-Semiconductor":[48],"(CMOS)":[49],"Large-Scale":[50],"Integration":[51],"(LSI)":[52],"(referred":[53],"to":[54,77],"\"sensor":[56],"platform":[57,99],"LSI\")":[58],"for":[59,156],"bus-networked":[60],"Micro-Electro-Mechanical-Systems":[61],"(MEMS)-LSI":[62],"integrated":[63],"sensors.":[64],"In":[65,88],"LSI,":[67],"collision":[68,80],"avoidance,":[69],"adaptation":[70,132],"event-driven":[72],"functions":[73],"are":[74],"simply":[75],"implemented":[76],"relieve":[78],"data":[79,137],"congestion":[82],"asynchronous":[84],"serial":[85,122],"bus":[86,110,114],"communication.":[87],"study,":[90],"network":[94],"system":[95],"48":[97,126],"LSIs":[100,127],"based":[101],"on":[102],"Printed":[103],"Circuit":[104],"Board":[105],"(PCB)":[106],"backbone":[109],"topology":[111],"length":[115],"being":[116],"2.4":[117],"m.":[118],"We":[119],"evaluated":[120],"communication":[123],"performance":[124],"when":[125],"operated":[128],"simultaneously":[129],"function.":[133],"The":[134],"number":[135],"packets":[138],"received":[139],"from":[140],"each":[141,157],"LSI":[142],"was":[143,159],"almost":[144],"identical,":[145],"average":[148],"sampling":[149],"frequency":[150],"384":[152],"capacitance":[153],"channels":[154],"(eight":[155],"LSI)":[158],"73.66":[160],"Hz.":[161]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-30T17:31:21.811387","created_date":"2025-10-10T00:00:00"}