{"id":"https://openalex.org/W2539544102","doi":"https://doi.org/10.3390/s16111795","title":"Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry","display_name":"Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry","publication_year":2016,"publication_date":"2016-10-27","ids":{"openalex":"https://openalex.org/W2539544102","doi":"https://doi.org/10.3390/s16111795","mag":"2539544102","pmid":"https://pubmed.ncbi.nlm.nih.gov/27801809"},"language":"en","primary_location":{"id":"doi:10.3390/s16111795","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s16111795","pdf_url":"https://www.mdpi.com/1424-8220/16/11/1795/pdf?version=1477645614","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/16/11/1795/pdf?version=1477645614","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063016978","display_name":"M. Matteucci","orcid":"https://orcid.org/0000-0002-3660-5621"},"institutions":[{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":true,"raw_author_name":"Marco Matteucci","raw_affiliation_strings":["Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark"],"raw_orcid":"https://orcid.org/0000-0002-3660-5621","affiliations":[{"raw_affiliation_string":"Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark","institution_ids":["https://openalex.org/I96673099"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029679398","display_name":"Arto Heiskanen","orcid":"https://orcid.org/0000-0002-7124-8420"},"institutions":[{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"Arto Heiskanen","raw_affiliation_strings":["Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark","institution_ids":["https://openalex.org/I96673099"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076237877","display_name":"Kinga Z\u00f3r","orcid":"https://orcid.org/0000-0002-2905-4155"},"institutions":[{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"Kinga Z\u00f3r","raw_affiliation_strings":["Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark","institution_ids":["https://openalex.org/I96673099"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012302822","display_name":"Jenny Emn\u00e9us","orcid":"https://orcid.org/0000-0002-8061-201X"},"institutions":[{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"Jenny Emn\u00e9us","raw_affiliation_strings":["Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark","institution_ids":["https://openalex.org/I96673099"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031142541","display_name":"Rafael Taboryski","orcid":"https://orcid.org/0000-0003-2491-1098"},"institutions":[{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"Rafael Taboryski","raw_affiliation_strings":["Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark"],"raw_orcid":"https://orcid.org/0000-0003-2491-1098","affiliations":[{"raw_affiliation_string":"Department of Micro- and Nanotechnology, Technical University of Denmark, Kongens Lyngby 2800, Denmark","institution_ids":["https://openalex.org/I96673099"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5063016978"],"corresponding_institution_ids":["https://openalex.org/I96673099"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":1.5745,"has_fulltext":true,"cited_by_count":19,"citation_normalized_percentile":{"value":0.83031227,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"16","issue":"11","first_page":"1795","last_page":"1795"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.802238941192627},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.7199548482894897},{"id":"https://openalex.org/keywords/welding","display_name":"Welding","score":0.6673339605331421},{"id":"https://openalex.org/keywords/ultrasonic-welding","display_name":"Ultrasonic welding","score":0.6657707691192627},{"id":"https://openalex.org/keywords/electrochemistry","display_name":"Electrochemistry","score":0.5781006813049316},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.5026514530181885},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.4744078814983368},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.47109565138816833},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4252094030380249},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.41798797249794006},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.39809972047805786},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23405462503433228},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.09627029299736023}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.802238941192627},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.7199548482894897},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.6673339605331421},{"id":"https://openalex.org/C2778922904","wikidata":"https://www.wikidata.org/wiki/Q580160","display_name":"Ultrasonic welding","level":3,"score":0.6657707691192627},{"id":"https://openalex.org/C52859227","wikidata":"https://www.wikidata.org/wiki/Q7877","display_name":"Electrochemistry","level":3,"score":0.5781006813049316},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.5026514530181885},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.4744078814983368},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.47109565138816833},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4252094030380249},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.41798797249794006},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.39809972047805786},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23405462503433228},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.09627029299736023},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":6,"locations":[{"id":"doi:10.3390/s16111795","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s16111795","pdf_url":"https://www.mdpi.com/1424-8220/16/11/1795/pdf?version=1477645614","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:27801809","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/27801809","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:356182586a424905a30f355e74049ae7","is_oa":true,"landing_page_url":"https://doaj.org/article/356182586a424905a30f355e74049ae7","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 16, Iss 11, p 1795 (2016)","raw_type":"article"},{"id":"pmh:oai:mdpi.com:/1424-8220/16/11/1795/","is_oa":true,"landing_page_url":"https://dx.doi.org/10.3390/s16111795","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors; Volume 16; Issue 11; Pages: 1795","raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:5134454","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/5134454","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"},{"id":"pmh:oai:pure.atira.dk:publications/8aa08c74-c17e-4d96-b3a1-3f16accd6dae","is_oa":true,"landing_page_url":"https://orbit.dtu.dk/en/publications/8aa08c74-c17e-4d96-b3a1-3f16accd6dae","pdf_url":null,"source":{"id":"https://openalex.org/S4306400705","display_name":"Technical University of Denmark, DTU Orbit (Technical University of Denmark, DTU)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I96673099","host_organization_name":"Technical University of Denmark","host_organization_lineage":["https://openalex.org/I96673099"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Matteucci , M , Heiskanen , A , Zor , K , Emn\u00e9us , J & Taboryski , R J 2016 , ' Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry ' , Sensors , vol. 16 , no. 11 , 1795 . https://doi.org/10.3390/s16111795","raw_type":"article"}],"best_oa_location":{"id":"doi:10.3390/s16111795","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s16111795","pdf_url":"https://www.mdpi.com/1424-8220/16/11/1795/pdf?version=1477645614","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.6000000238418579,"id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G4152390927","display_name":null,"funder_award_id":"10-092322","funder_id":"https://openalex.org/F4320309756","funder_display_name":"Strategiske Forskningsr\u00e5d"},{"id":"https://openalex.org/G7803744340","display_name":null,"funder_award_id":"10-092322/DSF","funder_id":"https://openalex.org/F4320309756","funder_display_name":"Strategiske Forskningsr\u00e5d"}],"funders":[{"id":"https://openalex.org/F4320309756","display_name":"Strategiske Forskningsr\u00e5d","ror":"https://ror.org/03ge1nb22"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2539544102.pdf","grobid_xml":"https://content.openalex.org/works/W2539544102.grobid-xml"},"referenced_works_count":35,"referenced_works":["https://openalex.org/W1893516527","https://openalex.org/W1965120227","https://openalex.org/W1965903996","https://openalex.org/W1969457959","https://openalex.org/W1970575807","https://openalex.org/W1987458028","https://openalex.org/W1996117952","https://openalex.org/W2004496149","https://openalex.org/W2012385197","https://openalex.org/W2012761867","https://openalex.org/W2014360162","https://openalex.org/W2027834662","https://openalex.org/W2029213372","https://openalex.org/W2029561718","https://openalex.org/W2031073207","https://openalex.org/W2032460446","https://openalex.org/W2033015627","https://openalex.org/W2046813308","https://openalex.org/W2053490619","https://openalex.org/W2056854886","https://openalex.org/W2065132281","https://openalex.org/W2065187211","https://openalex.org/W2068825750","https://openalex.org/W2069200961","https://openalex.org/W2069764142","https://openalex.org/W2084597395","https://openalex.org/W2093181396","https://openalex.org/W2093478537","https://openalex.org/W2097773259","https://openalex.org/W2099779584","https://openalex.org/W2104377142","https://openalex.org/W2106195203","https://openalex.org/W2108436253","https://openalex.org/W2336968708","https://openalex.org/W2516598086"],"related_works":["https://openalex.org/W2044503519","https://openalex.org/W4400200109","https://openalex.org/W2314917133","https://openalex.org/W2046610411","https://openalex.org/W3011199464","https://openalex.org/W2743996787","https://openalex.org/W924290156","https://openalex.org/W4366423011","https://openalex.org/W2317770466","https://openalex.org/W3020193333"],"abstract_inverted_index":{"We":[0],"compare":[1],"ultrasonic":[2],"welding":[3],"(UW)":[4],"and":[5,56,67,80,93,107],"thermal":[6],"bonding":[7,78],"(TB)":[8],"for":[9,17,82,91],"the":[10,38,76],"integration":[11,95],"of":[12,48,51,58,96],"embedded":[13],"thin-film":[14],"gold":[15],"electrodes":[16],"electrochemical":[18,34,84],"applications":[19],"in":[20,104],"injection":[21],"molded":[22],"(IM)":[23],"microfluidic":[24],"chips.":[25],"The":[26,86],"UW":[27],"bonded":[28],"chips":[29],"showed":[30],"a":[31],"significantly":[32],"superior":[33],"performance":[35],"compared":[36],"to":[37,74,100],"ones":[39],"obtained":[40],"using":[41],"TB.":[42],"Parameters":[43],"such":[44],"as":[45,63,65],"metal":[46],"thickness":[47],"electrodes,":[49],"depth":[50],"electrode":[52],"embedding,":[53],"delivered":[54],"power,":[55],"height":[57],"energy":[59],"directors":[60],"(for":[61,69],"UW),":[62],"well":[64],"pressure":[66],"temperature":[68],"TB),":[70],"were":[71],"systematically":[72],"studied":[73],"evaluate":[75],"two":[77],"methods":[79],"requirements":[81],"optimal":[83],"performance.":[85],"presented":[87],"technology":[88],"is":[89],"intended":[90],"easy":[92],"effective":[94],"polymeric":[97],"Lab-on-Chip":[98],"systems":[99],"encourage":[101],"their":[102],"use":[103],"research,":[105],"commercialization":[106],"education.":[108]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}