{"id":"https://openalex.org/W1973033478","doi":"https://doi.org/10.3390/s140101680","title":"Manufacture of Radio Frequency Micromachined Switches with Annealing","display_name":"Manufacture of Radio Frequency Micromachined Switches with Annealing","publication_year":2014,"publication_date":"2014-01-17","ids":{"openalex":"https://openalex.org/W1973033478","doi":"https://doi.org/10.3390/s140101680","mag":"1973033478","pmid":"https://pubmed.ncbi.nlm.nih.gov/24445415"},"language":"en","primary_location":{"id":"doi:10.3390/s140101680","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s140101680","pdf_url":"https://www.mdpi.com/1424-8220/14/1/1680/pdf?version=1403343502","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/14/1/1680/pdf?version=1403343502","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109384957","display_name":"Cheng-Yang Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I162838928","display_name":"National Chung Hsing University","ror":"https://ror.org/05vn3ca78","country_code":"TW","type":"education","lineage":["https://openalex.org/I162838928"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Yang Lin","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan. g099061077@mail.nchu.edu.tw"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","institution_ids":["https://openalex.org/I162838928"]},{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan. g099061077@mail.nchu.edu.tw","institution_ids":["https://openalex.org/I162838928"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005155364","display_name":"Ching\u2010Liang Dai","orcid":"https://orcid.org/0000-0001-9114-7363"},"institutions":[{"id":"https://openalex.org/I162838928","display_name":"National Chung Hsing University","ror":"https://ror.org/05vn3ca78","country_code":"TW","type":"education","lineage":["https://openalex.org/I162838928"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Ching-Liang Dai","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan. cldai@dragon.nchu.edu.tw"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","institution_ids":["https://openalex.org/I162838928"]},{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan. cldai@dragon.nchu.edu.tw","institution_ids":["https://openalex.org/I162838928"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5005155364"],"corresponding_institution_ids":["https://openalex.org/I162838928"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":0.0,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.04574676,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"14","issue":"1","first_page":"1680","last_page":"1690"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.7206753492355347},{"id":"https://openalex.org/keywords/rf-switch","display_name":"RF switch","score":0.636578381061554},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6334159970283508},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.6288395524024963},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5900151133537292},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5585604906082153},{"id":"https://openalex.org/keywords/coplanar-waveguide","display_name":"Coplanar waveguide","score":0.5137835144996643},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.5008516311645508},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.49424031376838684},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4479047954082489},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.43546539545059204},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.431254118680954},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.4309201240539551},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4302997887134552},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4217141568660736},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.39028680324554443},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37305688858032227},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3077187240123749},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.17493849992752075},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13320431113243103},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11090290546417236}],"concepts":[{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.7206753492355347},{"id":"https://openalex.org/C2781283035","wikidata":"https://www.wikidata.org/wiki/Q571939","display_name":"RF switch","level":3,"score":0.636578381061554},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6334159970283508},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.6288395524024963},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5900151133537292},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5585604906082153},{"id":"https://openalex.org/C3736036","wikidata":"https://www.wikidata.org/wiki/Q15525941","display_name":"Coplanar waveguide","level":3,"score":0.5137835144996643},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.5008516311645508},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.49424031376838684},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4479047954082489},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.43546539545059204},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.431254118680954},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.4309201240539551},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4302997887134552},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4217141568660736},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.39028680324554443},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37305688858032227},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3077187240123749},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.17493849992752075},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13320431113243103},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11090290546417236},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[{"descriptor_ui":"D011846","descriptor_name":"Radio Waves","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D011846","descriptor_name":"Radio Waves","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D011846","descriptor_name":"Radio Waves","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D012666","descriptor_name":"Semiconductors","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012666","descriptor_name":"Semiconductors","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012666","descriptor_name":"Semiconductors","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012984","descriptor_name":"Software","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D012984","descriptor_name":"Software","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D012984","descriptor_name":"Software","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D020342","descriptor_name":"Finite Element Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D020342","descriptor_name":"Finite Element Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D020342","descriptor_name":"Finite Element Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false}],"locations_count":7,"locations":[{"id":"doi:10.3390/s140101680","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s140101680","pdf_url":"https://www.mdpi.com/1424-8220/14/1/1680/pdf?version=1403343502","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:24445415","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/24445415","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:df87d976282f43fc9f43f7568433a8ff","is_oa":true,"landing_page_url":"https://doaj.org/article/df87d976282f43fc9f43f7568433a8ff","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 14, Iss 1, Pp 1680-1690 (2014)","raw_type":"article"},{"id":"pmh:oai:europepmc.org:2910388","is_oa":true,"landing_page_url":"http://europepmc.org/articles/PMC3926632","pdf_url":null,"source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"},{"id":"pmh:oai:ir.lib.nchu.edu.tw:11455/86255","is_oa":false,"landing_page_url":"http://hdl.handle.net/11455/86255","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Journal Article"},{"id":"pmh:oai:mdpi.com:/1424-8220/14/1/1680/","is_oa":true,"landing_page_url":"https://dx.doi.org/10.3390/s140101680","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors; Volume 14; Issue 1; Pages: 1680-1690","raw_type":"Text"},{"id":"pmh:oai:pubmedcentral.nih.gov:3926632","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3926632","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s140101680","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s140101680","pdf_url":"https://www.mdpi.com/1424-8220/14/1/1680/pdf?version=1403343502","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.4300000071525574,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1973033478.pdf","grobid_xml":"https://content.openalex.org/works/W1973033478.grobid-xml"},"referenced_works_count":27,"referenced_works":["https://openalex.org/W1825047602","https://openalex.org/W1937060092","https://openalex.org/W1964592297","https://openalex.org/W1982495274","https://openalex.org/W1983282195","https://openalex.org/W2008039216","https://openalex.org/W2020457891","https://openalex.org/W2025179016","https://openalex.org/W2028873622","https://openalex.org/W2028897143","https://openalex.org/W2031739436","https://openalex.org/W2057710469","https://openalex.org/W2070496215","https://openalex.org/W2071822903","https://openalex.org/W2086507063","https://openalex.org/W2094485065","https://openalex.org/W2095334449","https://openalex.org/W2106332253","https://openalex.org/W2117364386","https://openalex.org/W2117878461","https://openalex.org/W2118751963","https://openalex.org/W2137562005","https://openalex.org/W2149205095","https://openalex.org/W2166721839","https://openalex.org/W2171505706","https://openalex.org/W2621919695","https://openalex.org/W6675763060"],"related_works":["https://openalex.org/W3100681166","https://openalex.org/W2365912011","https://openalex.org/W2782250132","https://openalex.org/W2359032066","https://openalex.org/W2139983917","https://openalex.org/W2017435270","https://openalex.org/W1554539010","https://openalex.org/W2128281921","https://openalex.org/W2089888636","https://openalex.org/W2146329217"],"abstract_inverted_index":{"The":[0,15,32,45,56,103,148],"fabrication":[1],"and":[2,29,54,69,96,116,139],"characterization":[3],"of":[4,17,22,75,85,118,133,142,151],"a":[5,23,48,59],"radio":[6],"frequency":[7],"(RF)":[8],"micromachined":[9],"switch":[10,20,34,46,128,153],"with":[11],"annealing":[12,89],"were":[13],"presented.":[14],"structure":[16],"the":[18,38,52,64,72,76,82,86,94,97,114,119,126,152],"RF":[19,33,120,127],"consists":[21],"membrane,":[24],"coplanar":[25],"waveguide":[26],"(CPW)":[27],"lines,":[28],"eight":[30],"springs.":[31,55],"is":[35,91,110,154],"manufactured":[36],"using":[37],"complementary":[39],"metal":[40],"oxide":[41],"semiconductor":[42],"(CMOS)":[43],"process.":[44],"requires":[47],"post-process":[49,57],"to":[50,62,70,80,93,112],"release":[51],"membrane":[53,98],"uses":[58],"wet":[60],"etching":[61],"remove":[63],"sacrificial":[65],"silicon":[66],"dioxide":[67],"layer,":[68],"obtain":[71],"suspended":[73],"structures":[74],"switch.":[77,121],"In":[78],"order":[79],"improve":[81],"residual":[83],"stress":[84,115],"switch,":[87,95],"an":[88,100,130,140],"process":[90],"applied":[92],"obtains":[99],"excellent":[101],"flatness.":[102],"finite":[104],"element":[105],"method":[106],"(FEM)":[107],"software":[108],"CoventorWare":[109],"utilized":[111],"simulate":[113],"displacement":[117],"Experimental":[122],"results":[123],"show":[124],"that":[125],"has":[129],"insertion":[131],"loss":[132],"0.9":[134],"dB":[135,144],"at":[136,145],"35":[137],"GHz":[138],"isolation":[141],"21":[143],"39":[146],"GHz.":[147],"actuation":[149],"voltage":[150],"14":[155],"V.":[156]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-05-21T09:19:25.381259","created_date":"2025-10-10T00:00:00"}