{"id":"https://openalex.org/W2075233132","doi":"https://doi.org/10.3390/s121217094","title":"CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties","display_name":"CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties","publication_year":2012,"publication_date":"2012-12-12","ids":{"openalex":"https://openalex.org/W2075233132","doi":"https://doi.org/10.3390/s121217094","mag":"2075233132","pmid":"https://pubmed.ncbi.nlm.nih.gov/23235449"},"language":"en","primary_location":{"id":"doi:10.3390/s121217094","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s121217094","pdf_url":"https://www.mdpi.com/1424-8220/12/12/17094/pdf?version=1403320809","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/12/12/17094/pdf?version=1403320809","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003583178","display_name":"Wan-Chun Chuang","orcid":"https://orcid.org/0000-0001-9570-8471"},"institutions":[{"id":"https://openalex.org/I142974352","display_name":"National Sun Yat-sen University","ror":"https://ror.org/00mjawt10","country_code":"TW","type":"education","lineage":["https://openalex.org/I142974352"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wan-Chun Chuang","raw_affiliation_strings":["Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan","institution_ids":["https://openalex.org/I142974352"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110407506","display_name":"Yuh-Chung Hu","orcid":null},"institutions":[{"id":"https://openalex.org/I75430998","display_name":"National Ilan University","ror":"https://ror.org/01npf0s58","country_code":"TW","type":"education","lineage":["https://openalex.org/I75430998"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yuh-Chung Hu","raw_affiliation_strings":["Department of Mechanical and Electro-Mechanical Engineering, Center of Green Technology, National ILan University, ILan 260, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electro-Mechanical Engineering, Center of Green Technology, National ILan University, ILan 260, Taiwan","institution_ids":["https://openalex.org/I75430998"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111777435","display_name":"Pei\u2010Zen Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pei-Zen Chang","raw_affiliation_strings":["Institute of Applied Mechanics, National Taiwan University, Taipei 10617, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Applied Mechanics, National Taiwan University, Taipei 10617, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":0.9993,"has_fulltext":true,"cited_by_count":7,"citation_normalized_percentile":{"value":0.79236215,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"12","issue":"12","first_page":"17094","last_page":"17111"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6394575238227844},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5918393135070801},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.5357733368873596},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.5353776216506958},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5287242531776428},{"id":"https://openalex.org/keywords/modulus","display_name":"Modulus","score":0.41329607367515564},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40622901916503906},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.39026954770088196},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.35564857721328735},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.338242769241333},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3303627371788025},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2742617726325989},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.16606247425079346},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1337074637413025}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6394575238227844},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5918393135070801},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.5357733368873596},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.5353776216506958},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5287242531776428},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.41329607367515564},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40622901916503906},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.39026954770088196},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35564857721328735},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.338242769241333},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3303627371788025},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2742617726325989},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.16606247425079346},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1337074637413025},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[{"descriptor_ui":"D000465","descriptor_name":"Algorithms","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D000465","descriptor_name":"Algorithms","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D000465","descriptor_name":"Algorithms","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D008422","descriptor_name":"Materials Testing","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008422","descriptor_name":"Materials Testing","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008422","descriptor_name":"Materials Testing","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D013314","descriptor_name":"Stress, Mechanical","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D013314","descriptor_name":"Stress, Mechanical","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D013314","descriptor_name":"Stress, Mechanical","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055119","descriptor_name":"Elastic Modulus","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055119","descriptor_name":"Elastic Modulus","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055119","descriptor_name":"Elastic Modulus","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055595","descriptor_name":"Mechanical Phenomena","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055595","descriptor_name":"Mechanical Phenomena","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055595","descriptor_name":"Mechanical Phenomena","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055617","descriptor_name":"Micro-Electrical-Mechanical Systems","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055617","descriptor_name":"Micro-Electrical-Mechanical Systems","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055617","descriptor_name":"Micro-Electrical-Mechanical Systems","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true}],"locations_count":5,"locations":[{"id":"doi:10.3390/s121217094","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s121217094","pdf_url":"https://www.mdpi.com/1424-8220/12/12/17094/pdf?version=1403320809","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:23235449","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/23235449","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.296.2307","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.296.2307","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.mdpi.com/1424-8220/12/12/17094/pdf/","raw_type":"text"},{"id":"pmh:oai:doaj.org/article:4240ef7e48344825a4b29331f7708a37","is_oa":true,"landing_page_url":"https://doaj.org/article/4240ef7e48344825a4b29331f7708a37","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 12, Iss 12, Pp 17094-17111 (2012)","raw_type":"article"},{"id":"pmh:oai:europepmc.org:2574672","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3571828","pdf_url":null,"source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/s121217094","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s121217094","pdf_url":"https://www.mdpi.com/1424-8220/12/12/17094/pdf?version=1403320809","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322589","display_name":"Taiwan Semiconductor Manufacturing Company","ror":"https://ror.org/02wx79d08"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2075233132.pdf","grobid_xml":"https://content.openalex.org/works/W2075233132.grobid-xml"},"referenced_works_count":40,"referenced_works":["https://openalex.org/W1510290630","https://openalex.org/W1545053220","https://openalex.org/W1963773365","https://openalex.org/W1966140773","https://openalex.org/W1974838749","https://openalex.org/W1984884977","https://openalex.org/W1997441138","https://openalex.org/W2001458054","https://openalex.org/W2007547222","https://openalex.org/W2007954272","https://openalex.org/W2008039216","https://openalex.org/W2009400107","https://openalex.org/W2018924220","https://openalex.org/W2023065583","https://openalex.org/W2030816898","https://openalex.org/W2034491264","https://openalex.org/W2040332050","https://openalex.org/W2042795939","https://openalex.org/W2047864849","https://openalex.org/W2071822903","https://openalex.org/W2074731230","https://openalex.org/W2075567099","https://openalex.org/W2076477233","https://openalex.org/W2086933933","https://openalex.org/W2090587147","https://openalex.org/W2095562511","https://openalex.org/W2102927848","https://openalex.org/W2104980941","https://openalex.org/W2111135224","https://openalex.org/W2115302362","https://openalex.org/W2116357047","https://openalex.org/W2126858546","https://openalex.org/W2135023527","https://openalex.org/W2137086712","https://openalex.org/W2140746522","https://openalex.org/W2140804926","https://openalex.org/W2143364941","https://openalex.org/W2155045812","https://openalex.org/W2164531572","https://openalex.org/W6646631832"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W1530711136","https://openalex.org/W3014521742","https://openalex.org/W1998662473","https://openalex.org/W1763916368","https://openalex.org/W2075391483","https://openalex.org/W2391127530","https://openalex.org/W2045074154","https://openalex.org/W2751944553"],"abstract_inverted_index":{"This":[0,151],"paper":[1,137],"develops":[2],"the":[3,28,34,42,63,71,77,82,89,96,108,116,130,140,146,162,171,178],"technologies":[4],"of":[5,8,33,45,76,88,119,142,149],"mechanical":[6,18,152],"characterization":[7],"CMOS-MEMS":[9],"devices,":[10],"and":[11,24,52,62,85,107,168],"presents":[12],"a":[13,100],"robust":[14],"algorithm":[15,132,144],"for":[16,41],"extracting":[17,154],"properties,":[19],"such":[20],"as":[21],"Young's":[22,83],"modulus,":[23],"mean":[25,86],"stress,":[26],"through":[27],"external":[29],"electrical":[30],"circuit":[31],"behavior":[32],"micro":[35],"test-key.":[36],"An":[37],"approximate":[38],"analytical":[39],"solution":[40,75],"pull-in":[43,78,117],"voltage":[44,79,118],"bridge-type":[46],"test-key":[47,97],"subjected":[48],"to":[49,80,112,158,161],"electrostatic":[50],"load":[51],"initial":[53],"stress":[54,87],"is":[55,156,181],"derived":[56],"based":[57],"on":[58,115],"Euler's":[59],"beam":[60],"model":[61],"minimum":[64],"energy":[65],"method.":[66],"Then":[67],"one":[68],"can":[69],"use":[70],"aforesaid":[72],"closed":[73],"form":[74],"extract":[81],"modulus":[84],"test":[90,93,179],"structures.":[91],"The":[92,124],"cases":[94],"include":[95],"fabricated":[98],"by":[99,129],"TSMC":[101],"0.18":[102],"\u03bcm":[103],"standard":[104],"CMOS":[105],"process,":[106],"experimental":[109],"results":[110],"refer":[111],"Osterberg's":[113],"work":[114],"single":[120],"crystal":[121],"silicone":[122],"microbridges.":[123],"extracted":[125],"material":[126],"properties":[127,153],"calculated":[128],"present":[131],"are":[133],"valid.":[134],"Besides,":[135],"this":[136,143],"also":[138],"analyzes":[139],"robustness":[141],"regarding":[145],"dimension":[147],"effects":[148],"test-keys.":[150],"method":[155],"expected":[157],"be":[159],"applicable":[160],"wafer-level":[163,172],"testing":[164,173],"in":[165,174],"micro-device":[166],"manufacture":[167],"compatible":[169],"with":[170],"IC":[175],"industry":[176],"since":[177],"process":[180],"non-destructive.":[182]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}