{"id":"https://openalex.org/W2124429464","doi":"https://doi.org/10.3390/s100403989","title":"Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices","display_name":"Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices","publication_year":2010,"publication_date":"2010-04-20","ids":{"openalex":"https://openalex.org/W2124429464","doi":"https://doi.org/10.3390/s100403989","mag":"2124429464","pmid":"https://pubmed.ncbi.nlm.nih.gov/22319337"},"language":"en","primary_location":{"id":"doi:10.3390/s100403989","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s100403989","pdf_url":"https://www.mdpi.com/1424-8220/10/4/3989/pdf?version=1403312394","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/10/4/3989/pdf?version=1403312394","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036523036","display_name":"J.J.M. Zaal","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":true,"raw_author_name":"Jeroen J. M. Zaal","raw_affiliation_strings":["Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073722171","display_name":"W.D. van Driel","orcid":"https://orcid.org/0000-0001-8882-2508"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Willem D. Van Driel","raw_affiliation_strings":["Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111351665","display_name":"G. Q. Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"G.Q. Zhang","raw_affiliation_strings":["Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5036523036"],"corresponding_institution_ids":["https://openalex.org/I98358874"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":1.177,"has_fulltext":true,"cited_by_count":16,"citation_normalized_percentile":{"value":0.81895189,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"10","issue":"4","first_page":"3989","last_page":"4001"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.9268445372581482},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8190838098526001},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6767538189888},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.44833168387413025},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.41027578711509705},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3948160409927368},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.37721800804138184},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3202871084213257},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3106684684753418}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.9268445372581482},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8190838098526001},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6767538189888},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.44833168387413025},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.41027578711509705},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3948160409927368},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.37721800804138184},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3202871084213257},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3106684684753418}],"mesh":[],"locations_count":5,"locations":[{"id":"doi:10.3390/s100403989","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s100403989","pdf_url":"https://www.mdpi.com/1424-8220/10/4/3989/pdf?version=1403312394","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},{"id":"pmid:22319337","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/22319337","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors (Basel, Switzerland)","raw_type":null},{"id":"pmh:oai:doaj.org/article:e8a9fdf412264fbbbc76cb78ce11aaf2","is_oa":true,"landing_page_url":"https://doaj.org/article/e8a9fdf412264fbbbc76cb78ce11aaf2","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors, Vol 10, Iss 4, Pp 3989-4001 (2010)","raw_type":"article"},{"id":"pmh:oai:pubmedcentral.nih.gov:3274256","is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/3274256","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Sensors (Basel)","raw_type":"Text"},{"id":"pmh:oai:tudelft.nl:uuid:166088ff-569f-4ed1-9e21-7dcaf8e6ad4f","is_oa":true,"landing_page_url":"http://resolver.tudelft.nl/uuid:166088ff-569f-4ed1-9e21-7dcaf8e6ad4f","pdf_url":null,"source":{"id":"https://openalex.org/S4306400906","display_name":"Research Repository (Delft University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I98358874","host_organization_name":"Delft University of Technology","host_organization_lineage":["https://openalex.org/I98358874"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"journal article"}],"best_oa_location":{"id":"doi:10.3390/s100403989","is_oa":true,"landing_page_url":"https://doi.org/10.3390/s100403989","pdf_url":"https://www.mdpi.com/1424-8220/10/4/3989/pdf?version=1403312394","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sensors","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2124429464.pdf","grobid_xml":"https://content.openalex.org/works/W2124429464.grobid-xml"},"referenced_works_count":20,"referenced_works":["https://openalex.org/W141735924","https://openalex.org/W1967109116","https://openalex.org/W1991126128","https://openalex.org/W2007407027","https://openalex.org/W2012347002","https://openalex.org/W2012893462","https://openalex.org/W2023753998","https://openalex.org/W2030225268","https://openalex.org/W2035399608","https://openalex.org/W2055076893","https://openalex.org/W2062408946","https://openalex.org/W2069336095","https://openalex.org/W2107639256","https://openalex.org/W2122956407","https://openalex.org/W2127932846","https://openalex.org/W2135239091","https://openalex.org/W2135307366","https://openalex.org/W2159731359","https://openalex.org/W2160686622","https://openalex.org/W2268857563"],"related_works":["https://openalex.org/W2094969048","https://openalex.org/W994558755","https://openalex.org/W3035935536","https://openalex.org/W2010746423","https://openalex.org/W2372119205","https://openalex.org/W2117710422","https://openalex.org/W1987106725","https://openalex.org/W1787300689","https://openalex.org/W4283270028","https://openalex.org/W2079437682"],"abstract_inverted_index":{"This":[0],"paper":[1],"discusses":[2],"the":[3,7,47,53],"assembly":[4,22,48],"challenges":[5],"considering":[6],"design":[8,57],"and":[9,34],"manufacturability":[10],"of":[11],"a":[12],"Wafer":[13],"Level":[14],"Thin":[15],"Film":[16],"Package":[17],"in":[18,43],"MEMS":[19],"applications.":[20],"The":[21,26],"processes":[23,31],"are":[24,32,38],"discussed.":[25],"loads":[27],"associated":[28],"with":[29,40],"these":[30],"illustrated":[33],"evaluated.":[35],"Numerical":[36],"calculations":[37],"combined":[39],"experimental":[41],"observations":[42],"order":[44],"to":[45],"estimate":[46],"risks.":[49],"Our":[50],"results":[51],"emphasize":[52],"need":[54],"for":[55,58],"concurrent":[56],"assembly.":[59]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-25T08:15:23.626066","created_date":"2025-10-10T00:00:00"}