{"id":"https://openalex.org/W2113496317","doi":"https://doi.org/10.3390/mi6101439","title":"Manufacturing and Characterization of a Thermoelectric Energy Harvester Using the CMOS-MEMS Technology","display_name":"Manufacturing and Characterization of a Thermoelectric Energy Harvester Using the CMOS-MEMS Technology","publication_year":2015,"publication_date":"2015-10-16","ids":{"openalex":"https://openalex.org/W2113496317","doi":"https://doi.org/10.3390/mi6101439","mag":"2113496317"},"language":"en","primary_location":{"id":"doi:10.3390/mi6101439","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi6101439","pdf_url":"https://www.mdpi.com/2072-666X/6/10/1439/pdf?version=1445244490","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/2072-666X/6/10/1439/pdf?version=1445244490","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5055675890","display_name":"Shih-Wen Peng","orcid":null},"institutions":[{"id":"https://openalex.org/I162838928","display_name":"National Chung Hsing University","ror":"https://ror.org/05vn3ca78","country_code":"TW","type":"education","lineage":["https://openalex.org/I162838928"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shih-Wen Peng","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","institution_ids":["https://openalex.org/I162838928"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069876826","display_name":"Po\u2010Jen Shih","orcid":"https://orcid.org/0000-0002-8726-9998"},"institutions":[{"id":"https://openalex.org/I192168892","display_name":"National University of Kaohsiung","ror":"https://ror.org/013zjb662","country_code":"TW","type":"education","lineage":["https://openalex.org/I192168892"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Po-Jen Shih","raw_affiliation_strings":["Department of Civil and Environmental Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Civil and Environmental Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan","institution_ids":["https://openalex.org/I192168892"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005155364","display_name":"Ching\u2010Liang Dai","orcid":"https://orcid.org/0000-0001-9114-7363"},"institutions":[{"id":"https://openalex.org/I162838928","display_name":"National Chung Hsing University","ror":"https://ror.org/05vn3ca78","country_code":"TW","type":"education","lineage":["https://openalex.org/I162838928"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Ching-Liang Dai","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan","institution_ids":["https://openalex.org/I162838928"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5005155364"],"corresponding_institution_ids":["https://openalex.org/I162838928"],"apc_list":{"value":2000,"currency":"CHF","value_usd":2165},"apc_paid":{"value":2000,"currency":"CHF","value_usd":2165},"fwci":1.1231,"has_fulltext":true,"cited_by_count":42,"citation_normalized_percentile":{"value":0.76164285,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"6","issue":"10","first_page":"1560","last_page":"1568"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermocouple","display_name":"Thermocouple","score":0.8836511373519897},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7456703186035156},{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.6941257119178772},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6653464436531067},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6390436291694641},{"id":"https://openalex.org/keywords/energy-harvesting","display_name":"Energy harvesting","score":0.5937408804893494},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.5264509320259094},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5093830823898315},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.46224287152290344},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4480750560760498},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.43540748953819275},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.434085488319397},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.42186254262924194},{"id":"https://openalex.org/keywords/thermoelectric-materials","display_name":"Thermoelectric materials","score":0.41541916131973267},{"id":"https://openalex.org/keywords/energy","display_name":"Energy (signal processing)","score":0.32196444272994995},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20602113008499146},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.18423086404800415},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.14358359575271606},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.09288844466209412}],"concepts":[{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.8836511373519897},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7456703186035156},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.6941257119178772},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6653464436531067},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6390436291694641},{"id":"https://openalex.org/C101518730","wikidata":"https://www.wikidata.org/wiki/Q930236","display_name":"Energy harvesting","level":3,"score":0.5937408804893494},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.5264509320259094},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5093830823898315},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.46224287152290344},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4480750560760498},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.43540748953819275},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.434085488319397},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.42186254262924194},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.41541916131973267},{"id":"https://openalex.org/C186370098","wikidata":"https://www.wikidata.org/wiki/Q442787","display_name":"Energy (signal processing)","level":2,"score":0.32196444272994995},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20602113008499146},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.18423086404800415},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.14358359575271606},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.09288844466209412},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.3390/mi6101439","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi6101439","pdf_url":"https://www.mdpi.com/2072-666X/6/10/1439/pdf?version=1445244490","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:3fe98e16483448cba8450abe97ea498f","is_oa":false,"landing_page_url":"https://doaj.org/article/3fe98e16483448cba8450abe97ea498f","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Micromachines, Vol 6, Iss 10, Pp 1560-1568 (2015)","raw_type":"article"},{"id":"pmh:oai:mdpi.com:/2072-666X/6/10/1560/","is_oa":true,"landing_page_url":"http://doi.org/10.3390/mi6101439","pdf_url":null,"source":{"id":"https://openalex.org/S4306400947","display_name":"MDPI (MDPI AG)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210097602","host_organization_name":"Multidisciplinary Digital Publishing Institute (Switzerland)","host_organization_lineage":["https://openalex.org/I4210097602"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Micromachines","raw_type":"Text"}],"best_oa_location":{"id":"doi:10.3390/mi6101439","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi6101439","pdf_url":"https://www.mdpi.com/2072-666X/6/10/1439/pdf?version=1445244490","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8799999952316284,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2113496317.pdf","grobid_xml":"https://content.openalex.org/works/W2113496317.grobid-xml"},"referenced_works_count":36,"referenced_works":["https://openalex.org/W1862694621","https://openalex.org/W1968298709","https://openalex.org/W1975107244","https://openalex.org/W1976822956","https://openalex.org/W1993660539","https://openalex.org/W2000181253","https://openalex.org/W2004901902","https://openalex.org/W2007035286","https://openalex.org/W2007697940","https://openalex.org/W2011651788","https://openalex.org/W2012326895","https://openalex.org/W2015648930","https://openalex.org/W2020360707","https://openalex.org/W2021905164","https://openalex.org/W2031350258","https://openalex.org/W2031739436","https://openalex.org/W2037700156","https://openalex.org/W2040302530","https://openalex.org/W2041097227","https://openalex.org/W2052219411","https://openalex.org/W2052246031","https://openalex.org/W2055152164","https://openalex.org/W2057573768","https://openalex.org/W2057710469","https://openalex.org/W2065658803","https://openalex.org/W2070539841","https://openalex.org/W2079741565","https://openalex.org/W2086507063","https://openalex.org/W2095318639","https://openalex.org/W2104298187","https://openalex.org/W2118751963","https://openalex.org/W2135010991","https://openalex.org/W2152131785","https://openalex.org/W2160178720","https://openalex.org/W2161535064","https://openalex.org/W2499130578"],"related_works":["https://openalex.org/W2991058684","https://openalex.org/W2948256387","https://openalex.org/W4308191264","https://openalex.org/W2901480515","https://openalex.org/W3093857753","https://openalex.org/W2802430672","https://openalex.org/W4387094989","https://openalex.org/W4205778619","https://openalex.org/W2631294502","https://openalex.org/W3143330227"],"abstract_inverted_index":{"The":[0,21,42,51,81,107],"fabrication":[1],"and":[2,33,48,95,124],"characterization":[3],"of":[4,27,37,46,54,62,104,121,128],"a":[5,85,125],"thermoelectric":[6,22],"energy":[7,23,30,56,73,82,113],"harvester":[8,24,57,74,83,114],"using":[9],"the":[10,55,60,63,69,72,76,90,96,101,112],"complementary":[11],"metal":[12],"oxide":[13],"semiconductor":[14],"(CMOS)-microelectromechanical":[15],"system":[16],"(MEMS)":[17],"technology":[18],"were":[19],"presented.":[20],"is":[25],"composed":[26],"eight":[28],"circular":[29],"harvesting":[31],"cells,":[32],"each":[34],"cell":[35],"consists":[36],"25":[38],"thermocouples":[39,43],"in":[40],"series.":[41],"are":[44],"made":[45],"p-type":[47],"n-type":[49],"polysilicons.":[50],"output":[52,70,117],"power":[53,126],"relies":[58],"on":[59],"number":[61,78],"thermocouples.":[64],"In":[65],"order":[66],"to":[67,88,99],"enhance":[68],"power,":[71],"increases":[75],"thermocouple":[77],"per":[79,119],"area.":[80],"requires":[84],"post-CMOS":[86],"process":[87],"etch":[89],"sacrificial":[91],"silicon":[92,97],"dioxide":[93],"layer":[94],"substrate":[98],"release":[100],"suspended":[102],"structures":[103],"hot":[105],"part.":[106],"experimental":[108],"results":[109],"show":[110],"that":[111],"has":[115],"an":[116],"voltage":[118],"area":[120],"0.178":[122],"mV\u00b7mm\u22122\u00b7K\u22121":[123],"factor":[127],"1.47":[129],"\u00d7":[130],"10\u22123":[131],"pW\u00b7mm\u22122\u00b7K\u22122.":[132]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":7},{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2016-06-24T00:00:00"}