{"id":"https://openalex.org/W2116614267","doi":"https://doi.org/10.3390/mi4010067","title":"Effects of Micromachining Processes on Electro-Osmotic Flow Mobility of Glass Surfaces","display_name":"Effects of Micromachining Processes on Electro-Osmotic Flow Mobility of Glass Surfaces","publication_year":2013,"publication_date":"2013-03-13","ids":{"openalex":"https://openalex.org/W2116614267","doi":"https://doi.org/10.3390/mi4010067","mag":"2116614267"},"language":"en","primary_location":{"id":"doi:10.3390/mi4010067","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi4010067","pdf_url":"https://www.mdpi.com/2072-666X/4/1/67/pdf?version=1363189300","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/2072-666X/4/1/67/pdf?version=1363189300","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5049190118","display_name":"Yosuke Koga","orcid":null},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yosuke Koga","raw_affiliation_strings":["Department of Mechanical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046201784","display_name":"Reiko Kuriyama","orcid":"https://orcid.org/0000-0003-3619-7370"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Reiko Kuriyama","raw_affiliation_strings":["Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103106346","display_name":"Yohei Sato","orcid":"https://orcid.org/0000-0003-4918-9724"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yohei Sato","raw_affiliation_strings":["Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109355447","display_name":"Koichi Hishida","orcid":null},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koichi Hishida","raw_affiliation_strings":["Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","Organization for the Strategic Coordination of Research and Intellectual Properties"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","institution_ids":["https://openalex.org/I203951103"]},{"raw_affiliation_string":"Organization for the Strategic Coordination of Research and Intellectual Properties","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030225388","display_name":"Norihisa Miki","orcid":"https://orcid.org/0000-0002-5632-2143"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Norihisa Miki","raw_affiliation_strings":["Department of Mechanical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan"],"raw_orcid":"https://orcid.org/0000-0002-5632-2143","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8522, Japan","institution_ids":["https://openalex.org/I203951103"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2000,"currency":"CHF","value_usd":2165},"apc_paid":{"value":2000,"currency":"CHF","value_usd":2165},"fwci":0.4103,"has_fulltext":true,"cited_by_count":17,"citation_normalized_percentile":{"value":0.66764968,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"4","issue":"1","first_page":"67","last_page":"79"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.735441267490387},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7305321097373962},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.6982866525650024},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6772103309631348},{"id":"https://openalex.org/keywords/surface-finish","display_name":"Surface finish","score":0.6079968810081482},{"id":"https://openalex.org/keywords/isotropic-etching","display_name":"Isotropic etching","score":0.5605014562606812},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4808145761489868},{"id":"https://openalex.org/keywords/dry-etching","display_name":"Dry etching","score":0.4622488021850586},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.44410043954849243},{"id":"https://openalex.org/keywords/surface-modification","display_name":"Surface modification","score":0.42961329221725464},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4294319450855255},{"id":"https://openalex.org/keywords/bulk-micromachining","display_name":"Bulk micromachining","score":0.4134993553161621},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.36746513843536377},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36128202080726624},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.28929466009140015},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.16860371828079224}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.735441267490387},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7305321097373962},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.6982866525650024},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6772103309631348},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.6079968810081482},{"id":"https://openalex.org/C33220542","wikidata":"https://www.wikidata.org/wiki/Q6086567","display_name":"Isotropic etching","level":4,"score":0.5605014562606812},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4808145761489868},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.4622488021850586},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.44410043954849243},{"id":"https://openalex.org/C115537861","wikidata":"https://www.wikidata.org/wiki/Q7645993","display_name":"Surface modification","level":2,"score":0.42961329221725464},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4294319450855255},{"id":"https://openalex.org/C41075158","wikidata":"https://www.wikidata.org/wiki/Q4996485","display_name":"Bulk micromachining","level":5,"score":0.4134993553161621},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.36746513843536377},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36128202080726624},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.28929466009140015},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.16860371828079224},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.3390/mi4010067","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi4010067","pdf_url":"https://www.mdpi.com/2072-666X/4/1/67/pdf?version=1363189300","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.374.9615","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.374.9615","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.mdpi.com/2072-666X/4/1/67/pdf?y=1","raw_type":"text"},{"id":"pmh:oai:doaj.org/article:928bdae15f8a4f1f94831aa7a9d299a3","is_oa":true,"landing_page_url":"https://doaj.org/article/928bdae15f8a4f1f94831aa7a9d299a3","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Micromachines, Vol 4, Iss 1, Pp 67-79 (2013)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.3390/mi4010067","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi4010067","pdf_url":"https://www.mdpi.com/2072-666X/4/1/67/pdf?version=1363189300","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320909","display_name":"Keio University","ror":"https://ror.org/02kn6nx58"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2116614267.pdf","grobid_xml":"https://content.openalex.org/works/W2116614267.grobid-xml"},"referenced_works_count":76,"referenced_works":["https://openalex.org/W630236944","https://openalex.org/W1964302169","https://openalex.org/W1968582026","https://openalex.org/W1969216403","https://openalex.org/W1975687263","https://openalex.org/W1977150421","https://openalex.org/W1978890220","https://openalex.org/W1979352329","https://openalex.org/W1981773175","https://openalex.org/W1984575543","https://openalex.org/W2000455110","https://openalex.org/W2002672674","https://openalex.org/W2009001911","https://openalex.org/W2009129285","https://openalex.org/W2009471751","https://openalex.org/W2010479393","https://openalex.org/W2016277424","https://openalex.org/W2016779837","https://openalex.org/W2017231440","https://openalex.org/W2019770578","https://openalex.org/W2019846554","https://openalex.org/W2023394266","https://openalex.org/W2023588096","https://openalex.org/W2024286012","https://openalex.org/W2027872603","https://openalex.org/W2028276783","https://openalex.org/W2032218118","https://openalex.org/W2033184402","https://openalex.org/W2033795884","https://openalex.org/W2039382734","https://openalex.org/W2042278458","https://openalex.org/W2043309350","https://openalex.org/W2045071200","https://openalex.org/W2046092624","https://openalex.org/W2046921238","https://openalex.org/W2046979192","https://openalex.org/W2048228650","https://openalex.org/W2048456147","https://openalex.org/W2050515344","https://openalex.org/W2051030358","https://openalex.org/W2052179426","https://openalex.org/W2052799592","https://openalex.org/W2053563183","https://openalex.org/W2056622339","https://openalex.org/W2060096625","https://openalex.org/W2060726880","https://openalex.org/W2061014393","https://openalex.org/W2061873493","https://openalex.org/W2065748148","https://openalex.org/W2065781758","https://openalex.org/W2066739245","https://openalex.org/W2070971833","https://openalex.org/W2073875816","https://openalex.org/W2073911898","https://openalex.org/W2075574064","https://openalex.org/W2079490428","https://openalex.org/W2082689940","https://openalex.org/W2086487380","https://openalex.org/W2090139697","https://openalex.org/W2091511871","https://openalex.org/W2093356989","https://openalex.org/W2101565116","https://openalex.org/W2106689037","https://openalex.org/W2108868865","https://openalex.org/W2122288099","https://openalex.org/W2126203846","https://openalex.org/W2131538144","https://openalex.org/W2136822145","https://openalex.org/W2142432823","https://openalex.org/W2161041066","https://openalex.org/W2168168425","https://openalex.org/W2240977112","https://openalex.org/W2317251052","https://openalex.org/W2329326891","https://openalex.org/W3099432648","https://openalex.org/W3103247389"],"related_works":["https://openalex.org/W2138446428","https://openalex.org/W2741274830","https://openalex.org/W2186803100","https://openalex.org/W2159636143","https://openalex.org/W3021553204","https://openalex.org/W1584171941","https://openalex.org/W1999955672","https://openalex.org/W1966309282","https://openalex.org/W2007813469","https://openalex.org/W1953159322"],"abstract_inverted_index":{"Silica":[0],"glass":[1,44,76,101,110],"is":[2,53,68,83],"frequently":[3],"used":[4,41],"as":[5,19],"a":[6,71],"device":[7],"material":[8],"for":[9],"micro/nano":[10,47,203],"fluidic":[11,48,204],"devices":[12],"due":[13],"to":[14,42,45,60,131],"its":[15],"excellent":[16],"properties,":[17],"such":[18],"transparency":[20],"and":[21,29,104,129,156],"chemical":[22],"resistance.":[23],"Wet":[24],"etching":[25,31,38,115],"by":[26,32,70,85,112,117],"hydrofluoric":[27],"acid":[28],"dry":[30],"neutral":[33],"loop":[34],"discharge":[35],"(NLD)":[36],"plasma":[37,119],"are":[39],"currently":[40],"micromachine":[43],"form":[46],"channels.":[49,65],"Electro-osmotic":[50],"flow":[51],"(EOF)":[52],"one":[54],"of":[55,73,96,140,177,196,202],"the":[56,64,74,86,94,100,105,122,138,141,147,153,159,170,175,178,188,200],"most":[57],"effective":[58],"methods":[59],"drive":[61],"liquids":[62],"into":[63],"EOF":[66,106,135,148],"mobility":[67,149],"affected":[69],"property":[72],"micromachined":[75],"surfaces,":[77],"which":[78],"includes":[79],"surface":[80,102,123,154,171],"roughness":[81,172],"that":[82,146,187],"determined":[84],"manufacturing":[87],"processes.":[88],"In":[89],"this":[90,192],"paper,":[91],"we":[92],"investigate":[93],"effect":[95],"micromaching":[97],"processes":[98],"on":[99,152,174],"topography":[103,124],"mobility.":[107],"We":[108,185],"prepared":[109],"surfaces":[111],"either":[113],"wet":[114],"or":[116,183],"NLD":[118],"etching,":[120],"investigated":[121],"using":[125],"atomic":[126],"force":[127],"microscopy,":[128],"attempted":[130],"correlate":[132],"it":[133],"with":[134],"generated":[136],"in":[137,191,199],"micro-channels":[139],"machined":[142],"glass.":[143],"Experiments":[144],"revealed":[145],"strongly":[150],"depends":[151],"roughness,":[155],"therefore":[157],"upon":[158],"fabrication":[160],"process":[161],"used.":[162],"A":[163],"particularly":[164],"strong":[165],"dependency":[166],"was":[167,173],"observed":[168],"when":[169],"order":[176],"electric":[179],"double":[180],"layer":[181],"thickness":[182],"below.":[184],"believe":[186],"correlation":[189],"described":[190],"paper":[193],"can":[194],"be":[195],"great":[197],"help":[198],"design":[201],"devices.":[205]},"counts_by_year":[{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":4},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}