{"id":"https://openalex.org/W3163424296","doi":"https://doi.org/10.3233/978-1-61499-898-3-178","title":"Towards the Development of Additive Layer Manufacturing Cost Model","display_name":"Towards the Development of Additive Layer Manufacturing Cost Model","publication_year":2018,"publication_date":"2018-01-01","ids":{"openalex":"https://openalex.org/W3163424296","doi":"https://doi.org/10.3233/978-1-61499-898-3-178","mag":"3163424296"},"language":"en","primary_location":{"id":"doi:10.3233/978-1-61499-898-3-178","is_oa":true,"landing_page_url":"https://doi.org/10.3233/978-1-61499-898-3-178","pdf_url":null,"source":{"id":"https://openalex.org/S4210187496","display_name":"Advances in transdisciplinary engineering","issn_l":"2352-751X","issn":["2352-751X","2352-7528"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310318577","host_organization_name":"IOS Press","host_organization_lineage":["https://openalex.org/P4310318577"],"host_organization_lineage_names":["IOS Press"],"type":"book series"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Transdisciplinary Engineering","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.3233/978-1-61499-898-3-178","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Shehab Essam","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Shehab Essam","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052096289","display_name":"Lapuerta-Porpetta Jimena","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Lapuerta-Porpetta Jimena","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116321884","display_name":"Michel Alice","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michel Alice","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116321885","display_name":"Paris Celia","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Paris Celia","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116321886","display_name":"Perrin Adele","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Perrin Adele","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062338660","display_name":"Selgas-Carvajal Sergio","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Selgas-Carvajal Sergio","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116321888","display_name":"Schuler Margaux","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Schuler Margaux","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085912083","display_name":"Ung Emilie","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ung Emilie","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116321890","display_name":"Kirkwood Leigh","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kirkwood Leigh","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022073589","display_name":"Birthe K. Paul","orcid":"https://orcid.org/0000-0002-5994-5354"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Baguley Paul","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Sarfraz Shoaib","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sarfraz Shoaib","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5116321882","display_name":"Chinchapatnam Phani","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chinchapatnam Phani","raw_affiliation_strings":[],"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":12,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.1145,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.81300427,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"178","last_page":"187"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.988099992275238,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.988099992275238,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9872999787330627,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9085000157356262,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.6448869109153748},{"id":"https://openalex.org/keywords/development","display_name":"Development (topology)","score":0.5300455093383789},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.41555672883987427},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3647165894508362},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23077073693275452},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.21153593063354492},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.13214579224586487},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.12678661942481995}],"concepts":[{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6448869109153748},{"id":"https://openalex.org/C2776542497","wikidata":"https://www.wikidata.org/wiki/Q5266672","display_name":"Development (topology)","level":2,"score":0.5300455093383789},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.41555672883987427},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3647165894508362},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23077073693275452},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.21153593063354492},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13214579224586487},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.12678661942481995},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.3233/978-1-61499-898-3-178","is_oa":true,"landing_page_url":"https://doi.org/10.3233/978-1-61499-898-3-178","pdf_url":null,"source":{"id":"https://openalex.org/S4210187496","display_name":"Advances in transdisciplinary engineering","issn_l":"2352-751X","issn":["2352-751X","2352-7528"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310318577","host_organization_name":"IOS Press","host_organization_lineage":["https://openalex.org/P4310318577"],"host_organization_lineage_names":["IOS Press"],"type":"book series"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Transdisciplinary Engineering","raw_type":"book-chapter"},{"id":"pmh:oai:pure.atira.dk:openaire_cris_publications/724bb97a-5816-4096-80db-114f207ad714","is_oa":false,"landing_page_url":"https://research.birmingham.ac.uk/en/publications/724bb97a-5816-4096-80db-114f207ad714","pdf_url":null,"source":{"id":"https://openalex.org/S4306402634","display_name":"University of Birmingham Research Portal (University of Birmingham)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79619799","host_organization_name":"University of Birmingham","host_organization_lineage":["https://openalex.org/I79619799"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Shehab , E , Lapuerta-Porpetta , J , Michel , A , Paris , C , Perrin , A , Selgas-Carvajal , S , Schuler , M , Ung , E , Kirkwood , L , Baguley , P , Sarfraz , S & Chinchapatnam , P 2018 , Towards the Development of Additive Layer Manufacturing Cost Model . in Advances in Transdisciplinary Engineering . https://doi.org/10.3233/978-1-61499-898-3-178","raw_type":"contributionToPeriodical"},{"id":"mag:3163424296","is_oa":false,"landing_page_url":"https://ebooks.iospress.nl/volumearticle/49798","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":null,"raw_type":null}],"best_oa_location":{"id":"doi:10.3233/978-1-61499-898-3-178","is_oa":true,"landing_page_url":"https://doi.org/10.3233/978-1-61499-898-3-178","pdf_url":null,"source":{"id":"https://openalex.org/S4210187496","display_name":"Advances in transdisciplinary engineering","issn_l":"2352-751X","issn":["2352-751X","2352-7528"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310318577","host_organization_name":"IOS Press","host_organization_lineage":["https://openalex.org/P4310318577"],"host_organization_lineage_names":["IOS Press"],"type":"book series"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Transdisciplinary Engineering","raw_type":"book-chapter"},"sustainable_development_goals":[{"score":0.4399999976158142,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"In":[0,118],"the":[1,20,24,39,61,67,89,114,124,129,155,167,172,187,194,206,217],"past":[2],"few":[3],"years,":[4],"Additive":[5],"Layer":[6],"Manufacturing":[7],"(ALM)":[8],"utilisation":[9],"has":[10,109,122,137],"increased":[11,183],"significantly.":[12],"The":[13,45,151],"high":[14,91],"cost":[15,54,71,135,142,158,169,174,177,182],"of":[16,26,47,96,113,144,166,205,209,225],"manufactured":[17],"products":[18],"is":[19,50],"main":[21,168],"barrier":[22],"for":[23,149],"implementation":[25],"this":[27,48,120,210],"technology":[28],"in":[29,66,99,197,219,223],"mass":[30],"production.":[31],"This":[32,191],"implies":[33],"that":[34],"companies":[35],"need":[36],"to":[37,42,51,128,140],"search":[38],"cost-efficient":[40],"way":[41],"remain":[43],"competitive.":[44],"aim":[46],"study":[49,192],"develop":[52],"a":[53,94,111,200],"model":[55,136,159],"and":[56,63,83,107,146,160,163,175,185,203],"software":[57,152],"tool":[58,153],"while":[59],"addressing":[60],"issues":[62],"challenges":[64],"confronted":[65],"previous":[68],"developed":[69,139],"AM":[70],"models.":[72],"It":[73],"focuses":[74],"on":[75],"two":[76],"processes":[77,148],"viz.":[78],"Selective":[79],"Laser":[80],"Sintering":[81],"(SLS)":[82],"Electron":[84],"Beam":[85],"Melting":[86],"(EBM).":[87],"Despite":[88],"current":[90,164,207],"initial":[92],"investment,":[93],"growth":[95,121],"these":[97],"technologies":[98],"various":[100],"sectors":[101],"such":[102],"as":[103],"aerospace,":[104],"automotive,":[105],"medical":[106],"electronics":[108],"driven":[110],"decrease":[112],"machine":[115,173],"purchase":[116],"price.":[117],"addition,":[119],"reduced":[123],"manufacturing":[125,226],"cost,":[126],"owing":[127],"learning":[130],"curve":[131],"effect.":[132],"A":[133],"high-level":[134],"been":[138],"combine":[141],"information":[143],"SLS":[145],"EBM":[147],"metals.":[150],"analyse":[154],"data":[156],"through":[157],"gives":[161],"trends":[162],"distribution":[165],"drivers;":[170],"both":[171],"material":[176],"decreased":[178],"slightly,":[179],"however,":[180],"post-processing":[181],"significantly":[184],"became":[186],"second":[188],"highest":[189],"cost.":[190],"enhances":[193],"ALM":[195,220],"development":[196],"industries":[198,218],"giving":[199],"new":[201,211],"insight":[202],"details":[204],"state":[208],"technology.":[212],"Moreover,":[213],"it":[214],"will":[215],"benefit":[216],"market":[221],"knowledge":[222],"terms":[224],"costs.":[227]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2021-05-24T00:00:00"}