{"id":"https://openalex.org/W2605060056","doi":"https://doi.org/10.3233/978-1-61499-484-8-321","title":"An Color Interference Checking Chip Dicing Plan for Multiple Project Wafer","display_name":"An Color Interference Checking Chip Dicing Plan for Multiple Project Wafer","publication_year":2015,"publication_date":"2015-01-01","ids":{"openalex":"https://openalex.org/W2605060056","doi":"https://doi.org/10.3233/978-1-61499-484-8-321","mag":"2605060056"},"language":"en","primary_location":{"id":"doi:10.3233/978-1-61499-484-8-321","is_oa":false,"landing_page_url":"https://doi.org/10.3233/978-1-61499-484-8-321","pdf_url":null,"source":{"id":"https://openalex.org/S4210201731","display_name":"Frontiers in artificial intelligence and applications","issn_l":"0922-6389","issn":["0922-6389","1879-8314"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Frontiers in Artificial Intelligence and Applications","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086748596","display_name":"Chihhsiong Shih","orcid":"https://orcid.org/0000-0002-9266-0940"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Shih Chihhsiong","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022144720","display_name":"Minlong Huang","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Huang Minlong","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5084416510","display_name":"Zhaolong Liang","orcid":null},"institutions":[{"id":"https://openalex.org/I169090423","display_name":"Tunghai University","ror":"https://ror.org/00zhvdn11","country_code":"TW","type":"education","lineage":["https://openalex.org/I169090423"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Liang Zhaolong","raw_affiliation_strings":["Tunghai University, Taichung, Taiwan"],"affiliations":[{"raw_affiliation_string":"Tunghai University, Taichung, Taiwan","institution_ids":["https://openalex.org/I169090423"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5086748596"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.39566832,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9679999947547913,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9679999947547913,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.933899998664856},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7585689425468445},{"id":"https://openalex.org/keywords/interference","display_name":"Interference (communication)","score":0.6218948364257812},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6167160272598267},{"id":"https://openalex.org/keywords/plan","display_name":"Plan (archaeology)","score":0.5204594135284424},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4608433246612549},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.355747789144516},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.33810701966285706},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.29340606927871704},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2700611650943756},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2415456771850586},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12572473287582397},{"id":"https://openalex.org/keywords/history","display_name":"History","score":0.10291475057601929},{"id":"https://openalex.org/keywords/archaeology","display_name":"Archaeology","score":0.06476908922195435}],"concepts":[{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.933899998664856},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7585689425468445},{"id":"https://openalex.org/C32022120","wikidata":"https://www.wikidata.org/wiki/Q797225","display_name":"Interference (communication)","level":3,"score":0.6218948364257812},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6167160272598267},{"id":"https://openalex.org/C2776505523","wikidata":"https://www.wikidata.org/wiki/Q4785468","display_name":"Plan (archaeology)","level":2,"score":0.5204594135284424},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4608433246612549},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.355747789144516},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.33810701966285706},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.29340606927871704},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2700611650943756},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2415456771850586},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12572473287582397},{"id":"https://openalex.org/C95457728","wikidata":"https://www.wikidata.org/wiki/Q309","display_name":"History","level":0,"score":0.10291475057601929},{"id":"https://openalex.org/C166957645","wikidata":"https://www.wikidata.org/wiki/Q23498","display_name":"Archaeology","level":1,"score":0.06476908922195435},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.3233/978-1-61499-484-8-321","is_oa":false,"landing_page_url":"https://doi.org/10.3233/978-1-61499-484-8-321","pdf_url":null,"source":{"id":"https://openalex.org/S4210201731","display_name":"Frontiers in artificial intelligence and applications","issn_l":"0922-6389","issn":["0922-6389","1879-8314"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Frontiers in Artificial Intelligence and Applications","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W327425532","https://openalex.org/W293942573","https://openalex.org/W2168348385","https://openalex.org/W4213132161","https://openalex.org/W2017722595","https://openalex.org/W2970266003","https://openalex.org/W4281685712","https://openalex.org/W2004857665","https://openalex.org/W2897696252","https://openalex.org/W2331745693"],"abstract_inverted_index":{"In":[0],"the":[1,12],"wafer":[2],"production":[3],"process,":[4],"cost":[5],"is":[6],"an":[7],"important":[8],"factor.":[9],"Due":[10],"to":[11,22],"requirement":[13],"of":[14],"different":[15,17],"chips,":[16],"dice":[18],"arrangements":[19],"are":[20],"needed":[21],"generate":[23],"these":[24],"chips.":[25]},"counts_by_year":[],"updated_date":"2025-12-28T23:10:05.387466","created_date":"2017-04-14T00:00:00"}