{"id":"https://openalex.org/W4410553359","doi":"https://doi.org/10.23919/date64628.2025.10992810","title":"A Comprehensive Inductance-Aware Modeling Approach to Power Distribution Network in Heterogeneous 3D Integrated Circuits","display_name":"A Comprehensive Inductance-Aware Modeling Approach to Power Distribution Network in Heterogeneous 3D Integrated Circuits","publication_year":2025,"publication_date":"2025-03-31","ids":{"openalex":"https://openalex.org/W4410553359","doi":"https://doi.org/10.23919/date64628.2025.10992810"},"language":"en","primary_location":{"id":"doi:10.23919/date64628.2025.10992810","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date64628.2025.10992810","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065179609","display_name":"Qiuwei Wang","orcid":"https://orcid.org/0000-0001-5970-6639"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Quansen Wang","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, Beihang University,Beijing,China,100191"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, Beihang University,Beijing,China,100191","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031542707","display_name":"Vasilis F. Pavlidis","orcid":"https://orcid.org/0000-0002-4063-4652"},"institutions":[{"id":"https://openalex.org/I21370196","display_name":"Aristotle University of Thessaloniki","ror":"https://ror.org/02j61yw88","country_code":"GR","type":"education","lineage":["https://openalex.org/I21370196"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Vasilis F. Pavlidis","raw_affiliation_strings":["Aristotle University of Thessaloniki,ECE Department,Thessaloniki,Greece"],"affiliations":[{"raw_affiliation_string":"Aristotle University of Thessaloniki,ECE Department,Thessaloniki,Greece","institution_ids":["https://openalex.org/I21370196"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091884273","display_name":"Yuanqing Cheng","orcid":"https://orcid.org/0000-0003-2477-314X"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuanqing Cheng","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, Beihang University,Beijing,China,100191"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, Beihang University,Beijing,China,100191","institution_ids":["https://openalex.org/I82880672"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5065179609"],"corresponding_institution_ids":["https://openalex.org/I82880672"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.11438155,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.6612652540206909},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5958223938941956},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5398475527763367},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5326988697052002},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4566766917705536},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.30143415927886963},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14663353562355042},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.06702566146850586}],"concepts":[{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.6612652540206909},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5958223938941956},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5398475527763367},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5326988697052002},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4566766917705536},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.30143415927886963},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14663353562355042},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.06702566146850586},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date64628.2025.10992810","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date64628.2025.10992810","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7200000286102295}],"awards":[{"id":"https://openalex.org/G2859260522","display_name":null,"funder_award_id":"Z230002","funder_id":"https://openalex.org/F4320322919","funder_display_name":"Natural Science Foundation of Beijing Municipality"},{"id":"https://openalex.org/G3481700679","display_name":null,"funder_award_id":"92373205","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320322919","display_name":"Natural Science Foundation of Beijing Municipality","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2039835454","https://openalex.org/W2290226064","https://openalex.org/W2482450555","https://openalex.org/W2588739200","https://openalex.org/W2913065231","https://openalex.org/W3136423611","https://openalex.org/W3186775846"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2371304091","https://openalex.org/W2606355273","https://openalex.org/W1496710700","https://openalex.org/W2072843072","https://openalex.org/W3215814706","https://openalex.org/W2351633113","https://openalex.org/W2364239049","https://openalex.org/W2511684689","https://openalex.org/W4241196849"],"abstract_inverted_index":{"Heterogeneous":[0],"3D":[1],"integration":[2],"technology":[3],"is":[4,72],"a":[5,78],"cost-effective":[6],"and":[7,48,62,83,91],"high-performance":[8],"alternative":[9],"to":[10],"planar":[11],"integrated":[12,52],"circuits":[13],"(ICs).":[14],"In":[15],"this":[16],"paper,":[17],"we":[18],"propose":[19],"an":[20],"on-chip":[21,38],"power":[22],"distribution":[23],"network":[24],"(PDN)":[25],"modeling":[26],"technique":[27],"for":[28],"heterogeneous":[29],"3D-ICs":[30],"(H3D-ICs),":[31],"which":[32],"explicitly":[33],"takes":[34],"the":[35,64],"effects":[36],"of":[37,66,87],"inductance":[39],"into":[40],"account.":[41],"The":[42,70],"proposed":[43],"model":[44,71],"facilitates":[45],"efficient":[46],"transient":[47,90],"AC":[49,94],"simulations":[50],"with":[51],"inductive":[53],"effects,":[54],"enabling":[55],"accurate":[56],"noise":[57],"characterization":[58],"at":[59],"high":[60],"frequencies":[61],"facilitating":[63],"exploration":[65],"early-stage":[67],"PDN":[68],"design.":[69],"validated":[73],"via":[74],"HSPICE":[75],"simulations,":[76],"demonstrating":[77],"maximum":[79],"error":[80],"below":[81],"1%":[82],"achieving":[84],"average":[85],"speedups":[86],"1.5x":[88],"in":[89,93],"8.5x":[92],"simulations.":[95]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}