{"id":"https://openalex.org/W4385210010","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185394","title":"Front-side and Back-side Power Delivery Network Guidelines for 2nm node High Perf Computing and Mobile SoC applications","display_name":"Front-side and Back-side Power Delivery Network Guidelines for 2nm node High Perf Computing and Mobile SoC applications","publication_year":2023,"publication_date":"2023-06-11","ids":{"openalex":"https://openalex.org/W4385210010","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185394"},"language":"en","primary_location":{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185394","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185394","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100341491","display_name":"Jongmin Lee","orcid":"https://orcid.org/0000-0002-6167-7926"},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"J. Lee","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021895938","display_name":"Jae Jin Jeong","orcid":"https://orcid.org/0000-0002-3684-3179"},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"J. Jeong","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063875095","display_name":"Sanghan Lee","orcid":"https://orcid.org/0000-0002-5807-864X"},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"S. Lee","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063875095","display_name":"Sanghan Lee","orcid":"https://orcid.org/0000-0002-5807-864X"},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"S. Lee","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101943562","display_name":"J. Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"J. Lim","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010981401","display_name":"S. C. Song","orcid":"https://orcid.org/0000-0002-5484-6058"},"institutions":[{"id":"https://openalex.org/I1291425158","display_name":"Google (United States)","ror":"https://ror.org/00njsd438","country_code":"US","type":"company","lineage":["https://openalex.org/I1291425158","https://openalex.org/I4210128969"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. C. Song","raw_affiliation_strings":["Google LLC,Mountain View,CA,USA","Google LLC, Mountain View, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Google LLC,Mountain View,CA,USA","institution_ids":["https://openalex.org/I1291425158"]},{"raw_affiliation_string":"Google LLC, Mountain View, CA, USA","institution_ids":["https://openalex.org/I1291425158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075251005","display_name":"S. Ekbote","orcid":null},"institutions":[{"id":"https://openalex.org/I1291425158","display_name":"Google (United States)","ror":"https://ror.org/00njsd438","country_code":"US","type":"company","lineage":["https://openalex.org/I1291425158","https://openalex.org/I4210128969"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Ekbote","raw_affiliation_strings":["Google LLC,Mountain View,CA,USA","Google LLC, Mountain View, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Google LLC,Mountain View,CA,USA","institution_ids":["https://openalex.org/I1291425158"]},{"raw_affiliation_string":"Google LLC, Mountain View, CA, USA","institution_ids":["https://openalex.org/I1291425158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5092244738","display_name":"Nick Stevens-Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I1291425158","display_name":"Google (United States)","ror":"https://ror.org/00njsd438","country_code":"US","type":"company","lineage":["https://openalex.org/I1291425158","https://openalex.org/I4210128969"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"N. Stevens-Yu","raw_affiliation_strings":["Google LLC,Mountain View,CA,USA","Google LLC, Mountain View, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Google LLC,Mountain View,CA,USA","institution_ids":["https://openalex.org/I1291425158"]},{"raw_affiliation_string":"Google LLC, Mountain View, CA, USA","institution_ids":["https://openalex.org/I1291425158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026035071","display_name":"D. Greenlaw","orcid":null},"institutions":[{"id":"https://openalex.org/I1291425158","display_name":"Google (United States)","ror":"https://ror.org/00njsd438","country_code":"US","type":"company","lineage":["https://openalex.org/I1291425158","https://openalex.org/I4210128969"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Greenlaw","raw_affiliation_strings":["Google LLC,Mountain View,CA,USA","Google LLC, Mountain View, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Google LLC,Mountain View,CA,USA","institution_ids":["https://openalex.org/I1291425158"]},{"raw_affiliation_string":"Google LLC, Mountain View, CA, USA","institution_ids":["https://openalex.org/I1291425158"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5056156000","display_name":"Rock\u2010Hyun Baek","orcid":"https://orcid.org/0000-0002-6175-8101"},"institutions":[{"id":"https://openalex.org/I123900574","display_name":"Pohang University of Science and Technology","ror":"https://ror.org/04xysgw12","country_code":"KR","type":"education","lineage":["https://openalex.org/I123900574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"R.-H. Baek","raw_affiliation_strings":["Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea","institution_ids":["https://openalex.org/I123900574"]},{"raw_affiliation_string":"Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea","institution_ids":["https://openalex.org/I123900574"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9876999855041504,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5489896535873413},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5174339413642883},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4872497618198395},{"id":"https://openalex.org/keywords/drop","display_name":"Drop (telecommunication)","score":0.4342440962791443},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2465808391571045},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11962428689002991}],"concepts":[{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5489896535873413},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5174339413642883},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4872497618198395},{"id":"https://openalex.org/C2781345722","wikidata":"https://www.wikidata.org/wiki/Q5308388","display_name":"Drop (telecommunication)","level":2,"score":0.4342440962791443},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2465808391571045},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11962428689002991},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185394","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185394","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.7799999713897705}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052","https://openalex.org/W2382290278","https://openalex.org/W4395014643"],"abstract_inverted_index":{"For":[0],"the":[1,10],"first":[2],"time,":[3],"we":[4],"propose":[5],"selection":[6],"guidelines":[7],"for":[8,35,60,68],"using":[9],"front-side":[11,58],"(FS)":[12],"or":[13],"back-side":[14],"(BS)":[15],"power":[16],"delivery":[17],"network":[18],"(PDN)":[19],"in":[20],"a":[21],"$2\\mathrm{~nm}$":[22],"node.":[23],"IR":[24,75],"drop":[25],"of":[26,47,53],"various":[27],"FS":[28],"and":[29,39],"BS-PDN":[30,48],"structures":[31],"have":[32],"been":[33],"analyzed":[34],"high-performance":[36],"computing":[37],"(HPC)":[38],"mobile":[40,61],"SoC":[41],"applications.":[42],"Added":[43],"process":[44],"cost":[45,59],"(PC)":[46],"should":[49],"be":[50,71],"$\\lt":[51,66],"5.9\\%$":[52],"nanosheet":[54],"FET":[55],"(NSFET)":[56],"based":[57],"SoCs,":[62],"but":[63],"much":[64],"higher":[65],"10.9\\%$":[67],"HPCs,":[69],"to":[70],"cost-effective":[72],"at":[73],"similar":[74],"drop.":[76]},"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}