{"id":"https://openalex.org/W4385192396","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185277","title":"Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy","display_name":"Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy","publication_year":2023,"publication_date":"2023-06-11","ids":{"openalex":"https://openalex.org/W4385192396","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185277"},"language":"en","primary_location":{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185277","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185277","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088967519","display_name":"Norio Chujo","orcid":"https://orcid.org/0000-0001-9833-8680"},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]},{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Norio Chujo","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","Hitachi Ltd. Research & Development Group, Yokohama, Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"Hitachi Ltd. Research & Development Group, Yokohama, Japan","institution_ids":["https://openalex.org/I65143321"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075738265","display_name":"Koji Sakui","orcid":"https://orcid.org/0000-0003-2086-4802"},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koji Sakui","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062235531","display_name":"Shinji Sugatani","orcid":"https://orcid.org/0000-0001-6062-5000"},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shinji Sugatani","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011206456","display_name":"Hiroyuki Ryoson","orcid":null},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroyuki Ryoson","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110012668","display_name":"T. Nakamura","orcid":null},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tomoji Nakamura","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043022589","display_name":"Takayuki Ohba","orcid":"https://orcid.org/0000-0003-3416-7098"},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takayuki Ohba","raw_affiliation_strings":["Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan","institution_ids":["https://openalex.org/I114531698"]},{"raw_affiliation_string":"The WOW Alliance, Tokyo Institute of Technology, IIR, Yokohama, Japan","institution_ids":["https://openalex.org/I114531698"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.859,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.72963035,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9865000247955322,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7827635407447815},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7334095239639282},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.6657026410102844},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.577796459197998},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5581445097923279},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5026431083679199},{"id":"https://openalex.org/keywords/efficient-energy-use","display_name":"Efficient energy use","score":0.4443413019180298},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41935718059539795},{"id":"https://openalex.org/keywords/cube","display_name":"Cube (algebra)","score":0.41230854392051697},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.33162009716033936},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.30386555194854736},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.29931798577308655},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.29905563592910767},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28581249713897705},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24350398778915405},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.14762884378433228},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13074436783790588}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7827635407447815},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7334095239639282},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.6657026410102844},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.577796459197998},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5581445097923279},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5026431083679199},{"id":"https://openalex.org/C2742236","wikidata":"https://www.wikidata.org/wiki/Q924713","display_name":"Efficient energy use","level":2,"score":0.4443413019180298},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41935718059539795},{"id":"https://openalex.org/C53051483","wikidata":"https://www.wikidata.org/wiki/Q861555","display_name":"Cube (algebra)","level":2,"score":0.41230854392051697},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.33162009716033936},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.30386555194854736},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.29931798577308655},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.29905563592910767},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28581249713897705},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24350398778915405},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.14762884378433228},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13074436783790588},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185277","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185277","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8899999856948853}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W3047436637"],"related_works":["https://openalex.org/W3120961607","https://openalex.org/W3148568549","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W4211178602","https://openalex.org/W2269474412","https://openalex.org/W4386903460","https://openalex.org/W1898301658","https://openalex.org/W2024395993","https://openalex.org/W4214760333"],"abstract_inverted_index":{"We":[0],"propose":[1],"a":[2,40,54],"technology":[3],"called":[4],"BBCube":[5,19,47],"3D":[6,20,25,48],"for":[7],"AI":[8],"and":[9,16,34,45,61,76],"HPC":[10],"applications,":[11],"which":[12,28],"need":[13],"high":[14],"bandwidth":[15,55],"power":[17],"efficiency.":[18],"is":[21],"constructed":[22],"by":[23],"heterogeneous":[24],"integration":[26],"in":[27],"xPU":[29],"(CPU,":[30],"GPU":[31],"etc.)":[32],"chiplets":[33],"DRAM":[35],"wafers":[36],"are":[37],"stacked":[38],"using":[39],"combination":[41],"of":[42,74,79],"bumpless":[43],"Wafer-on-Wafer":[44],"Chip-on-Wafer.":[46],"has":[49],"the":[50],"potential":[51],"to":[52],"achieve":[53],"30":[56],"times":[57,63],"higher":[58,64],"than":[59,65],"DDR5":[60,75],"four":[62],"HBM2E":[66],"with":[67],"an":[68],"bit":[69],"access":[70],"energy":[71],"1/20th":[72],"that":[73,78],"1/5th":[77],"HBM2E.":[80]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}