{"id":"https://openalex.org/W4385210818","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185230","title":"High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications","display_name":"High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications","publication_year":2023,"publication_date":"2023-06-11","ids":{"openalex":"https://openalex.org/W4385210818","doi":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185230"},"language":"en","primary_location":{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185230","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185230","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024213168","display_name":"Yao-Hung Huang","orcid":"https://orcid.org/0000-0002-4146-7403"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Yao-Hung Huang","raw_affiliation_strings":["Institute of Electronics Engineering"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074081012","display_name":"Yu\u2010Cheng Hsieh","orcid":"https://orcid.org/0000-0001-6218-7139"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yu-Cheng Hsieh","raw_affiliation_strings":["Institute of Electronics Engineering"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088555411","display_name":"Yu-Cheng Lin","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yu-Cheng Lin","raw_affiliation_strings":["Institute of Electronics Engineering"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108829163","display_name":"Yue\u2010Der Chih","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yue-Der Chih","raw_affiliation_strings":["Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100746974","display_name":"Eric Wang","orcid":"https://orcid.org/0000-0001-7940-753X"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Eric Wang","raw_affiliation_strings":["Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081987422","display_name":"Jonathan Chang","orcid":"https://orcid.org/0000-0002-3811-1254"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jonathan Chang","raw_affiliation_strings":["Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC),Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Design Technology Platform (DTP), Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085948014","display_name":"Ya\u2010Chin King","orcid":"https://orcid.org/0000-0003-4065-0350"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ya-Chin King","raw_affiliation_strings":["Institute of Electronics Engineering","College of Semiconductor Research, National Tsing Hua University (NTHU), Taiwan"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics Engineering","institution_ids":[]},{"raw_affiliation_string":"College of Semiconductor Research, National Tsing Hua University (NTHU), Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109905968","display_name":"Chrong Jung Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chrong Jung Lin","raw_affiliation_strings":["Institute of Electronics Engineering","College of Semiconductor Research, National Tsing Hua University (NTHU), Taiwan"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics Engineering","institution_ids":[]},{"raw_affiliation_string":"College of Semiconductor Research, National Tsing Hua University (NTHU), Taiwan","institution_ids":["https://openalex.org/I25846049"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5024213168"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.4709,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.82053485,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9853000044822693,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9840999841690063,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/resistive-random-access-memory","display_name":"Resistive random-access memory","score":0.8114435076713562},{"id":"https://openalex.org/keywords/microcontroller","display_name":"Microcontroller","score":0.7293946146965027},{"id":"https://openalex.org/keywords/random-access-memory","display_name":"Random access memory","score":0.4875468611717224},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4870884418487549},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.46096915006637573},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.2850490212440491},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1915815770626068},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1364680528640747}],"concepts":[{"id":"https://openalex.org/C182019814","wikidata":"https://www.wikidata.org/wiki/Q1143830","display_name":"Resistive random-access memory","level":3,"score":0.8114435076713562},{"id":"https://openalex.org/C173018170","wikidata":"https://www.wikidata.org/wiki/Q165678","display_name":"Microcontroller","level":2,"score":0.7293946146965027},{"id":"https://openalex.org/C2994168587","wikidata":"https://www.wikidata.org/wiki/Q5295","display_name":"Random access memory","level":2,"score":0.4875468611717224},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4870884418487549},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.46096915006637573},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2850490212440491},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1915815770626068},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1364680528640747},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/vlsitechnologyandcir57934.2023.10185230","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185230","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322589","display_name":"Taiwan Semiconductor Manufacturing Company","ror":"https://ror.org/02wx79d08"},{"id":"https://openalex.org/F4320331164","display_name":"National Science and Technology Council","ror":"https://ror.org/00wnb9798"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3091627987","https://openalex.org/W2147310439","https://openalex.org/W2020622255","https://openalex.org/W2065076119","https://openalex.org/W4384616198","https://openalex.org/W2054635671","https://openalex.org/W4312727691","https://openalex.org/W2588373136","https://openalex.org/W2791102142","https://openalex.org/W2088897617"],"abstract_inverted_index":{"An":[0],"innovative":[1],"3D":[2,44,60],"stackable":[3,43],"wing-shaped":[4],"Via":[5],"RRAM":[6,45,62],"is":[7,63],"firstly":[8],"proposed,":[9],"featuring":[10],"logic":[11],"embedded":[12,61],"ultra-high":[13],"memory":[14],"density":[15,68],"(>0.1Gb/mm":[16],"<sup":[17],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[18],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[19],")":[20],"and":[21,33,56,76],"full":[22],"compatibility":[23],"with":[24],"TSMC\u2019s":[25],"16nm":[26],"FinFET":[27,51],"CMOS":[28],"platform":[29],"without":[30],"extra":[31],"mask":[32],"process":[34],"steps.":[35],"In":[36],"this":[37],"paper,":[38],"the":[39,58],"new":[40,59],"backend":[41],"Cu-layer":[42],"cell":[46],"structure,":[47],"array":[48],"operations,":[49],"reliability,":[50],"macro":[52],"scalability":[53],"are":[54],"characterized":[55],"exhibiting":[57],"a":[64],"very":[65],"promising":[66],"high":[67,71],"solution":[69],"of":[70],"performance":[72],"MCU":[73],"in":[74],"automotive":[75],"IoT":[77],"applications.":[78]},"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":6}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}