{"id":"https://openalex.org/W3185317308","doi":"https://doi.org/10.23919/vlsicircuits52068.2021.9492472","title":"All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors","display_name":"All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors","publication_year":2021,"publication_date":"2021-06-13","ids":{"openalex":"https://openalex.org/W3185317308","doi":"https://doi.org/10.23919/vlsicircuits52068.2021.9492472","mag":"3185317308"},"language":"en","primary_location":{"id":"doi:10.23919/vlsicircuits52068.2021.9492472","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsicircuits52068.2021.9492472","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 Symposium on VLSI Circuits","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041779304","display_name":"Eun Sub Shim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Eun Sub Shim","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100767529","display_name":"Kyungho Lee","orcid":"https://orcid.org/0000-0002-2173-5642"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyungho Lee","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112662263","display_name":"Junghyung Pyo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Junghyung Pyo","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088953657","display_name":"Wooseok Choi","orcid":"https://orcid.org/0000-0003-4064-4575"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Wooseok Choi","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008885462","display_name":"Jungbin Yun","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jungbin Yun","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008933510","display_name":"Taesub Jung","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taesub Jung","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059787698","display_name":"Kyungduck Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyungduck Lee","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100417274","display_name":"Seyoung Kim","orcid":"https://orcid.org/0000-0002-0408-1165"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seyoung Kim","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113782068","display_name":"Chanhee Lee","orcid":"https://orcid.org/0009-0002-5287-6664"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chanhee Lee","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054673418","display_name":"Seungki Baek","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seungki Baek","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100650578","display_name":"Hyun\u2010Cheol Kim","orcid":"https://orcid.org/0000-0002-6831-9291"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyuncheol Kim","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074857251","display_name":"Sungsoo Choi","orcid":"https://orcid.org/0000-0001-6179-5968"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungsoo Choi","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041416872","display_name":"Jun-Seok Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Junseok Yang","raw_affiliation_strings":["Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072195758","display_name":"Kyoungmok Son","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyoungmok Son","raw_affiliation_strings":["Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113894948","display_name":"Jong-Won Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jongwon Choi","raw_affiliation_strings":["Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090080019","display_name":"Howoo Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Howoo Park","raw_affiliation_strings":["Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Division, Samsung Electronics Co., Ltd., Yongin-City, Gyeonggi-Do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025624226","display_name":"Bumsuk Kim","orcid":"https://orcid.org/0000-0002-8438-6670"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Bumsuk Kim","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102604026","display_name":"JungChak Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JungChak Ahn","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113986295","display_name":"Duckhyun Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Duckhyun Chang","raw_affiliation_strings":["System LSI Division, Samsung Electronics Co., Ltd"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Co., Ltd","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":19,"corresponding_author_ids":["https://openalex.org/A5041779304"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":1.1327,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.80621125,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10540","display_name":"Advanced Fluorescence Microscopy Techniques","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/1304","display_name":"Biophysics"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.9015074968338013},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.6294410228729248},{"id":"https://openalex.org/keywords/focus","display_name":"Focus (optics)","score":0.5673292279243469},{"id":"https://openalex.org/keywords/shallow-trench-isolation","display_name":"Shallow trench isolation","score":0.5342544317245483},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5134781002998352},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4929652214050293},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4753539264202118},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.45964881777763367},{"id":"https://openalex.org/keywords/dual","display_name":"Dual (grammatical number)","score":0.4556177258491516},{"id":"https://openalex.org/keywords/image-quality","display_name":"Image quality","score":0.43694111704826355},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.27925634384155273},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.2070780098438263},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.19208073616027832},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.17384573817253113},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15359169244766235},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1527191698551178},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15073275566101074}],"concepts":[{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.9015074968338013},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.6294410228729248},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.5673292279243469},{"id":"https://openalex.org/C105066941","wikidata":"https://www.wikidata.org/wiki/Q1424524","display_name":"Shallow trench isolation","level":4,"score":0.5342544317245483},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5134781002998352},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4929652214050293},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4753539264202118},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.45964881777763367},{"id":"https://openalex.org/C2780980858","wikidata":"https://www.wikidata.org/wiki/Q110022","display_name":"Dual (grammatical number)","level":2,"score":0.4556177258491516},{"id":"https://openalex.org/C55020928","wikidata":"https://www.wikidata.org/wiki/Q3813865","display_name":"Image quality","level":3,"score":0.43694111704826355},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.27925634384155273},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2070780098438263},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.19208073616027832},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.17384573817253113},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15359169244766235},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1527191698551178},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15073275566101074},{"id":"https://openalex.org/C124952713","wikidata":"https://www.wikidata.org/wiki/Q8242","display_name":"Literature","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/vlsicircuits52068.2021.9492472","is_oa":false,"landing_page_url":"https://doi.org/10.23919/vlsicircuits52068.2021.9492472","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 Symposium on VLSI Circuits","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W4241254990"],"related_works":["https://openalex.org/W2349576212","https://openalex.org/W1981776476","https://openalex.org/W2352535872","https://openalex.org/W4286571729","https://openalex.org/W1590693222","https://openalex.org/W2382967348","https://openalex.org/W2944239605","https://openalex.org/W1873415836","https://openalex.org/W2334823507","https://openalex.org/W2107073676"],"abstract_inverted_index":{"We":[0],"developed":[1],"a":[2],"dual":[3,48,65,75],"pixel":[4,49,66,76],"with":[5,50],"accurate":[6,26],"and":[7,29,38,77],"all-directional":[8,59],"auto":[9],"focus":[10],"(AF)":[11],"performance":[12],"in":[13,33,73],"CMOS":[14],"image":[15,31,36],"sensor":[16],"(CIS).":[17],"The":[18],"optimized":[19],"in-pixel":[20,53],"deep":[21],"trench":[22],"isolation":[23],"(DTI)":[24],"provided":[25],"AF":[27,60],"data":[28],"good":[30],"quality":[32],"the":[34,45,51,56,63,82],"entire":[35],"area":[37],"over":[39],"whole":[40],"visible":[41],"wavelength":[42],"range.":[43],"Furthermore,":[44],"horizontal-vertical":[46],"(HV)":[47],"slanted":[52],"DTI":[54],"enabled":[55],"acquisition":[57],"of":[58],"information":[61],"by":[62],"conventional":[64],"readout":[67],"method.":[68],"These":[69],"technologies":[70],"were":[71],"demonstrated":[72],"1.4\u03bcm":[74],"will":[78],"be":[79],"applied":[80],"to":[81],"further":[83],"shrunken":[84],"pixels.":[85]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":1}],"updated_date":"2026-03-12T08:34:05.389933","created_date":"2025-10-10T00:00:00"}