{"id":"https://openalex.org/W4385688879","doi":"https://doi.org/10.23919/mixdes58562.2023.10203129","title":"Preliminary Characterization of An Electro-Thermal Converter","display_name":"Preliminary Characterization of An Electro-Thermal Converter","publication_year":2023,"publication_date":"2023-06-29","ids":{"openalex":"https://openalex.org/W4385688879","doi":"https://doi.org/10.23919/mixdes58562.2023.10203129"},"language":"en","primary_location":{"id":"doi:10.23919/mixdes58562.2023.10203129","is_oa":false,"landing_page_url":"https://doi.org/10.23919/mixdes58562.2023.10203129","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022178059","display_name":"Marcin Janicki","orcid":"https://orcid.org/0000-0002-7628-3858"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Marcin Janicki","raw_affiliation_strings":["&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland"],"affiliations":[{"raw_affiliation_string":"&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026728623","display_name":"Mariusz Jankowski","orcid":"https://orcid.org/0000-0002-6050-3975"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mariusz Jankowski","raw_affiliation_strings":["&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland"],"affiliations":[{"raw_affiliation_string":"&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078406102","display_name":"Micha\u0142 Szermer","orcid":"https://orcid.org/0000-0002-9294-701X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michal Szermer","raw_affiliation_strings":["&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland"],"affiliations":[{"raw_affiliation_string":"&#x0141;&#x00F3;d&#x017A; University of Technology,Department of Microelectronics and Computer Science,&#x0141;&#x00F3;d&#x017A;,Poland","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5022178059"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2009,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.48992215,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"160","last_page":"163"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12898","display_name":"Induction Heating and Inverter Technology","score":0.965499997138977,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.8136688470840454},{"id":"https://openalex.org/keywords/calibration","display_name":"Calibration","score":0.7641137838363647},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.7443987727165222},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.5175556540489197},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48935240507125854},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.475501149892807},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4635647237300873},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.35514694452285767},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24880090355873108},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2131112813949585},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09940904378890991},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09198099374771118}],"concepts":[{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.8136688470840454},{"id":"https://openalex.org/C165838908","wikidata":"https://www.wikidata.org/wiki/Q736777","display_name":"Calibration","level":2,"score":0.7641137838363647},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.7443987727165222},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.5175556540489197},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48935240507125854},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.475501149892807},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4635647237300873},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.35514694452285767},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24880090355873108},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2131112813949585},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09940904378890991},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09198099374771118},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/mixdes58562.2023.10203129","is_oa":false,"landing_page_url":"https://doi.org/10.23919/mixdes58562.2023.10203129","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7599999904632568,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2015063649","https://openalex.org/W2122837809","https://openalex.org/W2125240972","https://openalex.org/W2581188453"],"related_works":["https://openalex.org/W3107994849","https://openalex.org/W2165367082","https://openalex.org/W4247143848","https://openalex.org/W1972641423","https://openalex.org/W611446063","https://openalex.org/W2009883749","https://openalex.org/W2735573198","https://openalex.org/W29442446","https://openalex.org/W1996322406","https://openalex.org/W4206938017"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,6,22,26,29,42,45],"results":[4,39],"of":[5,9,28,31],"preliminary":[7],"characterization":[8],"an":[10,15],"electrothermal":[11],"converter":[12,43],"manufactured":[13],"as":[14,55],"ASIC":[16],"in":[17],"a":[18,34,56],"technology,":[19],"which":[20],"allows":[21],"fast":[23],"prototyping":[24],"and":[25,49],"verification":[27],"proof":[30],"concept":[32],"for":[33],"design.":[35],"The":[36],"presented":[37],"measurement":[38],"confirm":[40],"that":[41],"meets":[44],"expected":[46],"operating":[47],"characteristics":[48],"after":[50],"calibration":[51],"could":[52],"be":[53],"used":[54],"temperature":[57],"sensor.":[58]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
