{"id":"https://openalex.org/W7163518028","doi":"https://doi.org/10.23919/date69613.2026.11539491","title":"Efficient Warpage Simulation of Complex 2.5-D/3-D IC Structures with Novel Meshing Algorithm and Layerwise Plate Theory","display_name":"Efficient Warpage Simulation of Complex 2.5-D/3-D IC Structures with Novel Meshing Algorithm and Layerwise Plate Theory","publication_year":2026,"publication_date":"2026-04-20","ids":{"openalex":"https://openalex.org/W7163518028","doi":"https://doi.org/10.23919/date69613.2026.11539491"},"language":null,"primary_location":{"id":"doi:10.23919/date69613.2026.11539491","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539491","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation &amp;amp; Test in Europe Conference (DATE)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090214293","display_name":"Tianxiang Zhu","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianxiang Zhu","raw_affiliation_strings":["Peking University,School of Integrated Circuits,Beijing"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Peking University,School of Integrated Circuits,Beijing","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048356549","display_name":"Qipan Wang","orcid":"https://orcid.org/0000-0002-5155-1553"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qipan Wang","raw_affiliation_strings":["Peking University,School of Integrated Circuits,Beijing"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Peking University,School of Integrated Circuits,Beijing","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000933188","display_name":"Yibo Lin","orcid":"https://orcid.org/0000-0002-0977-2774"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yibo Lin","raw_affiliation_strings":["Peking University,School of Integrated Circuits,Beijing"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Peking University,School of Integrated Circuits,Beijing","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5137867563","display_name":"Runsheng Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Runsheng Wang","raw_affiliation_strings":["Peking University,School of Integrated Circuits,Beijing"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Peking University,School of Integrated Circuits,Beijing","institution_ids":["https://openalex.org/I20231570"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I20231570"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.3790000081062317,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.3790000081062317,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11263","display_name":"Electromagnetic Simulation and Numerical Methods","score":0.11810000240802765,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.07029999792575836,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.4239000082015991},{"id":"https://openalex.org/keywords/efficient-algorithm","display_name":"Efficient algorithm","score":0.26350000500679016},{"id":"https://openalex.org/keywords/signal-processing","display_name":"Signal processing","score":0.2433999925851822},{"id":"https://openalex.org/keywords/computer-simulation","display_name":"Computer simulation","score":0.241799995303154}],"concepts":[{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.5174000263214111},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4758000075817108},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4239000082015991},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.41040000319480896},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2865999937057495},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.27250000834465027},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.26460000872612},{"id":"https://openalex.org/C3018263672","wikidata":"https://www.wikidata.org/wiki/Q1296251","display_name":"Efficient algorithm","level":2,"score":0.26350000500679016},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.2433999925851822},{"id":"https://openalex.org/C500300565","wikidata":"https://www.wikidata.org/wiki/Q925667","display_name":"Computer simulation","level":2,"score":0.241799995303154}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date69613.2026.11539491","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539491","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation &amp;amp; Test in Europe Conference (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":37,"referenced_works":["https://openalex.org/W594157154","https://openalex.org/W1977959209","https://openalex.org/W1985231656","https://openalex.org/W2001032894","https://openalex.org/W2018763208","https://openalex.org/W2064047786","https://openalex.org/W2073521671","https://openalex.org/W2089639363","https://openalex.org/W2107979247","https://openalex.org/W2112311198","https://openalex.org/W2113320347","https://openalex.org/W2133500334","https://openalex.org/W2145379630","https://openalex.org/W2512385765","https://openalex.org/W2531282715","https://openalex.org/W2743413006","https://openalex.org/W2776103768","https://openalex.org/W2848797041","https://openalex.org/W2889004626","https://openalex.org/W2915929578","https://openalex.org/W2967365787","https://openalex.org/W2971295516","https://openalex.org/W3130373099","https://openalex.org/W4205433314","https://openalex.org/W4281481500","https://openalex.org/W4289774595","https://openalex.org/W4297097318","https://openalex.org/W4378083402","https://openalex.org/W4392682258","https://openalex.org/W4401879764","https://openalex.org/W4401880405","https://openalex.org/W4409282580","https://openalex.org/W4409282844","https://openalex.org/W4410583184","https://openalex.org/W4412965440","https://openalex.org/W4413122453","https://openalex.org/W4414198774"],"related_works":[],"abstract_inverted_index":{"Nowadays,":[0],"warpage":[1,20],"effect":[2],"is":[3,31,171],"becoming":[4],"one":[5],"of":[6,13,19,44,85,96,113,135,153],"the":[7,11,22,26,94,97,111,114,126,133,143,154,175,183,188],"main":[8],"concerns":[9],"in":[10,21,61,168],"manufacture":[12],"2.5-D/3-D":[14,38,91],"IC":[15,39],"packages.":[16],"Numerical":[17],"simulation":[18],"design":[23],"stage":[24],"by":[25],"finite":[27],"element":[28],"method":[29],"(FEM)":[30],"required":[32],"for":[33,67,82],"manufacturability":[34],"and":[35,52,70,132,149],"reliability":[36],"optimization.":[37],"packages":[40],"are":[41],"generally":[42],"composed":[43],"laminated":[45],"thin":[46],"plates":[47],"with":[48,117,159,174],"high":[49],"aspect":[50],"ratios":[51],"complex":[53,90],"in-plane":[54],"material":[55],"boundaries,":[56],"leading":[57],"to":[58,108,130,139,147,157,165,182],"intrinsic":[59],"difficulties":[60],"obtaining":[62],"high-quality":[63,71],"hexahedral":[64,87],"meshes":[65,88],"essential":[66],"fast":[68],"convergence":[69,112,151,169],"results.":[72],"In":[73],"this":[74],"paper,":[75],"we":[76,100],"propose":[77],"a":[78,102],"novel":[79],"meshing":[80,121,127],"algorithm":[81,122],"efficient":[83],"generation":[84],"sweep":[86,98],"towards":[89],"structures.":[92],"On":[93],"basis":[95],"mesh,":[99],"utilize":[101],"modified":[103],"2-D":[104,177],"layerwise":[105,178],"plate":[106,179],"theory":[107,180],"further":[109,172],"improve":[110,142],"solver.":[115],"Compared":[116],"Ansys":[118],"Workbench,":[119],"our":[120],"can":[123],"either":[124],"reduce":[125,150],"time":[128,152,170],"(74.7\u00d7":[129],"221\u00d7)":[131],"number":[134],"mesh":[136,144],"nodes":[137],"(5.26\u00d7":[138],"18.4\u00d7),":[140],"or":[141],"quality":[145],"(3.45\u00d7":[146],"9.75\u00d7)":[148],"solver":[155],"(1.48\u00d7":[156],"4.50\u00d7),":[158],"<":[160],"0.5%":[161],"errors.":[162],"A":[163],"3.75\u00d7":[164],"12.6\u00d7":[166],"reduction":[167],"achieved":[173],"proposed":[176],"compared":[181],"3-D":[184],"formulation,":[185],"while":[186],"maintaining":[187],"errors":[189],"within":[190],"3%.":[191]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2026-06-05T00:00:00"}