{"id":"https://openalex.org/W7163563412","doi":"https://doi.org/10.23919/date69613.2026.11539406","title":"Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center","display_name":"Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center","publication_year":2026,"publication_date":"2026-04-20","ids":{"openalex":"https://openalex.org/W7163563412","doi":"https://doi.org/10.23919/date69613.2026.11539406"},"language":null,"primary_location":{"id":"doi:10.23919/date69613.2026.11539406","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539406","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5059133190","display_name":"Hussam Amrouch","orcid":"https://orcid.org/0000-0002-5649-3102"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["Technical University of Munich,Chairs of AI Processor Design,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of AI Processor Design,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5137878960","display_name":"Jehaan Joseph","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jehaan Joseph","raw_affiliation_strings":["Technical University of Munich,Chairs of AI Processor Design,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of AI Processor Design,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102700199","display_name":"Michael Schirmer","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael Schirmer","raw_affiliation_strings":["Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048166222","display_name":"Johannes Geier","orcid":"https://orcid.org/0000-0002-9439-3890"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Johannes Geier","raw_affiliation_strings":["Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017567485","display_name":"Ulf Schlichtmann","orcid":"https://orcid.org/0000-0003-4431-7619"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ulf Schlichtmann","raw_affiliation_strings":["Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114693016","display_name":"Michael Meidinger","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael Meidinger","raw_affiliation_strings":["Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023825785","display_name":"Tobias Wild","orcid":"https://orcid.org/0009-0004-9922-6700"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thomas Wild","raw_affiliation_strings":["Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5137534408","display_name":"Andreas Herkersdorf","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Herkersdorf","raw_affiliation_strings":["Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114693022","display_name":"Jens N\u00f6pel","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jens N\u00f6pel","raw_affiliation_strings":["Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026512033","display_name":"Georg Sigl","orcid":"https://orcid.org/0000-0003-3152-941X"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Georg Sigl","raw_affiliation_strings":["Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114147475","display_name":"Yicheng Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Yicheng Zhang","raw_affiliation_strings":["Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068174103","display_name":"Carsten Trinitis","orcid":"https://orcid.org/0000-0002-6750-3652"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Carsten Trinitis","raw_affiliation_strings":["Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5137896343","display_name":"Aswathy Nedumpalli Sankaranarayanan","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Aswathy Nedumpalli Sankaranarayanan","raw_affiliation_strings":["Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5137823017","display_name":"Martin Schulz","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Schulz","raw_affiliation_strings":["Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5137901978","display_name":"Andreas Korb","orcid":null},"institutions":[{"id":"https://openalex.org/I4210136922","display_name":"Fraunhofer Institute for Applied and Integrated Security","ror":"https://ror.org/03w0bbr97","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210136922","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Korb","raw_affiliation_strings":["Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany","institution_ids":["https://openalex.org/I4210136922"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5137816663","display_name":"Konrad Hohentanner","orcid":"https://orcid.org/0000-0003-2283-6071"},"institutions":[{"id":"https://openalex.org/I4210136922","display_name":"Fraunhofer Institute for Applied and Integrated Security","ror":"https://ror.org/03w0bbr97","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210136922","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Konrad Hohentanner","raw_affiliation_strings":["Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany","institution_ids":["https://openalex.org/I4210136922"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":16,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.86494428,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.16060000658035278,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.16060000658035278,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13436","display_name":"Space Technology and Applications","score":0.04830000177025795,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.04619999974966049,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/center","display_name":"Center (category theory)","score":0.4869999885559082},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.33239999413490295},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.2797999978065491},{"id":"https://openalex.org/keywords/systems-design","display_name":"Systems design","score":0.24719999730587006}],"concepts":[{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.48910000920295715},{"id":"https://openalex.org/C2779463800","wikidata":"https://www.wikidata.org/wiki/Q5062222","display_name":"Center (category theory)","level":2,"score":0.4869999885559082},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3440000116825104},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.33239999413490295},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.32519999146461487},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3156000077724457},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.28119999170303345},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.2797999978065491},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.2791000008583069},{"id":"https://openalex.org/C31352089","wikidata":"https://www.wikidata.org/wiki/Q3750474","display_name":"Systems design","level":2,"score":0.24719999730587006}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date69613.2026.11539406","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539406","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6517451405525208}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322835","display_name":"Ministry of Economic Affairs","ror":"https://ror.org/042ge0913"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W2193145675","https://openalex.org/W2606722458","https://openalex.org/W2791673912","https://openalex.org/W2804032941","https://openalex.org/W2936567838","https://openalex.org/W2963114857","https://openalex.org/W2980104813","https://openalex.org/W3122286897","https://openalex.org/W3207932494","https://openalex.org/W3213528054","https://openalex.org/W3214349257","https://openalex.org/W4246166885","https://openalex.org/W4285167314","https://openalex.org/W4308084052","https://openalex.org/W4386763463","https://openalex.org/W4389491925","https://openalex.org/W4394798692","https://openalex.org/W4404848971","https://openalex.org/W4406983056","https://openalex.org/W4408151455","https://openalex.org/W4408860199","https://openalex.org/W4408894276","https://openalex.org/W4409076890","https://openalex.org/W4409473930"],"related_works":[],"abstract_inverted_index":{"Europe\u2019s":[0,17,144],"semiconductor":[1,21],"industry":[2],"relies":[3],"heavily":[4],"on":[5,45,97],"Asian":[6],"and":[7,39,48,58,80,143],"US":[8],"manufacturers.":[9],"The":[10,70,93,124],"EU":[11],"Chips":[12],"Act":[13],"seeks":[14],"to":[15,128,146],"strengthen":[16],"capabilities":[18],"across":[19],"the":[20,28,53],"value":[22],"chain.":[23],"Aligned":[24],"with":[25,42,101,114],"this":[26],"goal,":[27],"Bavarian":[29],"Chip":[30],"Design":[31],"Center":[32],"(BCDC)":[33],"supports":[34,90],"local":[35],"chip":[36,151],"design,":[37],"manufacturing,":[38],"talent":[40],"development,":[41],"a":[43,62,76,85,98,115,130,135],"focus":[44],"RISC-V":[46,78],"computing":[47],"heterogeneous":[49],"integration.":[50],"Within":[51],"BCDC,":[52],"Technical":[54],"University":[55],"of":[56,132],"Munich":[57],"Fraunhofer":[59],"are":[60,95],"developing":[61],"chiplet-based":[63],"architecture":[64],"optimized":[65],"for":[66,104,122,134],"low-power":[67],"edge":[68],"AI.":[69],"system":[71,139],"integrates":[72],"two":[73],"chiplets,":[74],"combining":[75],"security-enhanced":[77],"core":[79],"AI":[81],"accelerators,":[82],"connected":[83],"via":[84],"chiplet-optimized":[86],"serial":[87],"interface":[88],"that":[89,140],"encrypted":[91],"data.":[92],"chiplets":[94],"mounted":[96],"custom":[99],"interposer":[100],"low-capacitance":[102],"wires":[103],"efficient":[105],"data":[106],"transmission.":[107],"System-and":[108],"component-level":[109],"development":[110],"is":[111,127],"currently":[112],"ongoing,":[113],"tapeout":[116],"in":[117,149],"22":[118],"nm":[119],"FD-SOI":[120],"planned":[121],"2027.":[123],"overall":[125],"goal":[126],"deliver":[129],"proof":[131],"concept":[133],"small-scale":[136],"energy-efficient":[137],"chiplet":[138],"demonstrates":[141],"Bavaria\u2019s":[142],"capability":[145],"drive":[147],"innovation":[148],"novel":[150],"design":[152],"fields.":[153]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2026-06-05T00:00:00"}