{"id":"https://openalex.org/W7163568217","doi":"https://doi.org/10.23919/date69613.2026.11539319","title":"3D Integration of Hybrid IGZO/Si and IGZO eDRAMs for High-Density/High-Performance On-Chip Memory","display_name":"3D Integration of Hybrid IGZO/Si and IGZO eDRAMs for High-Density/High-Performance On-Chip Memory","publication_year":2026,"publication_date":"2026-04-20","ids":{"openalex":"https://openalex.org/W7163568217","doi":"https://doi.org/10.23919/date69613.2026.11539319"},"language":null,"primary_location":{"id":"doi:10.23919/date69613.2026.11539319","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539319","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072306970","display_name":"Munhyeon Kim","orcid":"https://orcid.org/0000-0003-0177-8933"},"institutions":[{"id":"https://openalex.org/I118373667","display_name":"Seoul National University of Science and Technology","ror":"https://ror.org/00chfja07","country_code":"KR","type":"education","lineage":["https://openalex.org/I118373667"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Munhyeon Kim","raw_affiliation_strings":["Seoul National University of Science and Technology,Department of Electrical and Information Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Seoul National University of Science and Technology,Department of Electrical and Information Engineering","institution_ids":["https://openalex.org/I118373667"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074184348","display_name":"Sukhyun Choi","orcid":"https://orcid.org/0000-0003-0081-2589"},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sukhyun Choi","raw_affiliation_strings":["Seoul National University,Department of Electrical and Computer Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Seoul National University,Department of Electrical and Computer Engineering","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012718779","display_name":"Yulhwa Kim","orcid":"https://orcid.org/0000-0003-3735-821X"},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yulhwa Kim","raw_affiliation_strings":["Sungkyunkwan University,Department of Semiconductor Systems Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sungkyunkwan University,Department of Semiconductor Systems Engineering","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5137832137","display_name":"Jae-Joon Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae-Joon Kim","raw_affiliation_strings":["Seoul National University,Department of Electrical and Computer Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Seoul National University,Department of Electrical and Computer Engineering","institution_ids":["https://openalex.org/I139264467"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.64153469,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.28610000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.28610000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.20010000467300415,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11315","display_name":"Phase-change materials and chalcogenides","score":0.12110000103712082,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.3158999979496002},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.2919999957084656},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.2409999966621399},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.2272000014781952}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.474700003862381},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3310000002384186},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.3158999979496002},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.2919999957084656},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.2590000033378601},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2502000033855438},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.2409999966621399},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23019999265670776},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.2272000014781952},{"id":"https://openalex.org/C2994168587","wikidata":"https://www.wikidata.org/wiki/Q5295","display_name":"Random access memory","level":2,"score":0.2184000015258789}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date69613.2026.11539319","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date69613.2026.11539319","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7373731732368469,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W2002293402","https://openalex.org/W2048266589","https://openalex.org/W2077874318","https://openalex.org/W2161091390","https://openalex.org/W2165473669","https://openalex.org/W2194775991","https://openalex.org/W2508602506","https://openalex.org/W2593872692","https://openalex.org/W2606722458","https://openalex.org/W2963122961","https://openalex.org/W2976137532","https://openalex.org/W3006600764","https://openalex.org/W3015391117","https://openalex.org/W3097528158","https://openalex.org/W3190062760","https://openalex.org/W4226115116","https://openalex.org/W4286571707","https://openalex.org/W4297097318","https://openalex.org/W4388183769","https://openalex.org/W4391594512","https://openalex.org/W4401881203","https://openalex.org/W4404133850"],"related_works":[],"abstract_inverted_index":{"The":[0,69],"growing":[1],"need":[2],"for":[3],"advanced":[4],"memory":[5,20,30,53,63,86,94,105,113],"architectures":[6,21,119],"leveraging":[7],"3D":[8,45],"integration":[9,80],"has":[10],"become":[11],"increasingly":[12],"critical":[13],"in":[14,103,121,124],"modern":[15],"computing":[16],"systems.":[17],"In":[18,39],"particular,":[19],"that":[22],"match":[23],"the":[24,91],"performance":[25],"of":[26,71,90,146,152],"static":[27],"random":[28,51],"access":[29,52],"(SRAM)":[31],"while":[32],"significantly":[33],"increasing":[34],"density":[35,64,106],"are":[36],"highly":[37],"impactful.":[38],"this":[40],"paper,":[41],"we":[42],"propose":[43],"a":[44,100,141,149],"integration-based":[46],"hybrid":[47],"InGaZnO(IGZO)/Si":[48],"embedded":[49],"dynamic":[50],"architecture":[54],"(Hybrid-3D)":[55],"and":[56,65,84,127,134,148],"circuit":[57],"design,":[58],"which":[59],"markedly":[60],"increases":[61],"on-chip":[62,104,112],"enhances":[66],"system":[67],"performance.":[68],"superiority":[70],"Hybrid-3D":[72,111],"is":[73],"demonstrated":[74],"through":[75],"rigorous":[76],"validation":[77],"involving":[78],"process":[79],"verification,":[81],"transistor-level":[82],"modeling,":[83],"circuit-level":[85],"design.":[87],"Detailed":[88],"evaluations":[89,131],"vertically":[92],"stacked":[93],"operation":[95],"confirm":[96],"stable":[97],"operations,":[98],"enabling":[99],"22\u00d7":[101],"increase":[102,151],"compared":[107],"to":[108],"SRAM.":[109],"Integrating":[110],"into":[114],"neural":[115],"processing":[116,128,137],"unit":[117],"(NPU)":[118],"results":[120],"substantial":[122],"improvements":[123],"energy":[125,143],"efficiency":[126,144],"speed.":[129],"System-level":[130],"across":[132],"vision":[133],"natural":[135],"language":[136],"(NLP)":[138],"tasks":[139],"reveal":[140],"maximum":[142],"improvement":[145],"3.2\u00d7":[147],"throughput":[150],"2.6\u00d7.":[153]},"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2026-06-05T00:00:00"}