{"id":"https://openalex.org/W4410583635","doi":"https://doi.org/10.23919/date64628.2025.10993133","title":"Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology","display_name":"Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology","publication_year":2025,"publication_date":"2025-03-31","ids":{"openalex":"https://openalex.org/W4410583635","doi":"https://doi.org/10.23919/date64628.2025.10993133"},"language":"en","primary_location":{"id":"doi:10.23919/date64628.2025.10993133","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date64628.2025.10993133","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100664841","display_name":"Yukai Chen","orcid":"https://orcid.org/0000-0003-3378-887X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"Yukai Chen","raw_affiliation_strings":["System Technology Co-Optimization Program, IMEC,Leuven,Belgium"],"affiliations":[{"raw_affiliation_string":"System Technology Co-Optimization Program, IMEC,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001442930","display_name":"Subrat Mishra","orcid":"https://orcid.org/0000-0002-1435-3275"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Subrat Mishra","raw_affiliation_strings":["System Technology Co-Optimization Program, IMEC,Leuven,Belgium"],"affiliations":[{"raw_affiliation_string":"System Technology Co-Optimization Program, IMEC,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103112055","display_name":"Julien Ryckaert","orcid":"https://orcid.org/0009-0001-0140-3042"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Julien Ryckaert","raw_affiliation_strings":["System Technology Co-Optimization Program, IMEC,Leuven,Belgium"],"affiliations":[{"raw_affiliation_string":"System Technology Co-Optimization Program, IMEC,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060076901","display_name":"Dwaipayan Biswas","orcid":"https://orcid.org/0000-0002-1087-3433"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Dwaipayan Biswas","raw_affiliation_strings":["System Technology Co-Optimization Program, IMEC,Leuven,Belgium"],"affiliations":[{"raw_affiliation_string":"System Technology Co-Optimization Program, IMEC,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109885448","display_name":"James Myers","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"James Myers","raw_affiliation_strings":["System Technology Co-Optimization Program, IMEC,Leuven,Belgium"],"affiliations":[{"raw_affiliation_string":"System Technology Co-Optimization Program, IMEC,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100664841"],"corresponding_institution_ids":["https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":0.7467,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.72379449,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9876999855041504,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9865999817848206,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nanosheet","display_name":"Nanosheet","score":0.8591132164001465},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6055471301078796},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5218809247016907},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4326307475566864},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35579872131347656},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.20674383640289307},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07637479901313782}],"concepts":[{"id":"https://openalex.org/C51967427","wikidata":"https://www.wikidata.org/wiki/Q17148232","display_name":"Nanosheet","level":2,"score":0.8591132164001465},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6055471301078796},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5218809247016907},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4326307475566864},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35579872131347656},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.20674383640289307},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07637479901313782},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date64628.2025.10993133","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date64628.2025.10993133","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Design, Automation & Test in Europe Conference (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.5400000214576721}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W3183264115","https://openalex.org/W4400034408","https://openalex.org/W4402835322","https://openalex.org/W6732342490"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W3119082211","https://openalex.org/W3091852196","https://openalex.org/W4400260568","https://openalex.org/W2084951691","https://openalex.org/W4388294765","https://openalex.org/W3206721946","https://openalex.org/W798086848"],"abstract_inverted_index":{"Digital":[0],"Low":[1],"Dropout":[2],"Regulators":[3],"(LDOs)":[4],"are":[5],"an":[6],"excellent":[7],"candidate":[8],"for":[9,50,70,158],"area-efficient":[10],"fine-grain":[11],"power":[12,19,23,53,160],"management":[13,54],"in":[14,31,77,166],"heterogeneous":[15],"systems,":[16],"leveraging":[17],"integrated":[18],"switches.":[20],"Relocating":[21],"the":[22,26,29,34,104,110,113,121,127,146,163,167],"switches":[24,161],"to":[25,92,109,118,162],"backside":[27,122,140,165],"of":[28,95,106,120,149],"wafer":[30,164],"conjunction":[32],"with":[33,84],"Backside":[35],"Power":[36],"Delivery":[37],"Network":[38],"(BSPDN)":[39],"layer":[40],"is":[41],"envisaged":[42],"as":[43],"a":[44,60,71,78,93],"System":[45],"Technology":[46],"Co-Optimization":[47],"(STCO)":[48],"booster":[49],"finer":[51],"grain":[52],"and":[55],"reduced":[56],"area/cost.":[57],"We":[58],"perform":[59],"detailed":[61],"thermal":[62,89,101,135,156],"analysis":[63],"using":[64],"power-switch-based":[65],"LDOs":[66,108],"enabling":[67],"per-core":[68],"DVFS":[69],"high-performance":[72],"server":[73],"3D":[74],"computing":[75],"chiplet":[76],"Nanosheet":[79],"CMOS":[80],"(A10)":[81],"technology":[82],"node":[83],"BSPDN.":[85],"While":[86],"BSPDN":[87],"introduces":[88],"penalties":[90],"due":[91],"lack":[94],"lateral":[96],"heat":[97],"spreading,":[98],"our":[99],"high-resolution":[100],"simulations":[102],"explore":[103],"feasibility":[105],"moving":[107],"backside.":[111],"Increasing":[112],"LDO":[114,141],"area":[115,124],"from":[116],"5%":[117],"50%":[119],"die":[123],"effectively":[125],"lowers":[126],"2.5/3D":[128],"System-in-Package":[129],"(SiP)":[130],"peak":[131],"temperature,":[132],"confirming":[133],"that":[134],"concerns":[136],"do":[137],"not":[138],"impede":[139],"integration.":[142],"This":[143],"study":[144],"supports":[145],"cost-effective":[147],"design":[148],"next-generation":[150],"SiPs":[151],"by":[152],"demonstrating":[153],"no":[154],"adverse":[155],"impact":[157],"relocating":[159],"nanosheet":[168],"era.":[169]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}