{"id":"https://openalex.org/W4221149205","doi":"https://doi.org/10.23919/date54114.2022.9774541","title":"Flodam: Cross-Layer Reliability Analysis Flow for Complex Hardware Designs","display_name":"Flodam: Cross-Layer Reliability Analysis Flow for Complex Hardware Designs","publication_year":2022,"publication_date":"2022-03-14","ids":{"openalex":"https://openalex.org/W4221149205","doi":"https://doi.org/10.23919/date54114.2022.9774541"},"language":"en","primary_location":{"id":"doi:10.23919/date54114.2022.9774541","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date54114.2022.9774541","pdf_url":null,"source":{"id":"https://openalex.org/S4363607924","display_name":"2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://hal.science/hal-03485386","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058810601","display_name":"Angeliki Kritikakou","orcid":"https://orcid.org/0000-0002-9293-469X"},"institutions":[{"id":"https://openalex.org/I1326498283","display_name":"Institut national de recherche en sciences et technologies du num\u00e9rique","ror":"https://ror.org/02kvxyf05","country_code":"FR","type":"government","lineage":["https://openalex.org/I1326498283"]},{"id":"https://openalex.org/I2802519937","display_name":"Institut de Recherche en Informatique et Syst\u00e8mes Al\u00e9atoires","ror":"https://ror.org/00myn0z94","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I205703379","https://openalex.org/I2802204017","https://openalex.org/I2802519937","https://openalex.org/I28221208","https://openalex.org/I4210127572","https://openalex.org/I4210159245","https://openalex.org/I56067802"]},{"id":"https://openalex.org/I56067802","display_name":"Universit\u00e9 de Rennes","ror":"https://ror.org/015m7wh34","country_code":"FR","type":"education","lineage":["https://openalex.org/I56067802"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Angeliki Kritikakou","raw_affiliation_strings":["Univ. Rennes, IRISA, Inria,France","Architectures mat\u00e9rielles sp\u00e9cialis\u00e9es pour l\u2019\u00e8re post loi-de-Moore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Univ. Rennes, IRISA, Inria,France","institution_ids":["https://openalex.org/I2802519937","https://openalex.org/I56067802","https://openalex.org/I1326498283"]},{"raw_affiliation_string":"Architectures mat\u00e9rielles sp\u00e9cialis\u00e9es pour l\u2019\u00e8re post loi-de-Moore","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012353019","display_name":"Olivier Sentieys","orcid":"https://orcid.org/0000-0003-4334-6418"},"institutions":[{"id":"https://openalex.org/I1326498283","display_name":"Institut national de recherche en sciences et technologies du num\u00e9rique","ror":"https://ror.org/02kvxyf05","country_code":"FR","type":"government","lineage":["https://openalex.org/I1326498283"]},{"id":"https://openalex.org/I2802519937","display_name":"Institut de Recherche en Informatique et Syst\u00e8mes Al\u00e9atoires","ror":"https://ror.org/00myn0z94","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I205703379","https://openalex.org/I2802204017","https://openalex.org/I2802519937","https://openalex.org/I28221208","https://openalex.org/I4210127572","https://openalex.org/I4210159245","https://openalex.org/I56067802"]},{"id":"https://openalex.org/I56067802","display_name":"Universit\u00e9 de Rennes","ror":"https://ror.org/015m7wh34","country_code":"FR","type":"education","lineage":["https://openalex.org/I56067802"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Olivier Sentieys","raw_affiliation_strings":["Univ. Rennes, IRISA, Inria,France","Architectures mat\u00e9rielles sp\u00e9cialis\u00e9es pour l\u2019\u00e8re post loi-de-Moore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Univ. Rennes, IRISA, Inria,France","institution_ids":["https://openalex.org/I2802519937","https://openalex.org/I56067802","https://openalex.org/I1326498283"]},{"raw_affiliation_string":"Architectures mat\u00e9rielles sp\u00e9cialis\u00e9es pour l\u2019\u00e8re post loi-de-Moore","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039968824","display_name":"G. Hubert","orcid":"https://orcid.org/0000-0002-3537-9642"},"institutions":[{"id":"https://openalex.org/I2801658355","display_name":"Office National d'\u00c9tudes et de Recherches A\u00e9rospatiales","ror":"https://ror.org/005y2ap84","country_code":"FR","type":"facility","lineage":["https://openalex.org/I2801658355"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Guillaume Hubert","raw_affiliation_strings":["ONERA,France","ONERA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ONERA,France","institution_ids":["https://openalex.org/I2801658355"]},{"raw_affiliation_string":"ONERA","institution_ids":["https://openalex.org/I2801658355"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015165635","display_name":"Youri Helen","orcid":"https://orcid.org/0009-0007-9223-7759"},"institutions":[{"id":"https://openalex.org/I95583923","display_name":"Direction G\u00e9n\u00e9rale de l'Armement","ror":"https://ror.org/04wsqd844","country_code":"FR","type":"funder","lineage":["https://openalex.org/I2799681489","https://openalex.org/I2802818602","https://openalex.org/I95583923"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Youri Helen","raw_affiliation_strings":["DGA,France","DGA Ma\u00eetrise de l'information"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DGA,France","institution_ids":["https://openalex.org/I95583923"]},{"raw_affiliation_string":"DGA Ma\u00eetrise de l'information","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045644548","display_name":"J.F. Coulon","orcid":null},"institutions":[{"id":"https://openalex.org/I4210126534","display_name":"Temis (France)","ror":"https://ror.org/02zc9ks44","country_code":"FR","type":"company","lineage":["https://openalex.org/I4210126534"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Jean-Francois Coulon","raw_affiliation_strings":["Temento,France","Temento Systems"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Temento,France","institution_ids":["https://openalex.org/I4210126534"]},{"raw_affiliation_string":"Temento Systems","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064804823","display_name":"Patrice Deroux-Dauphin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210126534","display_name":"Temis (France)","ror":"https://ror.org/02zc9ks44","country_code":"FR","type":"company","lineage":["https://openalex.org/I4210126534"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Patrice Deroux-Dauphin","raw_affiliation_strings":["Temento,France","Temento Systems"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Temento,France","institution_ids":["https://openalex.org/I4210126534"]},{"raw_affiliation_string":"Temento Systems","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.02050077,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"819","last_page":"824"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9851999878883362,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6746770739555359},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6566036343574524},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.651799738407135},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5970059633255005},{"id":"https://openalex.org/keywords/flow","display_name":"Flow (mathematics)","score":0.5507085919380188},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4790171980857849},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3982965052127838},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3960161805152893},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17328479886054993},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.10389113426208496}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6746770739555359},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6566036343574524},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.651799738407135},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5970059633255005},{"id":"https://openalex.org/C38349280","wikidata":"https://www.wikidata.org/wiki/Q1434290","display_name":"Flow (mathematics)","level":2,"score":0.5507085919380188},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4790171980857849},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3982965052127838},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3960161805152893},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17328479886054993},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.10389113426208496},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.23919/date54114.2022.9774541","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date54114.2022.9774541","pdf_url":null,"source":{"id":"https://openalex.org/S4363607924","display_name":"2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-03485386v1","is_oa":true,"landing_page_url":"https://hal.science/hal-03485386","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"DATE 2022 - 25th IEEE/ACM Design, Automation and Test in Europe, Mar 2022, Anvers, Belgium. pp.1-6, ⟨10.23919/DATE54114.2022.9774541⟩","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":{"id":"pmh:oai:HAL:hal-03485386v1","is_oa":true,"landing_page_url":"https://hal.science/hal-03485386","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"DATE 2022 - 25th IEEE/ACM Design, Automation and Test in Europe, Mar 2022, Anvers, Belgium. pp.1-6, ⟨10.23919/DATE54114.2022.9774541⟩","raw_type":"info:eu-repo/semantics/conferenceObject"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1935809293","https://openalex.org/W2052887509","https://openalex.org/W2053608561","https://openalex.org/W2072397237","https://openalex.org/W2138815251","https://openalex.org/W2148644350","https://openalex.org/W2152652532","https://openalex.org/W2167839483","https://openalex.org/W2346282901","https://openalex.org/W2884336760","https://openalex.org/W2900963375","https://openalex.org/W2904417098","https://openalex.org/W2997740413","https://openalex.org/W4246794227","https://openalex.org/W6758690791"],"related_works":["https://openalex.org/W2534143559","https://openalex.org/W2511789865","https://openalex.org/W2108827571","https://openalex.org/W1604320855","https://openalex.org/W2390491086","https://openalex.org/W2054406841","https://openalex.org/W2053991919","https://openalex.org/W2596660752","https://openalex.org/W1582820633","https://openalex.org/W2041031309"],"abstract_inverted_index":{"Modern":[0],"technologies":[1],"make":[2],"hardware":[3,49,68,129],"designs":[4],"more":[5,7],"and":[6,12,83,131],"sensitive":[8],"to":[9,58,106,111],"radiation":[10,44,85],"particles":[11],"related":[13],"faults.":[14],"As":[15],"a":[16,22,96,118],"result,":[17],"analysing":[18,42],"the":[19,33,43,47,59,80,84,89,102,107,113,124,127,132],"behavior":[20],"of":[21,32,79,91,115],"system":[23,34,60,64],"under":[24,117,134],"radiation-induced":[25,56],"faults":[26,116],"has":[27],"become":[28],"an":[29],"essential":[30],"part":[31],"design":[35,50,130],"process.":[36],"Existing":[37],"approaches":[38,93],"either":[39],"focus":[40],"on":[41,73],"impact":[45],"at":[46,66],"lower":[48],"layers,":[51,71],"without":[52],"further":[53],"propagating":[54],"any":[55],"fault":[57,74],"execution,":[61],"or":[62,69],"analyse":[63],"reliability":[65,99],"higher":[67],"application":[70,108,133],"based":[72],"models":[75],"that":[76],"are":[77],"agnostic":[78],"fabrication":[81],"technology":[82],"environment.":[86],"Flodam":[87],"combines":[88],"benefits":[90],"existing":[92],"by":[94],"providing":[95],"novel":[97],"cross-layer":[98],"analysis":[100],"from":[101],"semiconductor":[103],"layer":[104],"up":[105],"layer,":[109],"able":[110],"quantify":[112],"risks":[114],"given":[119],"context,":[120],"taking":[121],"into":[122],"account":[123],"environmental":[125],"conditions,":[126],"physical":[128],"study.":[135]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2022-04-03T00:00:00"}