{"id":"https://openalex.org/W2798864731","doi":"https://doi.org/10.23919/date.2018.8342115","title":"Low-cost high-accuracy variation characterization for nanoscale IC technologies via novel learning-based techniques","display_name":"Low-cost high-accuracy variation characterization for nanoscale IC technologies via novel learning-based techniques","publication_year":2018,"publication_date":"2018-03-01","ids":{"openalex":"https://openalex.org/W2798864731","doi":"https://doi.org/10.23919/date.2018.8342115","mag":"2798864731"},"language":"en","primary_location":{"id":"doi:10.23919/date.2018.8342115","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date.2018.8342115","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048205578","display_name":"Zhijian Pan","orcid":"https://orcid.org/0000-0001-9945-6478"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhijian Pan","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100339711","display_name":"Miao Li","orcid":"https://orcid.org/0000-0002-7293-748X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Miao Li","raw_affiliation_strings":["Platform Design Automation, Inc., Cameo Center, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Platform Design Automation, Inc., Cameo Center, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011274467","display_name":"Jian Yao","orcid":"https://orcid.org/0000-0002-9134-5084"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jian Yao","raw_affiliation_strings":["Platform Design Automation, Inc., Cameo Center, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Platform Design Automation, Inc., Cameo Center, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014469274","display_name":"Hong Lu","orcid":"https://orcid.org/0000-0003-3062-7763"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hong Lu","raw_affiliation_strings":["Platform Design Automation, Inc., Cameo Center, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Platform Design Automation, Inc., Cameo Center, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112436964","display_name":"Zuochang Ye","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zuochang Ye","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100653134","display_name":"Yan\u2010Feng Li","orcid":"https://orcid.org/0000-0002-9121-1465"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yanfeng Li","raw_affiliation_strings":["Platform Design Automation, Inc., Cameo Center, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Platform Design Automation, Inc., Cameo Center, Beijing, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100617593","display_name":"Yan Wang","orcid":"https://orcid.org/0000-0003-4851-6113"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yan Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"797","last_page":"802"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nanoscopic-scale","display_name":"Nanoscopic scale","score":0.6220270991325378},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.6106747388839722},{"id":"https://openalex.org/keywords/variation","display_name":"Variation (astronomy)","score":0.5791847109794617},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48094648122787476},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3571816086769104},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.34385666251182556}],"concepts":[{"id":"https://openalex.org/C45206210","wikidata":"https://www.wikidata.org/wiki/Q2415817","display_name":"Nanoscopic scale","level":2,"score":0.6220270991325378},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.6106747388839722},{"id":"https://openalex.org/C2778334786","wikidata":"https://www.wikidata.org/wiki/Q1586270","display_name":"Variation (astronomy)","level":2,"score":0.5791847109794617},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48094648122787476},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3571816086769104},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.34385666251182556},{"id":"https://openalex.org/C44870925","wikidata":"https://www.wikidata.org/wiki/Q37547","display_name":"Astrophysics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date.2018.8342115","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date.2018.8342115","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5199999809265137,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1967144205","https://openalex.org/W2063237963","https://openalex.org/W2067231861","https://openalex.org/W2067549952","https://openalex.org/W2098575607","https://openalex.org/W2127392734","https://openalex.org/W2137225583","https://openalex.org/W2140735333","https://openalex.org/W2149606298","https://openalex.org/W2151103935","https://openalex.org/W2342585796","https://openalex.org/W2565701092","https://openalex.org/W2610857016","https://openalex.org/W4234930748","https://openalex.org/W4247520101"],"related_works":["https://openalex.org/W2748601471","https://openalex.org/W2928590592","https://openalex.org/W2025646587","https://openalex.org/W3185091036","https://openalex.org/W3033634128","https://openalex.org/W2045897892","https://openalex.org/W2312231219","https://openalex.org/W2025817262","https://openalex.org/W2034405267","https://openalex.org/W2058092176"],"abstract_inverted_index":{"Faster":[0],"and":[1,84,111,119,162,183,187],"more":[2],"accurate":[3,182],"variation":[4,129,159,185],"characterizations":[5],"of":[6,53,80,178],"semiconductor":[7],"devices/circuits":[8],"are":[9,27,121],"in":[10],"great":[11],"demand":[12],"as":[13],"process":[14,59,109],"technologies":[15],"scale":[16],"down":[17],"to":[18,49,65,87,127,170],"Fin-FET":[19],"era.":[20],"Traditional":[21],"methods":[22,45],"with":[23,74,93,116,133,153],"intensive":[24],"data":[25,39,70,73,83,92,160],"testing":[26],"extremely":[28],"costly.":[29],"In":[30],"this":[31,100],"paper,":[32],"we":[33],"propose":[34],"a":[35,77,137],"novel":[36,102],"learning-based":[37],"high-accuracy":[38],"prediction":[40,161],"framework":[41,147,180],"inspired":[42],"by":[43,57],"learning":[44],"from":[46,76,136],"computer":[47],"vision":[48],"efficiently":[50],"characterize":[51],"variabilities":[52],"device/circuit":[54],"behaviors":[55],"induced":[56],"manufacturing":[58],"variations.":[60],"The":[61,142],"key":[62],"idea":[63],"is":[64],"adaptively":[66],"learn":[67],"the":[68,90,146,176,179],"underlying":[69],"pattern":[71],"among":[72],"variations":[75],"small":[78],"set":[79],"already":[81],"obtained":[82],"utilize":[85],"it":[86],"accurately":[88],"predict":[89],"unmeasured":[91],"minimum":[94],"physical":[95,172],"measurement":[96],"cost.":[97],"To":[98],"realize":[99],"idea,":[101],"regression":[103,110,115],"modeling":[104],"techniques":[105],"based":[106],"on":[107,154],"Gaussian":[108],"partial":[112],"least":[113],"squares":[114],"feature":[117],"extraction":[118,168],"matching":[120],"developed.":[122],"We":[123],"applied":[124],"our":[125],"approach":[126],"real-time":[128],"characterization":[130],"for":[131,158,166,181],"transistors":[132],"multiple":[134],"geometries":[135],"foundry":[138],"28nm":[139],"CMOS":[140],"process.":[141],"results":[143],"show":[144],"that":[145],"achieves":[148],"about":[149],"14x":[150],"time":[151],"speed-up":[152],"average":[155],"0.1%":[156],"error":[157,165],"under":[163],"0.3%":[164],"statistical":[167,188],"compared":[169],"traditional":[171],"measurements,":[173],"which":[174],"demonstrates":[175],"efficacy":[177],"fast":[184],"analysis":[186],"modeling.":[189]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}