{"id":"https://openalex.org/W2612022394","doi":"https://doi.org/10.23919/date.2017.7926986","title":"Recovery-aware proactive TSV repair for electromigration in 3D ICs","display_name":"Recovery-aware proactive TSV repair for electromigration in 3D ICs","publication_year":2017,"publication_date":"2017-03-01","ids":{"openalex":"https://openalex.org/W2612022394","doi":"https://doi.org/10.23919/date.2017.7926986","mag":"2612022394"},"language":"en","primary_location":{"id":"doi:10.23919/date.2017.7926986","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date.2017.7926986","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5045007303","display_name":"Shengcheng Wang","orcid":"https://orcid.org/0000-0001-6939-4552"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Shengcheng Wang","raw_affiliation_strings":["Chair of Dependable Nano Computing (CDNC), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany"],"affiliations":[{"raw_affiliation_string":"Chair of Dependable Nano Computing (CDNC), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023780872","display_name":"Hongyang Zhao","orcid":"https://orcid.org/0000-0003-3531-2955"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hongyang Zhao","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064445713","display_name":"Mehdi B. Tahoori","orcid":"https://orcid.org/0000-0002-8829-5610"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mehdi B. Tahoori","raw_affiliation_strings":["Chair of Dependable Nano Computing (CDNC), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany"],"affiliations":[{"raw_affiliation_string":"Chair of Dependable Nano Computing (CDNC), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5045007303"],"corresponding_institution_ids":["https://openalex.org/I102335020"],"apc_list":null,"apc_paid":null,"fwci":0.2867,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.57660148,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"32","issue":null,"first_page":"220","last_page":"225"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.8374110460281372},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.762662410736084},{"id":"https://openalex.org/keywords/operability","display_name":"Operability","score":0.72735196352005},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6591448783874512},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.562411904335022},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49321264028549194},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.432922899723053},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.4305822253227234},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.4151032865047455},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.34606462717056274},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22565898299217224},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1261286437511444}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.8374110460281372},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.762662410736084},{"id":"https://openalex.org/C126231374","wikidata":"https://www.wikidata.org/wiki/Q1061298","display_name":"Operability","level":2,"score":0.72735196352005},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6591448783874512},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.562411904335022},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49321264028549194},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.432922899723053},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.4305822253227234},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.4151032865047455},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34606462717056274},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22565898299217224},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1261286437511444},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/date.2017.7926986","is_oa":false,"landing_page_url":"https://doi.org/10.23919/date.2017.7926986","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1517687623","https://openalex.org/W1757458251","https://openalex.org/W1965451131","https://openalex.org/W1978465272","https://openalex.org/W1987638749","https://openalex.org/W2002967711","https://openalex.org/W2005613478","https://openalex.org/W2023264348","https://openalex.org/W2029040443","https://openalex.org/W2037677325","https://openalex.org/W2061141647","https://openalex.org/W2062899780","https://openalex.org/W2068262032","https://openalex.org/W2086481541","https://openalex.org/W2093127878","https://openalex.org/W2124414146","https://openalex.org/W2126339718","https://openalex.org/W2151734895","https://openalex.org/W2151755625","https://openalex.org/W2204848021","https://openalex.org/W2295208369","https://openalex.org/W2481508967","https://openalex.org/W2538462262","https://openalex.org/W3147058567","https://openalex.org/W4231938743","https://openalex.org/W4255435342","https://openalex.org/W6665823828"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W2169154812","https://openalex.org/W2318525917","https://openalex.org/W2108703634","https://openalex.org/W2086910809","https://openalex.org/W1984394007","https://openalex.org/W3094065812"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"becomes":[2],"a":[3,16,25,32],"major":[4],"reliability":[5,64,108],"concern":[6],"in":[7,24,35,68,110],"three-dimensional":[8],"integrated-circuits":[9],"(3D":[10],"ICs).":[11],"To":[12],"mitigate":[13],"this":[14,50,83],"problem,":[15],"typical":[17],"solution":[18],"is":[19,71],"to":[20,59,74,78,96,119,122],"use":[21],"TSV":[22,66,115],"redundancy":[23,70],"reactive":[26,125],"manner,":[27],"maintaining":[28],"the":[29,36,61,100,113,123],"operability":[30],"of":[31,38,65,112],"3D":[33,97],"chip":[34],"presence":[37],"EM":[39,85],"failures":[40],"by":[41,90,117],"detecting":[42],"and":[43],"replacing":[44],"faulty":[45],"TSVs":[46,77],"with":[47,127],"spares.":[48],"In":[49,82],"work,":[51],"we":[52],"explore":[53],"an":[54],"alternative,":[55],"more":[56],"preferred":[57],"approach":[58,104],"enhance":[60],"EM-related":[62,106],"lifetime":[63,107],"grid,":[67],"which":[69],"used":[72],"proactively":[73],"allow":[75],"non-faulty":[76],"be":[79,88],"temporarily":[80],"deactivated.":[81],"way,":[84],"wear-out":[86],"can":[87],"reversed":[89],"exploiting":[91],"its":[92],"recovery":[93],"property.":[94],"Applied":[95],"benchmark":[98],"designs,":[99],"recovery-aware":[101],"proactive":[102],"repair":[103],"increases":[105],"(measured":[109],"mean-time-to-failure)":[111],"entire":[114],"grid":[116],"up":[118],"12X":[120],"relative":[121],"conventional":[124],"method,":[126],"less":[128],"area":[129],"overhead.":[130]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}