{"id":"https://openalex.org/W1916055304","doi":"https://doi.org/10.20965/ijat.2015.p0573","title":"Investigation into Chemical Mechanical Polishing Mechanism of Hard-to-Process Materials Using a Commercially Available Single-Sided Polisher","display_name":"Investigation into Chemical Mechanical Polishing Mechanism of Hard-to-Process Materials Using a Commercially Available Single-Sided Polisher","publication_year":2015,"publication_date":"2015-09-05","ids":{"openalex":"https://openalex.org/W1916055304","doi":"https://doi.org/10.20965/ijat.2015.p0573","mag":"1916055304"},"language":"en","primary_location":{"id":"doi:10.20965/ijat.2015.p0573","is_oa":true,"landing_page_url":"https://doi.org/10.20965/ijat.2015.p0573","pdf_url":null,"source":{"id":"https://openalex.org/S2764525154","display_name":"International Journal of Automation Technology","issn_l":"1881-7629","issn":["1881-7629","1883-8022"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4324309662","host_organization_name":"Fuji Technology Press Ltd.","host_organization_lineage":["https://openalex.org/P4324309662"],"host_organization_lineage_names":["Fuji Technology Press Ltd."],"type":"journal"},"license":"cc-by-nd","license_id":"https://openalex.org/licenses/cc-by-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Automation Technology","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://doi.org/10.20965/ijat.2015.p0573","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028757196","display_name":"Michio Uneda","orcid":"https://orcid.org/0000-0002-5621-0109"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michio Uneda","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087024078","display_name":"Keiichi Takano","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Keiichi Takano","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005618785","display_name":"Koji Koyama","orcid":"https://orcid.org/0000-0002-4074-1650"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Koji Koyama","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058889471","display_name":"Hideo Aida","orcid":"https://orcid.org/0000-0002-6593-9575"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hideo Aida","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5065575216","display_name":"Ken-Ichi Ishikawa","orcid":"https://orcid.org/0000-0001-6425-1894"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ken-ichi Ishikawa","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.9096,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.74052859,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"9","issue":"5","first_page":"573","last_page":"579"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.9021780490875244},{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.8196445107460022},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7426022291183472},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6776517033576965},{"id":"https://openalex.org/keywords/sapphire","display_name":"Sapphire","score":0.6103915572166443},{"id":"https://openalex.org/keywords/acceleration","display_name":"Acceleration","score":0.49787187576293945},{"id":"https://openalex.org/keywords/slurry","display_name":"Slurry","score":0.4427153170108795},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.42515113949775696},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.3322966694831848},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.328561007976532},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.17635098099708557},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15715399384498596},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08433488011360168}],"concepts":[{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.9021780490875244},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.8196445107460022},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7426022291183472},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6776517033576965},{"id":"https://openalex.org/C2780064504","wikidata":"https://www.wikidata.org/wiki/Q127583","display_name":"Sapphire","level":3,"score":0.6103915572166443},{"id":"https://openalex.org/C117896860","wikidata":"https://www.wikidata.org/wiki/Q11376","display_name":"Acceleration","level":2,"score":0.49787187576293945},{"id":"https://openalex.org/C94293008","wikidata":"https://www.wikidata.org/wiki/Q23925154","display_name":"Slurry","level":2,"score":0.4427153170108795},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.42515113949775696},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3322966694831848},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.328561007976532},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.17635098099708557},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15715399384498596},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08433488011360168},{"id":"https://openalex.org/C74650414","wikidata":"https://www.wikidata.org/wiki/Q11397","display_name":"Classical mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.20965/ijat.2015.p0573","is_oa":true,"landing_page_url":"https://doi.org/10.20965/ijat.2015.p0573","pdf_url":null,"source":{"id":"https://openalex.org/S2764525154","display_name":"International Journal of Automation Technology","issn_l":"1881-7629","issn":["1881-7629","1883-8022"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4324309662","host_organization_name":"Fuji Technology Press Ltd.","host_organization_lineage":["https://openalex.org/P4324309662"],"host_organization_lineage_names":["Fuji Technology Press Ltd."],"type":"journal"},"license":"cc-by-nd","license_id":"https://openalex.org/licenses/cc-by-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Automation Technology","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.20965/ijat.2015.p0573","is_oa":true,"landing_page_url":"https://doi.org/10.20965/ijat.2015.p0573","pdf_url":null,"source":{"id":"https://openalex.org/S2764525154","display_name":"International Journal of Automation Technology","issn_l":"1881-7629","issn":["1881-7629","1883-8022"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4324309662","host_organization_name":"Fuji Technology Press Ltd.","host_organization_lineage":["https://openalex.org/P4324309662"],"host_organization_lineage_names":["Fuji Technology Press Ltd."],"type":"journal"},"license":"cc-by-nd","license_id":"https://openalex.org/licenses/cc-by-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Automation Technology","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2004774327","https://openalex.org/W2031080691","https://openalex.org/W2046456942","https://openalex.org/W2051096277","https://openalex.org/W2065368112","https://openalex.org/W2073704332","https://openalex.org/W2077243211","https://openalex.org/W2086483556","https://openalex.org/W2108387096","https://openalex.org/W2117300599","https://openalex.org/W2132350042","https://openalex.org/W2570627358","https://openalex.org/W3015626697"],"related_works":["https://openalex.org/W2292866930","https://openalex.org/W4220862069","https://openalex.org/W2361080674","https://openalex.org/W2358991049","https://openalex.org/W2106409363","https://openalex.org/W2383844114","https://openalex.org/W1979080655","https://openalex.org/W3086529909","https://openalex.org/W2762493025","https://openalex.org/W2440599411"],"abstract_inverted_index":{"Chemical":[0],"mechanical":[1],"polishing":[2,43,60,81,117],"(CMP)":[3],"is":[4,26,37,68],"one":[5],"of":[6,40,73,94,122,134],"the":[7,41,51,58,64,71,78,86,91,95,101,132,138,154,165],"most":[8],"important":[9],"processes":[10],"for":[11,19,54,119],"fabricating":[12],"highly":[13],"planarized":[14],"substrates":[15],"such":[16],"as":[17,28,70],"sapphire":[18,25],"light":[20],"emitting":[21],"diodes":[22],"(LEDs).":[23],"However,":[24],"categorized":[27],"a":[29,33,120,126,144,149],"hard-to-process":[30,55],"material;":[31],"therefore,":[32],"long":[34],"processing":[35],"time":[36],"required":[38],"because":[39],"low":[42],"efficiency":[44],"(i.e.,":[45],"removal":[46,139,166],"rate).":[47],"This":[48],"study":[49],"investigates":[50],"CMP":[52,84],"mechanism":[53],"materials":[56],"using":[57,125],"following":[59],"evaluation":[61],"parameters:":[62],"(1)":[63],"velocity":[65,76,96,155],"ratio,":[66],"which":[67],"defined":[69],"ratio":[72,97,156],"slurry":[74],"flow":[75],"between":[77],"wafer":[79],"and":[80,99,115,157],"pad":[82,87],"during":[83,105],"to":[85],"tangential":[88],"velocity,":[89],"(2)":[90],"standard":[92],"deviation":[93],"distribution,":[98],"(3)":[100],"polisher":[102,158],"vibration":[103,159],"acceleration":[104,160],"CMP.":[106],"Each":[107],"parameter":[108,136],"was":[109,141],"measured":[110],"at":[111],"five":[112],"rotational":[113],"speeds":[114],"two":[116],"pressures":[118],"total":[121],"ten":[123],"conditions":[124],"commercially":[127],"available":[128],"single-sided":[129],"polisher.":[130],"Moreover,":[131],"influence":[133],"each":[135],"on":[137],"rate":[140],"demonstrated":[142],"via":[143],"multiple":[145],"correlation":[146],"analysis.":[147],"As":[148],"result,":[150],"we":[151],"revealed":[152],"that":[153],"are":[161],"strongly":[162],"related":[163],"with":[164],"rate.":[167]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}