{"id":"https://openalex.org/W4414193327","doi":"https://doi.org/10.1587/transele.2025ecp5009","title":"Signal Integrity Study of a Panel Level Package Based on Simulation-Measurement Correlations","display_name":"Signal Integrity Study of a Panel Level Package Based on Simulation-Measurement Correlations","publication_year":2025,"publication_date":"2025-09-15","ids":{"openalex":"https://openalex.org/W4414193327","doi":"https://doi.org/10.1587/transele.2025ecp5009"},"language":"en","primary_location":{"id":"doi:10.1587/transele.2025ecp5009","is_oa":true,"landing_page_url":"https://doi.org/10.1587/transele.2025ecp5009","pdf_url":"https://www.jstage.jst.go.jp/article/transele/advpub/0/advpub_2025ECP5009/_pdf","source":{"id":"https://openalex.org/S2489501747","display_name":"IEICE Transactions on Electronics","issn_l":"0916-8524","issn":["0916-8524","1745-1353"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Transactions on Electronics","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://www.jstage.jst.go.jp/article/transele/advpub/0/advpub_2025ECP5009/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006567298","display_name":"Sangkyu KIM","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147194","display_name":"Convergence","ror":"https://ror.org/03kcznq08","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210147194"]},{"id":"https://openalex.org/I94588446","display_name":"Hongik University","ror":"https://ror.org/00egdv862","country_code":"KR","type":"education","lineage":["https://openalex.org/I94588446"]}],"countries":["KR","US"],"is_corresponding":true,"raw_author_name":"Sangkyu KIM","raw_affiliation_strings":["Electrical and Electronic Convergence Department, Hongik University"],"affiliations":[{"raw_affiliation_string":"Electrical and Electronic Convergence Department, Hongik University","institution_ids":["https://openalex.org/I4210147194","https://openalex.org/I94588446"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5006567298"],"corresponding_institution_ids":["https://openalex.org/I4210147194","https://openalex.org/I94588446"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.25382373,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"E109.C","issue":"3","first_page":"84","last_page":"92"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9678000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9678000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.95660001039505,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.925599992275238,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.9291999936103821},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5940999984741211},{"id":"https://openalex.org/keywords/reflectometry","display_name":"Reflectometry","score":0.5925999879837036},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.5849999785423279},{"id":"https://openalex.org/keywords/transmission-line","display_name":"Transmission line","score":0.5666000247001648},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.5475999712944031},{"id":"https://openalex.org/keywords/power-integrity","display_name":"Power integrity","score":0.41339999437332153},{"id":"https://openalex.org/keywords/time-domain","display_name":"Time domain","score":0.41190001368522644},{"id":"https://openalex.org/keywords/return-loss","display_name":"Return loss","score":0.3917999863624573},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.3862999975681305}],"concepts":[{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.9291999936103821},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5940999984741211},{"id":"https://openalex.org/C2778925768","wikidata":"https://www.wikidata.org/wiki/Q3454718","display_name":"Reflectometry","level":3,"score":0.5925999879837036},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.5849999785423279},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5849000215530396},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.5666000247001648},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.5475999712944031},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46320000290870667},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.41339999437332153},{"id":"https://openalex.org/C103824480","wikidata":"https://www.wikidata.org/wiki/Q185889","display_name":"Time domain","level":2,"score":0.41190001368522644},{"id":"https://openalex.org/C196901423","wikidata":"https://www.wikidata.org/wiki/Q3933836","display_name":"Return loss","level":3,"score":0.3917999863624573},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.3862999975681305},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.3815000057220459},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.364300012588501},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.36039999127388},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.34290000796318054},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.34049999713897705},{"id":"https://openalex.org/C195266298","wikidata":"https://www.wikidata.org/wiki/Q2165620","display_name":"Scattering parameters","level":2,"score":0.34040001034736633},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.3352000117301941},{"id":"https://openalex.org/C19118579","wikidata":"https://www.wikidata.org/wiki/Q786423","display_name":"Frequency domain","level":2,"score":0.32120001316070557},{"id":"https://openalex.org/C75291252","wikidata":"https://www.wikidata.org/wiki/Q1315756","display_name":"TRACE (psycholinguistics)","level":2,"score":0.31150001287460327},{"id":"https://openalex.org/C198352243","wikidata":"https://www.wikidata.org/wiki/Q37105","display_name":"Line (geometry)","level":2,"score":0.30820000171661377},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.29429998993873596},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.29159998893737793},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.29109999537467957},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.29089999198913574},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28519999980926514},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.27549999952316284},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.26840001344680786},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.26420000195503235},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25940001010894775},{"id":"https://openalex.org/C202311505","wikidata":"https://www.wikidata.org/wiki/Q1474701","display_name":"Radio propagation","level":2,"score":0.2567000091075897},{"id":"https://openalex.org/C184880428","wikidata":"https://www.wikidata.org/wiki/Q1417308","display_name":"Finite-difference time-domain method","level":2,"score":0.2542000114917755},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.2540000081062317},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.25130000710487366}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/transele.2025ecp5009","is_oa":true,"landing_page_url":"https://doi.org/10.1587/transele.2025ecp5009","pdf_url":"https://www.jstage.jst.go.jp/article/transele/advpub/0/advpub_2025ECP5009/_pdf","source":{"id":"https://openalex.org/S2489501747","display_name":"IEICE Transactions on Electronics","issn_l":"0916-8524","issn":["0916-8524","1745-1353"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Transactions on Electronics","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/transele.2025ecp5009","is_oa":true,"landing_page_url":"https://doi.org/10.1587/transele.2025ecp5009","pdf_url":"https://www.jstage.jst.go.jp/article/transele/advpub/0/advpub_2025ECP5009/_pdf","source":{"id":"https://openalex.org/S2489501747","display_name":"IEICE Transactions on Electronics","issn_l":"0916-8524","issn":["0916-8524","1745-1353"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Transactions on Electronics","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4414193327.pdf","grobid_xml":"https://content.openalex.org/works/W4414193327.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"studied":[4],"on":[5,87],"the":[6,16,49,54,58,61,83,88,99,119,123,133,138,143,146,150,161],"signal":[7,80,120,139,147],"integrity":[8,81,121,148],"of":[9,30,60,71,82,98,122,137,149],"a":[10,25],"novel":[11],"2.3D":[12],"package":[13,19,85,163],"platform,":[14],"called":[15],"panel":[17],"level":[18],"(PLP)":[20],"interposer":[21,101,125,152],"system.":[22,102],"We":[23,103],"adopted":[24],"simple":[26],"model":[27,44,51,116],"which":[28],"consists":[29],"two":[31],"dimensional":[32],"transmission":[33],"line":[34],"models":[35],"and":[36,41,57,74,111,141,167],"fitted":[37],"parasitic":[38,112,144],"self/mutual":[39],"inductances":[40],"capacitances.":[42],"Our":[43],"is":[45,94],"then":[46],"correlated":[47],"with":[48,96],"S-parameter":[50],"extracted":[52],"from":[53],"real":[55],"design":[56],"measurement":[59],"fabricated":[62],"sample.":[63],"The":[64,79],"results":[65],"show":[66],"strong":[67],"correlation":[68],"in":[69,114,172],"terms":[70],"return":[72],"loss":[73,109],"time":[75],"domain":[76],"reflectometry":[77],"(TDR).":[78],"conventional":[84,129,162],"based":[86],"Ajinomoto":[89],"build-up":[90],"film":[91],"(ABF)":[92],"substrate":[93],"compared":[95,127],"that":[97],"PLP":[100,124,151],"varied":[104],"parameters":[105],"including":[106],"trace":[107,140],"geometry,":[108],"tangent,":[110],"capacitance":[113],"our":[115],"to":[117,128,157,160,165],"improve":[118],"system":[126,153],"package.":[130],"By":[131],"increasing":[132],"cross":[134],"sectional":[135],"area":[136],"decreasing":[142],"capacitances,":[145],"can":[154,168],"be":[155,158,169],"enhanced":[156],"comparable":[159],"up":[164],"20GHz,":[166],"even":[170],"better":[171],"higher":[173],"frequency":[174],"ranges.":[175]},"counts_by_year":[],"updated_date":"2026-03-10T16:38:18.471706","created_date":"2025-10-10T00:00:00"}