{"id":"https://openalex.org/W4415163782","doi":"https://doi.org/10.1587/elex.22.20250514","title":"Enhanced high-selectivity miniaturized bandpass filter using stacked glass-based IPD technology","display_name":"Enhanced high-selectivity miniaturized bandpass filter using stacked glass-based IPD technology","publication_year":2025,"publication_date":"2025-10-14","ids":{"openalex":"https://openalex.org/W4415163782","doi":"https://doi.org/10.1587/elex.22.20250514"},"language":"en","primary_location":{"id":"doi:10.1587/elex.22.20250514","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.22.20250514","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_22.20250514/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_22.20250514/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5104729982","display_name":"Wenjuan Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenjuan Wu","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017434144","display_name":"Shiwei Huang","orcid":"https://orcid.org/0000-0001-9663-3256"},"institutions":[{"id":"https://openalex.org/I75867142","display_name":"Xiamen University of Technology","ror":"https://ror.org/01285e189","country_code":"CN","type":"education","lineage":["https://openalex.org/I75867142"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shiwei Huang","raw_affiliation_strings":["Xiamen Sky Semiconductor Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xiamen Sky Semiconductor Technology Co., Ltd","institution_ids":["https://openalex.org/I75867142"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100391490","display_name":"Dong Wei","orcid":"https://orcid.org/0000-0002-6342-4658"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dong Wei","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101637153","display_name":"Shuang Liu","orcid":"https://orcid.org/0000-0003-2103-7200"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shuang Liu","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100395778","display_name":"Junjie Wang","orcid":"https://orcid.org/0000-0001-7183-422X"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junjie Wang","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014317773","display_name":"Yihe Liu","orcid":"https://orcid.org/0000-0002-8011-6972"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210160974","display_name":"Hebei Semiconductor Research Institute","ror":"https://ror.org/050777m95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210160974"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yihe Liu","raw_affiliation_strings":["Hebei Semiconductor Research Institute","School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hebei Semiconductor Research Institute","institution_ids":["https://openalex.org/I4210160974"]},{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015237857","display_name":"Hao Hu","orcid":"https://orcid.org/0000-0002-6831-8352"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hao Hu","raw_affiliation_strings":["School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102290478","display_name":"Wenbiao Ruan","orcid":null},"institutions":[{"id":"https://openalex.org/I75867142","display_name":"Xiamen University of Technology","ror":"https://ror.org/01285e189","country_code":"CN","type":"education","lineage":["https://openalex.org/I75867142"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenbiao Ruan","raw_affiliation_strings":["Xiamen Sky Semiconductor Technology Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xiamen Sky Semiconductor Technology Co., Ltd","institution_ids":["https://openalex.org/I75867142"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100605751","display_name":"Yang Liu","orcid":"https://orcid.org/0000-0001-9849-478X"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210160974","display_name":"Hebei Semiconductor Research Institute","ror":"https://ror.org/050777m95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210160974"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Liu","raw_affiliation_strings":["Hebei Semiconductor Research Institute","School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hebei Semiconductor Research Institute","institution_ids":["https://openalex.org/I4210160974"]},{"raw_affiliation_string":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China","institution_ids":["https://openalex.org/I150229711"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.24002944,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"22","issue":"23","first_page":"20250514","last_page":"20250514"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9794999957084656,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9794999957084656,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.8450999855995178},{"id":"https://openalex.org/keywords/band-pass-filter","display_name":"Band-pass filter","score":0.7777000069618225},{"id":"https://openalex.org/keywords/footprint","display_name":"Footprint","score":0.6280999779701233},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.6240000128746033},{"id":"https://openalex.org/keywords/chebyshev-filter","display_name":"Chebyshev filter","score":0.6096000075340271},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5246000289916992},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.44119998812675476},{"id":"https://openalex.org/keywords/diplexer","display_name":"Diplexer","score":0.42480000853538513}],"concepts":[{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.8450999855995178},{"id":"https://openalex.org/C147788027","wikidata":"https://www.wikidata.org/wiki/Q2718101","display_name":"Band-pass filter","level":2,"score":0.7777000069618225},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.6280999779701233},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.6240000128746033},{"id":"https://openalex.org/C21424316","wikidata":"https://www.wikidata.org/wiki/Q718621","display_name":"Chebyshev filter","level":2,"score":0.6096000075340271},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5791000127792358},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5246000289916992},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49950000643730164},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.44119998812675476},{"id":"https://openalex.org/C81774821","wikidata":"https://www.wikidata.org/wiki/Q1227176","display_name":"Diplexer","level":2,"score":0.42480000853538513},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.4171999990940094},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37380000948905945},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3650999963283539},{"id":"https://openalex.org/C2776096036","wikidata":"https://www.wikidata.org/wiki/Q1140483","display_name":"Narrowband","level":2,"score":0.34310001134872437},{"id":"https://openalex.org/C97256817","wikidata":"https://www.wikidata.org/wiki/Q1462316","display_name":"Spurious relationship","level":2,"score":0.3239000141620636},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3215999901294708},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.29319998621940613},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.29269999265670776},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2904999852180481},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.2897999882698059},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2777999937534332},{"id":"https://openalex.org/C196901423","wikidata":"https://www.wikidata.org/wiki/Q3933836","display_name":"Return loss","level":3,"score":0.2709999978542328},{"id":"https://openalex.org/C207467116","wikidata":"https://www.wikidata.org/wiki/Q4385666","display_name":"Inverse","level":2,"score":0.25850000977516174},{"id":"https://openalex.org/C2781089630","wikidata":"https://www.wikidata.org/wiki/Q21856745","display_name":"Realization (probability)","level":2,"score":0.2581999897956848},{"id":"https://openalex.org/C26441681","wikidata":"https://www.wikidata.org/wiki/Q5358359","display_name":"Electronic filter topology","level":5,"score":0.2500999867916107}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.22.20250514","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.22.20250514","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_22.20250514/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.22.20250514","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.22.20250514","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_22.20250514/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4415163782.pdf","grobid_xml":"https://content.openalex.org/works/W4415163782.grobid-xml"},"referenced_works_count":33,"referenced_works":["https://openalex.org/W2009481284","https://openalex.org/W2035458072","https://openalex.org/W2563404461","https://openalex.org/W2619197483","https://openalex.org/W2743509207","https://openalex.org/W2765818948","https://openalex.org/W2800190355","https://openalex.org/W2807924033","https://openalex.org/W2809409773","https://openalex.org/W2886413298","https://openalex.org/W2942338549","https://openalex.org/W2970278071","https://openalex.org/W2999916095","https://openalex.org/W3048118817","https://openalex.org/W3195999345","https://openalex.org/W3209084242","https://openalex.org/W4237121725","https://openalex.org/W4285211539","https://openalex.org/W4285214794","https://openalex.org/W4312863396","https://openalex.org/W4317382134","https://openalex.org/W4323644317","https://openalex.org/W4376467223","https://openalex.org/W4386921442","https://openalex.org/W4394712812","https://openalex.org/W4399881545","https://openalex.org/W4401113611","https://openalex.org/W4402743603","https://openalex.org/W4403124012","https://openalex.org/W4403421249","https://openalex.org/W4403633588","https://openalex.org/W4406982846","https://openalex.org/W4410341849"],"related_works":[],"abstract_inverted_index":{"This":[0,99],"paper":[1],"presents":[2],"a":[3,16,30,51,66,74,84,102],"fifth-order":[4],"inverse":[5],"Chebyshev":[6],"bandpass":[7],"filter":[8],"(BPF)":[9],"operating":[10],"at":[11],"600-840":[12],"MHz,":[13],"realized":[14,95],"using":[15],"stacked":[17,32],"glass-based":[18],"Integrated":[19],"Passive":[20],"Device":[21],"(IPD)":[22],"technology":[23],"featuring":[24],"Through-Glass-Vias":[25],"(TGVs).":[26],"The":[27,56],"architecture":[28],"employs":[29],"vertically":[31],"topology":[33],"that":[34],"enables":[35],"the":[36,114],"independent":[37],"optimization":[38],"of":[39,64,71,78,87,116],"3D":[40],"TGV":[41],"inductors":[42],"and":[43,73,89,126],"Metal-Insulator-Metal":[44],"(MIM)":[45],"capacitors,":[46],"which":[47],"are":[48],"integrated":[49],"via":[50],"high-precision":[52],"chip-to-wafer":[53],"bonding":[54],"process.":[55],"fabricated":[57],"BPF":[58],"achieves":[59],"an":[60],"exceptionally":[61],"compact":[62],"footprint":[63],"0.012\u03bb0\u00d70.008\u03bb0,":[65],"sharp":[67],"shape":[68],"factor":[69],"(SF)":[70],"2.62,":[72],"low":[75],"insertion":[76],"loss":[77],"1.26":[79],"dB.":[80],"These":[81],"results":[82],"represent":[83],"superior":[85],"combination":[86],"miniaturization":[88],"selectivity":[90],"compared":[91],"to":[92],"other":[93],"filters":[94],"on":[96,110],"competing":[97],"substrates.":[98],"work":[100],"demonstrates":[101],"scalable":[103],"methodology":[104],"for":[105],"co-integrating":[106],"high-performance":[107],"passive":[108],"components":[109],"glass":[111],"interposers,":[112],"advancing":[113],"development":[115],"2.5D/3D":[117],"ultra-high-density":[118],"heterogeneous":[119],"systems":[120],"by":[121],"significantly":[122],"enhancing":[123],"integration":[124],"density":[125],"RF":[127],"performance.":[128]},"counts_by_year":[],"updated_date":"2026-03-08T06:56:09.383167","created_date":"2025-10-15T00:00:00"}