{"id":"https://openalex.org/W4401859201","doi":"https://doi.org/10.1587/elex.21.20240442","title":"Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips","display_name":"Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips","publication_year":2024,"publication_date":"2024-08-25","ids":{"openalex":"https://openalex.org/W4401859201","doi":"https://doi.org/10.1587/elex.21.20240442"},"language":"en","primary_location":{"id":"doi:10.1587/elex.21.20240442","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.21.20240442","pdf_url":null,"source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://doi.org/10.1587/elex.21.20240442","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100685540","display_name":"Rui Hu","orcid":"https://orcid.org/0009-0003-5480-9251"},"institutions":[{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Rui Hu","raw_affiliation_strings":["Department of Electronics Science, Guizhou University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055773491","display_name":"Mengru Huang","orcid":"https://orcid.org/0009-0000-4909-9097"},"institutions":[{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mengru Huang","raw_affiliation_strings":["Department of Electronics Science, Guizhou University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101337832","display_name":"Linhong Lu","orcid":null},"institutions":[{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Linhong Lu","raw_affiliation_strings":["Department of Electronics Science, Guizhou University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100534616","display_name":"Fashun Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139699","display_name":"Micro & Nano Research Institute","ror":"https://ror.org/03y1kax64","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210139699"]},{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fashun Yang","raw_affiliation_strings":["Department of Electronics Science, Guizhou University","Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]},{"raw_affiliation_string":"Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","institution_ids":["https://openalex.org/I4210139699"]},{"raw_affiliation_string":"Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100540028","display_name":"Jiexin Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139699","display_name":"Micro & Nano Research Institute","ror":"https://ror.org/03y1kax64","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210139699"]},{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiexin Lin","raw_affiliation_strings":["Department of Electronics Science, Guizhou University","Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]},{"raw_affiliation_string":"Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","institution_ids":["https://openalex.org/I4210139699"]},{"raw_affiliation_string":"Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101596889","display_name":"Kui Ma","orcid":"https://orcid.org/0000-0002-6207-7965"},"institutions":[{"id":"https://openalex.org/I4210139699","display_name":"Micro & Nano Research Institute","ror":"https://ror.org/03y1kax64","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210139699"]},{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kui Ma","raw_affiliation_strings":["Department of Electronics Science, Guizhou University","Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]},{"raw_affiliation_string":"Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","institution_ids":["https://openalex.org/I4210139699"]},{"raw_affiliation_string":"Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5026119706","display_name":"Zhao Ding","orcid":"https://orcid.org/0000-0003-1794-0392"},"institutions":[{"id":"https://openalex.org/I4210139699","display_name":"Micro & Nano Research Institute","ror":"https://ror.org/03y1kax64","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210139699"]},{"id":"https://openalex.org/I178232147","display_name":"Guizhou University","ror":"https://ror.org/02wmsc916","country_code":"CN","type":"education","lineage":["https://openalex.org/I178232147"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhao Ding","raw_affiliation_strings":["Department of Electronics Science, Guizhou University","Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Science, Guizhou University","institution_ids":["https://openalex.org/I178232147"]},{"raw_affiliation_string":"Guizhou Provincial Key Lab for Micro-Nano-Electronics and Software","institution_ids":["https://openalex.org/I4210139699"]},{"raw_affiliation_string":"Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5100685540"],"corresponding_institution_ids":["https://openalex.org/I178232147"],"apc_list":null,"apc_paid":null,"fwci":0.3818,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.60014313,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":98},"biblio":{"volume":"21","issue":"19","first_page":"20240442","last_page":"20240442"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.991599977016449,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.708789050579071},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.6506762504577637},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6039464473724365},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5308436155319214},{"id":"https://openalex.org/keywords/top-down-and-bottom-up-design","display_name":"Top-down and bottom-up design","score":0.42209678888320923},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.36609452962875366},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2053273618221283},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19628280401229858},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08079010248184204}],"concepts":[{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.708789050579071},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.6506762504577637},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6039464473724365},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5308436155319214},{"id":"https://openalex.org/C135798126","wikidata":"https://www.wikidata.org/wiki/Q2167279","display_name":"Top-down and bottom-up design","level":2,"score":0.42209678888320923},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.36609452962875366},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2053273618221283},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19628280401229858},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08079010248184204},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.21.20240442","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.21.20240442","pdf_url":null,"source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.21.20240442","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.21.20240442","pdf_url":null,"source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7099999785423279,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1926811926","https://openalex.org/W1993238276","https://openalex.org/W2022397498","https://openalex.org/W2036396224","https://openalex.org/W2066194009","https://openalex.org/W2069756028","https://openalex.org/W2073328422","https://openalex.org/W2077395645","https://openalex.org/W2083963493","https://openalex.org/W2100471067","https://openalex.org/W2151734895","https://openalex.org/W2171907321","https://openalex.org/W2209212170","https://openalex.org/W2339457127","https://openalex.org/W2783268447","https://openalex.org/W2911869662","https://openalex.org/W2943797293","https://openalex.org/W2982596635","https://openalex.org/W2985244621","https://openalex.org/W3000212629","https://openalex.org/W3081295191","https://openalex.org/W3117514197","https://openalex.org/W3177692890","https://openalex.org/W4239706042","https://openalex.org/W4294982425","https://openalex.org/W4383162808","https://openalex.org/W4385062230","https://openalex.org/W4385626743","https://openalex.org/W4399621287","https://openalex.org/W4400033920"],"related_works":["https://openalex.org/W2347486132","https://openalex.org/W2316789606","https://openalex.org/W2350340797","https://openalex.org/W4293224283","https://openalex.org/W2950501077","https://openalex.org/W2368601041","https://openalex.org/W2079984045","https://openalex.org/W2582182843","https://openalex.org/W2066200948","https://openalex.org/W2140614965"],"abstract_inverted_index":{"Three-dimensional":[0],"(3D)":[1],"integration":[2],"based":[3],"on":[4],"through":[5],"silicon":[6],"via":[7],"(TSV)":[8],"is":[9,72,85,119,139],"one":[10],"of":[11,35,69,79,113,132,135,144,150],"the":[12,17,33,82,90,99,107,111,127,136,148,159],"most":[13],"promising":[14],"technologies":[15],"in":[16,28,66,74,81,89],"post-Moore":[18],"Era.":[19],"However,":[20],"increased":[21],"power":[22,41,70],"density":[23],"will":[24],"cause":[25],"great":[26],"challenge":[27],"heat":[29,59,101,133,155],"dissipation":[30,60,102,156],"and":[31,122],"affect":[32],"reliability":[34],"3D":[36,40],"integrated":[37,42],"systems,":[38],"especially":[39],"systems.":[43],"Except":[44],"for":[45,158],"signal":[46],"connections,":[47],"TSV":[48],"can":[49,124],"also":[50],"be":[51],"used":[52],"as":[53],"thermal":[54],"conduction":[55],"pathway.":[56],"An":[57],"embedded":[58,100],"structure":[61,103,109,138],"with":[62,98,104,110],"different":[63,67],"size":[64],"TSVs":[65,80,114],"layers":[68],"chips":[71],"proposed":[73,108,137,160],"this":[75],"paper.":[76],"The":[77,130],"radius":[78,112],"lower":[83],"dies":[84],"larger":[86],"than":[87,142],"that":[88,143],"upper":[91],"dies.":[92],"Numerical":[93],"investigation":[94],"indicates":[95],"that,":[96],"compared":[97],"uniform":[105],"TSV,":[106],"from":[115],"top":[116],"to":[117],"bottom":[118],"11\u00b5m,":[120],"20\u00b5m,":[121],"23\u00b5m,":[123],"significantly":[125],"improve":[126],"cooling":[128],"capability.":[129],"volume":[131],"sink":[134],"much":[140],"smaller":[141],"two-dimensional":[145],"structure.":[146,161],"Increasing":[147],"number":[149],"internal":[151],"fins":[152],"has":[153],"improved":[154],"effect":[157]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1}],"updated_date":"2026-05-24T08:33:08.758527","created_date":"2025-10-10T00:00:00"}