{"id":"https://openalex.org/W4394793077","doi":"https://doi.org/10.1587/elex.21.20240208","title":"Effect of annealing residual stress on mobility of TSV vertical switch","display_name":"Effect of annealing residual stress on mobility of TSV vertical switch","publication_year":2024,"publication_date":"2024-04-14","ids":{"openalex":"https://openalex.org/W4394793077","doi":"https://doi.org/10.1587/elex.21.20240208"},"language":"en","primary_location":{"id":"doi:10.1587/elex.21.20240208","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1587/elex.21.20240208","pdf_url":"https://www.jstage.jst.go.jp/article/elex/21/10/21_21.20240208/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/21/10/21_21.20240208/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038846309","display_name":"Fengjuan Wang","orcid":"https://orcid.org/0000-0001-9331-7936"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengjuan Wang","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology","School of Automation and Information Engineering, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"School of Automation and Information Engineering, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113177405","display_name":"Jiashuo Ren","orcid":null},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiashuo Ren","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology","School of Automation and Information Engineering, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"School of Automation and Information Engineering, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029610013","display_name":"Xiangkun Yin","orcid":"https://orcid.org/0000-0003-2318-1257"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiangkun Yin","raw_affiliation_strings":["School of Microelectronics, Xidian University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108858013","display_name":"Ningmei Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ningmei Yu","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology","School of Automation and Information Engineering, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"School of Automation and Information Engineering, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5119032638","display_name":"Yuan Yang","orcid":"https://orcid.org/0009-0004-0117-9396"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Yang","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology","School of Automation and Information Engineering, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"School of Automation and Information Engineering, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101414145","display_name":"Kai Jing","orcid":"https://orcid.org/0000-0001-9471-6904"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Jing","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology","School of Automation and Information Engineering, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"School of Automation and Information Engineering, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100340567","display_name":"Qian Li","orcid":"https://orcid.org/0000-0002-1486-9773"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qian Li","raw_affiliation_strings":["Department of Applied Physics, Xi\u2019an University of Technology","Department of Applied Physics, Xi'an University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Applied Physics, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]},{"raw_affiliation_string":"Department of Applied Physics, Xi'an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.03100588,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"21","issue":"10","first_page":"20240208","last_page":"20240208"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6851556897163391},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.6481262445449829},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6360769867897034},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.633542001247406},{"id":"https://openalex.org/keywords/equilateral-triangle","display_name":"Equilateral triangle","score":0.6329836845397949},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.572932779788971},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.5389497876167297},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5203796625137329},{"id":"https://openalex.org/keywords/internal-stress","display_name":"Internal stress","score":0.4333633482456207},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.3913707435131073},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3256208896636963},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2571275532245636},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20143157243728638},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.18556666374206543},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.06954628229141235}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6851556897163391},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.6481262445449829},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6360769867897034},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.633542001247406},{"id":"https://openalex.org/C146786541","wikidata":"https://www.wikidata.org/wiki/Q157002","display_name":"Equilateral triangle","level":2,"score":0.6329836845397949},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.572932779788971},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.5389497876167297},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5203796625137329},{"id":"https://openalex.org/C2988361403","wikidata":"https://www.wikidata.org/wiki/Q206175","display_name":"Internal stress","level":2,"score":0.4333633482456207},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.3913707435131073},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3256208896636963},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2571275532245636},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20143157243728638},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.18556666374206543},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.06954628229141235},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.21.20240208","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1587/elex.21.20240208","pdf_url":"https://www.jstage.jst.go.jp/article/elex/21/10/21_21.20240208/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.21.20240208","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1587/elex.21.20240208","pdf_url":"https://www.jstage.jst.go.jp/article/elex/21/10/21_21.20240208/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G229384173","display_name":null,"funder_award_id":"2022YFB4401303","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4058546187","display_name":null,"funder_award_id":"62004160","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4670297199","display_name":null,"funder_award_id":"2022YFB4401303","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G5118577759","display_name":null,"funder_award_id":"2021TD-25","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7576675433","display_name":null,"funder_award_id":"2023-YBGY-118","funder_id":"https://openalex.org/F4320336350","funder_display_name":"Key Research and Development Projects of Shaanxi Province"},{"id":"https://openalex.org/G7763854156","display_name":null,"funder_award_id":"62174134","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7990631665","display_name":null,"funder_award_id":"62274133","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8517776753","display_name":null,"funder_award_id":"92364101","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320325627","display_name":"Education Department of Shaanxi Province","ror":null},{"id":"https://openalex.org/F4320335467","display_name":"Natural Science Foundation of Shaanxi Provincial Department of Education","ror":null},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null},{"id":"https://openalex.org/F4320336350","display_name":"Key Research and Development Projects of Shaanxi Province","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4394793077.pdf","grobid_xml":"https://content.openalex.org/works/W4394793077.grobid-xml"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W2004049202","https://openalex.org/W2061079473","https://openalex.org/W2067143020","https://openalex.org/W2083134391","https://openalex.org/W2107868198","https://openalex.org/W2306784149","https://openalex.org/W2598585298","https://openalex.org/W2741571441","https://openalex.org/W2756929416","https://openalex.org/W2781479423","https://openalex.org/W2785913568","https://openalex.org/W2887510060","https://openalex.org/W2896181676","https://openalex.org/W2903102426","https://openalex.org/W2927488006","https://openalex.org/W2930442772","https://openalex.org/W2954423143","https://openalex.org/W2956376512","https://openalex.org/W2998616947","https://openalex.org/W3005782011","https://openalex.org/W3134028237","https://openalex.org/W3140564856","https://openalex.org/W3161233762","https://openalex.org/W3210736540","https://openalex.org/W3211017996","https://openalex.org/W4290715745","https://openalex.org/W4293371112","https://openalex.org/W4297786955","https://openalex.org/W4312802436","https://openalex.org/W4367721884"],"related_works":["https://openalex.org/W3204326392","https://openalex.org/W3006458160","https://openalex.org/W372151222","https://openalex.org/W3102230940","https://openalex.org/W3161792707","https://openalex.org/W4251973223","https://openalex.org/W2066707154","https://openalex.org/W2086778274","https://openalex.org/W2780411548","https://openalex.org/W2508087100"],"abstract_inverted_index":{"The":[0,35],"effect":[1,45,62],"of":[2,14,49,63],"internal":[3],"radial":[4],"stress":[5,64],"generated":[6],"during":[7],"the":[8,12,39,43,47,50,55,60,66],"annealing":[9],"process":[10],"on":[11,46],"mobility":[13,48],"through-silicon":[15],"via":[16],"(TSV)":[17],"vertical":[18,52],"switch":[19],"are":[20],"analyzed":[21],"in":[22],"detail,":[23],"by":[24],"employing":[25],"finite":[26],"element":[27],"software":[28],"ANSYS":[29],"and":[30],"orthogonal":[31],"experimental":[32],"design":[33],"method.":[34],"results":[36],"show":[37],"that,":[38],"TSV":[40,51],"diameter":[41],"has":[42],"largest":[44],"switch,":[53],"while":[54],"equilateral":[56],"triangle":[57],"array":[58],"produces":[59],"smallest":[61],"at":[65],"same":[67],"distance.":[68]},"counts_by_year":[],"updated_date":"2026-03-11T06:11:40.159057","created_date":"2025-10-10T00:00:00"}