{"id":"https://openalex.org/W4385256913","doi":"https://doi.org/10.1587/elex.20.20230275","title":"Bond wires aging monitoring for IGBT module based on junction temperature difference of TSEPs","display_name":"Bond wires aging monitoring for IGBT module based on junction temperature difference of TSEPs","publication_year":2023,"publication_date":"2023-07-25","ids":{"openalex":"https://openalex.org/W4385256913","doi":"https://doi.org/10.1587/elex.20.20230275"},"language":"en","primary_location":{"id":"doi:10.1587/elex.20.20230275","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230275","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_20.20230275/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_20.20230275/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100343748","display_name":"Yulin Liu","orcid":"https://orcid.org/0000-0002-3687-2682"},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yulin Liu","raw_affiliation_strings":["Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin University of Technology","Tianjin University of Technology, Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin University of Technology","institution_ids":["https://openalex.org/I136765683"]},{"raw_affiliation_string":"Tianjin University of Technology, Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058775997","display_name":"Mingxing Du","orcid":"https://orcid.org/0000-0003-3107-0995"},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mingxing Du","raw_affiliation_strings":["Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin University of Technology","Tianjin University of Technology, Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin University of Technology","institution_ids":["https://openalex.org/I136765683"]},{"raw_affiliation_string":"Tianjin University of Technology, Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044584262","display_name":"Jinliang Yin","orcid":null},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinliang Yin","raw_affiliation_strings":["School of Electrical Engineering and Automation, Tianjin University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering and Automation, Tianjin University of Technology","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030750885","display_name":"Chaoyang Dong","orcid":"https://orcid.org/0000-0002-8587-7877"},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chao Dong","raw_affiliation_strings":["School of Electrical Engineering and Automation, Tianjin University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering and Automation, Tianjin University of Technology","institution_ids":["https://openalex.org/I136765683"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I136765683"],"apc_list":null,"apc_paid":null,"fwci":0.9291,"has_fulltext":true,"cited_by_count":8,"citation_normalized_percentile":{"value":0.74130602,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":98},"biblio":{"volume":"20","issue":"21","first_page":"20230275","last_page":"20230275"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insulated-gate-bipolar-transistor","display_name":"Insulated-gate bipolar transistor","score":0.8958318829536438},{"id":"https://openalex.org/keywords/junction-temperature","display_name":"Junction temperature","score":0.856671929359436},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7042616605758667},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5338398814201355},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.513381838798523},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.485689252614975},{"id":"https://openalex.org/keywords/correctness","display_name":"Correctness","score":0.48422741889953613},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"Temperature gradient","score":0.4494403004646301},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4414105713367462},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.4352869987487793},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38418155908584595},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.35714900493621826},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3307339549064636},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.22800606489181519},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.1959320604801178},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11073970794677734},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0831632912158966},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.0759742259979248}],"concepts":[{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.8958318829536438},{"id":"https://openalex.org/C167781694","wikidata":"https://www.wikidata.org/wiki/Q6311800","display_name":"Junction temperature","level":3,"score":0.856671929359436},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7042616605758667},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5338398814201355},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.513381838798523},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.485689252614975},{"id":"https://openalex.org/C55439883","wikidata":"https://www.wikidata.org/wiki/Q360812","display_name":"Correctness","level":2,"score":0.48422741889953613},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.4494403004646301},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4414105713367462},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4352869987487793},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38418155908584595},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.35714900493621826},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3307339549064636},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.22800606489181519},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1959320604801178},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11073970794677734},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0831632912158966},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0759742259979248},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.20.20230275","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230275","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_20.20230275/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.20.20230275","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230275","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_20.20230275/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.4300000071525574}],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":false},"content_urls":{"pdf":"https://content.openalex.org/works/W4385256913.pdf"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W267840210","https://openalex.org/W1973857030","https://openalex.org/W1981115875","https://openalex.org/W1982599175","https://openalex.org/W2091204867","https://openalex.org/W2150763729","https://openalex.org/W2167320299","https://openalex.org/W2367906240","https://openalex.org/W2464895101","https://openalex.org/W2537460656","https://openalex.org/W2546726487","https://openalex.org/W2588164626","https://openalex.org/W2752201979","https://openalex.org/W2794508159","https://openalex.org/W2806610791","https://openalex.org/W2887207409","https://openalex.org/W2891535831","https://openalex.org/W2948198020","https://openalex.org/W2950438813","https://openalex.org/W3019333861","https://openalex.org/W3037949166","https://openalex.org/W3039135076","https://openalex.org/W3040565717","https://openalex.org/W3102866083","https://openalex.org/W3117395369","https://openalex.org/W3120346419","https://openalex.org/W3133952230","https://openalex.org/W3136851200","https://openalex.org/W3216047609","https://openalex.org/W4205182622"],"related_works":["https://openalex.org/W2941586664","https://openalex.org/W2026438159","https://openalex.org/W2952153532","https://openalex.org/W3211169310","https://openalex.org/W4285161724","https://openalex.org/W2973352049","https://openalex.org/W2894661039","https://openalex.org/W2995312372","https://openalex.org/W2587344013","https://openalex.org/W1500340802"],"abstract_inverted_index":{"In":[0],"this":[1,71],"paper,":[2],"we":[3],"propose":[4],"to":[5,29,73],"use":[6],"the":[7,26,31,34,38,44,49,56,75,78,85,90,93],"junction":[8,22],"temperature":[9,47,51,57],"difference":[10,58,86],"estimated":[11],"by":[12,60,84,98],"two":[13,62],"temperature-sensitive":[14],"electric":[15],"parameters":[16],"(TSEPs),":[17],"threshold":[18],"voltage,":[19],"and":[20,48,89],"p-n":[21],"forward":[23],"voltage":[24],"of":[25,33,77,81,92,106],"IGBT":[27,82,101],"module":[28],"monitor":[30,74],"aging":[32,76],"bond":[35,39],"wires.":[36],"When":[37],"wires":[40,80],"are":[41],"lifted":[42],"off,":[43],"chip":[45],"surface":[46],"overall":[50],"gradient":[52],"will":[53],"increase,":[54],"making":[55],"measured":[59],"these":[61],"TSEPs":[63],"larger.":[64],"A":[65],"new":[66],"method":[67,95],"is":[68,96],"proposed":[69,94],"in":[70],"paper":[72],"bonding":[79,107],"modules":[83,102],"between":[87],"them,":[88],"correctness":[91],"verified":[97],"experiments":[99],"on":[100],"with":[103],"different":[104],"degrees":[105],"wire":[108],"aging.":[109]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3}],"updated_date":"2026-01-20T17:24:06.736184","created_date":"2025-10-10T00:00:00"}