{"id":"https://openalex.org/W4321353963","doi":"https://doi.org/10.1587/elex.20.20230011","title":"Electronic component placement optimization for heat measures of smartglasses","display_name":"Electronic component placement optimization for heat measures of smartglasses","publication_year":2023,"publication_date":"2023-02-19","ids":{"openalex":"https://openalex.org/W4321353963","doi":"https://doi.org/10.1587/elex.20.20230011"},"language":"en","primary_location":{"id":"doi:10.1587/elex.20.20230011","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230011","pdf_url":"https://www.jstage.jst.go.jp/article/elex/20/6/20_20.20230011/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/20/6/20_20.20230011/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036941888","display_name":"Kyosuke Kusumi","orcid":null},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Kyosuke Kusumi","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009587783","display_name":"Koutaro Hachiya","orcid":"https://orcid.org/0000-0002-2736-4002"},"institutions":[{"id":"https://openalex.org/I131632401","display_name":"Teikyo Heisei University","ror":"https://ror.org/034zkkc78","country_code":"JP","type":"education","lineage":["https://openalex.org/I131632401"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koutaro Hachiya","raw_affiliation_strings":["Graduate Program in Environmental Information Science, Teikyo Heisei University"],"affiliations":[{"raw_affiliation_string":"Graduate Program in Environmental Information Science, Teikyo Heisei University","institution_ids":["https://openalex.org/I131632401"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022305090","display_name":"Ryotaro Kudo","orcid":null},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ryotaro Kudo","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067005883","display_name":"Toshiki Kanamoto","orcid":"https://orcid.org/0000-0002-6326-6960"},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Toshiki Kanamoto","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108528404","display_name":"Atsushi Kurokawa","orcid":null},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Atsushi Kurokawa","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5036941888"],"corresponding_institution_ids":["https://openalex.org/I146516829"],"apc_list":null,"apc_paid":null,"fwci":0.2678,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.50589947,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"20","issue":"6","first_page":"20230011","last_page":"20230011"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11975","display_name":"Evolutionary Algorithms and Applications","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10848","display_name":"Advanced Multi-Objective Optimization Algorithms","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/sorting","display_name":"Sorting","score":0.7980401515960693},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.7329220175743103},{"id":"https://openalex.org/keywords/genetic-algorithm","display_name":"Genetic algorithm","score":0.682783842086792},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.6651888489723206},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.6176506876945496},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.586006760597229},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.564230740070343},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5233437418937683},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5187563896179199},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.4467742443084717},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23476552963256836},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22257933020591736},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.22011905908584595}],"concepts":[{"id":"https://openalex.org/C111696304","wikidata":"https://www.wikidata.org/wiki/Q2303697","display_name":"Sorting","level":2,"score":0.7980401515960693},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.7329220175743103},{"id":"https://openalex.org/C8880873","wikidata":"https://www.wikidata.org/wiki/Q187787","display_name":"Genetic algorithm","level":2,"score":0.682783842086792},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.6651888489723206},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.6176506876945496},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.586006760597229},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.564230740070343},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5233437418937683},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5187563896179199},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4467742443084717},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23476552963256836},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22257933020591736},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.22011905908584595},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.20.20230011","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230011","pdf_url":"https://www.jstage.jst.go.jp/article/elex/20/6/20_20.20230011/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.20.20230011","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.20.20230011","pdf_url":"https://www.jstage.jst.go.jp/article/elex/20/6/20_20.20230011/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.4699999988079071,"display_name":"Affordable and clean energy"},{"id":"https://metadata.un.org/sdg/11","score":0.46000000834465027,"display_name":"Sustainable cities and communities"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4321353963.pdf"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W93461835","https://openalex.org/W1488364200","https://openalex.org/W1517401074","https://openalex.org/W1556387124","https://openalex.org/W1980140173","https://openalex.org/W1989756522","https://openalex.org/W1992171695","https://openalex.org/W2001427579","https://openalex.org/W2017424540","https://openalex.org/W2030766424","https://openalex.org/W2060315097","https://openalex.org/W2108211197","https://openalex.org/W2114934447","https://openalex.org/W2122245206","https://openalex.org/W2124301944","https://openalex.org/W2126105956","https://openalex.org/W2127260328","https://openalex.org/W2135276056","https://openalex.org/W2140068846","https://openalex.org/W2175677697","https://openalex.org/W2326709068","https://openalex.org/W2589003851","https://openalex.org/W2811000352","https://openalex.org/W3000212629","https://openalex.org/W3009682779","https://openalex.org/W3123560358","https://openalex.org/W3129292293","https://openalex.org/W3155594815","https://openalex.org/W3217315228","https://openalex.org/W4213440056"],"related_works":["https://openalex.org/W2188146187","https://openalex.org/W4372294755","https://openalex.org/W2036494154","https://openalex.org/W2770314820","https://openalex.org/W2379772394","https://openalex.org/W2991295200","https://openalex.org/W3123114176","https://openalex.org/W16482907","https://openalex.org/W2364791190","https://openalex.org/W3135784728"],"abstract_inverted_index":{"The":[0,99],"thermal":[1,8,69],"aware":[2],"floor":[3],"planning":[4],"for":[5,49],"VLSIs":[6],"and":[7,67,78,92],"placement":[9,36,52],"optimization":[10,33],"of":[11,34,40,53,88],"electronic":[12,54],"components":[13,55,73],"on":[14,32,57],"printed":[15],"circuit":[16],"boards":[17],"(PCBs)":[18],"using":[19,59],"genetic":[20,64],"algorithms":[21],"(GAs)":[22],"are":[23,28,81],"well":[24],"studied.":[25],"However,":[26],"there":[27],"no":[29],"technical":[30],"paper":[31],"component":[35],"considering":[37],"the":[38,51,60,85,104,109],"heat":[39],"smartglasses.":[41],"In":[42],"this":[43],"paper,":[44],"we":[45],"propose":[46],"a":[47,68],"method":[48,106],"optimizing":[50],"equipped":[56],"smartglasses":[58],"elitist":[61],"non-dominated":[62],"sorting":[63],"algorithm":[65],"(NSGA-II)":[66],"resistance":[70],"circuit.":[71],"Electronic":[72],"that":[74,103],"have":[75],"various":[76],"dimensions":[77],"power":[79],"consumptions":[80],"relocated":[82],"to":[83],"minimize":[84],"maximum":[86,110],"temperature":[87],"parts":[89],"around":[90],"ears":[91],"areas":[93],"often":[94],"held":[95],"by":[96],"hands":[97],"simultaneously.":[98],"experimental":[100],"results":[101],"show":[102],"proposed":[105],"effectively":[107],"reduced":[108],"temperatures.":[111]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2026-01-22T23:29:09.771500","created_date":"2025-10-10T00:00:00"}