{"id":"https://openalex.org/W4289081920","doi":"https://doi.org/10.1587/elex.19.20220313","title":"Impact of ground solder ball failure in BGA package on near electric field radiation","display_name":"Impact of ground solder ball failure in BGA package on near electric field radiation","publication_year":2022,"publication_date":"2022-07-31","ids":{"openalex":"https://openalex.org/W4289081920","doi":"https://doi.org/10.1587/elex.19.20220313"},"language":"en","primary_location":{"id":"doi:10.1587/elex.19.20220313","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20220313","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/17/19_19.20220313/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/19/17/19_19.20220313/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113936201","display_name":"Yidong Yuan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210146981","display_name":"Shine Micro (United States)","ror":"https://ror.org/050chtk28","country_code":"US","type":"company","lineage":["https://openalex.org/I4210146981"]},{"id":"https://openalex.org/I4210089056","display_name":"Beijing Microelectronics Technology Institute","ror":"https://ror.org/007y7ej30","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"Yidong Yuan","raw_affiliation_strings":["Beijing Smart-chip Microelectronics Technology Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Beijing Smart-chip Microelectronics Technology Co., Ltd","institution_ids":["https://openalex.org/I4210089056","https://openalex.org/I4210146981"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101965614","display_name":"Tianmeng Zhang","orcid":"https://orcid.org/0009-0008-1861-5317"},"institutions":[{"id":"https://openalex.org/I139759216","display_name":"Beijing University of Posts and Telecommunications","ror":"https://ror.org/04w9fbh59","country_code":"CN","type":"education","lineage":["https://openalex.org/I139759216"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianmeng Zhang","raw_affiliation_strings":["Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"],"affiliations":[{"raw_affiliation_string":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications","institution_ids":["https://openalex.org/I139759216"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065154754","display_name":"Ziren Wang","orcid":"https://orcid.org/0000-0002-8227-8959"},"institutions":[{"id":"https://openalex.org/I4210136246","display_name":"China Telecom (China)","ror":"https://ror.org/03jgnzt20","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210136246"]},{"id":"https://openalex.org/I4210130112","display_name":"China Academy of Information and Communications Technology","ror":"https://ror.org/038dte259","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210130112","https://openalex.org/I890469752"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ziren Wang","raw_affiliation_strings":["China Telecommunication Technology Labs, China Academy of Information and Communications Technology"],"affiliations":[{"raw_affiliation_string":"China Telecommunication Technology Labs, China Academy of Information and Communications Technology","institution_ids":["https://openalex.org/I4210136246","https://openalex.org/I4210130112"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006588485","display_name":"Kaixuan Song","orcid":"https://orcid.org/0009-0007-6914-3041"},"institutions":[{"id":"https://openalex.org/I139759216","display_name":"Beijing University of Posts and Telecommunications","ror":"https://ror.org/04w9fbh59","country_code":"CN","type":"education","lineage":["https://openalex.org/I139759216"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kaixuan Song","raw_affiliation_strings":["Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"],"affiliations":[{"raw_affiliation_string":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications","institution_ids":["https://openalex.org/I139759216"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007673582","display_name":"Lingyu Bi","orcid":"https://orcid.org/0000-0002-3648-8074"},"institutions":[{"id":"https://openalex.org/I139759216","display_name":"Beijing University of Posts and Telecommunications","ror":"https://ror.org/04w9fbh59","country_code":"CN","type":"education","lineage":["https://openalex.org/I139759216"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lingyu Bi","raw_affiliation_strings":["Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"],"affiliations":[{"raw_affiliation_string":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications","institution_ids":["https://openalex.org/I139759216"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100365670","display_name":"Lu Tian","orcid":"https://orcid.org/0009-0007-6734-1984"},"institutions":[{"id":"https://openalex.org/I4210089056","display_name":"Beijing Microelectronics Technology Institute","ror":"https://ror.org/007y7ej30","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]},{"id":"https://openalex.org/I4210146981","display_name":"Shine Micro (United States)","ror":"https://ror.org/050chtk28","country_code":"US","type":"company","lineage":["https://openalex.org/I4210146981"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Lu Tian","raw_affiliation_strings":["Beijing Smart-chip Microelectronics Technology Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Beijing Smart-chip Microelectronics Technology Co., Ltd","institution_ids":["https://openalex.org/I4210089056","https://openalex.org/I4210146981"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063958295","display_name":"Jinchun Gao","orcid":"https://orcid.org/0000-0002-1280-4212"},"institutions":[{"id":"https://openalex.org/I139759216","display_name":"Beijing University of Posts and Telecommunications","ror":"https://ror.org/04w9fbh59","country_code":"CN","type":"education","lineage":["https://openalex.org/I139759216"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinchun Gao","raw_affiliation_strings":["Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"],"affiliations":[{"raw_affiliation_string":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications","institution_ids":["https://openalex.org/I139759216"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5113936201"],"corresponding_institution_ids":["https://openalex.org/I4210089056","https://openalex.org/I4210146981"],"apc_list":null,"apc_paid":null,"fwci":0.277,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.52920294,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":"19","issue":"17","first_page":"20220313","last_page":"20220313"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.9821220636367798},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.7162424325942993},{"id":"https://openalex.org/keywords/ball","display_name":"Ball (mathematics)","score":0.5758395791053772},{"id":"https://openalex.org/keywords/electric-field","display_name":"Electric field","score":0.5062243342399597},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4847356975078583},{"id":"https://openalex.org/keywords/electromagnetic-field","display_name":"Electromagnetic field","score":0.47986119985580444},{"id":"https://openalex.org/keywords/radiation","display_name":"Radiation","score":0.46261149644851685},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4619588851928711},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.414361834526062},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4118667542934418},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.3974701166152954},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3251575827598572},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3125390410423279},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2901204228401184},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.21499109268188477},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.20064851641654968},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14266082644462585}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.9821220636367798},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7162424325942993},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.5758395791053772},{"id":"https://openalex.org/C60799052","wikidata":"https://www.wikidata.org/wiki/Q46221","display_name":"Electric field","level":2,"score":0.5062243342399597},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4847356975078583},{"id":"https://openalex.org/C28843909","wikidata":"https://www.wikidata.org/wiki/Q177625","display_name":"Electromagnetic field","level":2,"score":0.47986119985580444},{"id":"https://openalex.org/C153385146","wikidata":"https://www.wikidata.org/wiki/Q18335","display_name":"Radiation","level":2,"score":0.46261149644851685},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4619588851928711},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.414361834526062},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4118667542934418},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3974701166152954},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3251575827598572},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3125390410423279},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2901204228401184},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.21499109268188477},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20064851641654968},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14266082644462585},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.19.20220313","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20220313","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/17/19_19.20220313/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.19.20220313","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20220313","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/17/19_19.20220313/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3317480652","display_name":null,"funder_award_id":"Science","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G391238517","display_name":null,"funder_award_id":", and","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5589568","display_name":null,"funder_award_id":"No. 51877010","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5939423041","display_name":null,"funder_award_id":"Technology","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5994120800","display_name":null,"funder_award_id":"Natural","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6940002817","display_name":null,"funder_award_id":"51877010","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4289081920.pdf","grobid_xml":"https://content.openalex.org/works/W4289081920.grobid-xml"},"referenced_works_count":31,"referenced_works":["https://openalex.org/W1602645972","https://openalex.org/W1979155829","https://openalex.org/W1982088050","https://openalex.org/W2011003030","https://openalex.org/W2096284648","https://openalex.org/W2107650101","https://openalex.org/W2125405346","https://openalex.org/W2148348965","https://openalex.org/W2161715735","https://openalex.org/W2168913760","https://openalex.org/W2316173155","https://openalex.org/W2477632003","https://openalex.org/W2528975548","https://openalex.org/W2542176805","https://openalex.org/W2576743917","https://openalex.org/W2604136476","https://openalex.org/W2750876901","https://openalex.org/W2910249589","https://openalex.org/W2921440357","https://openalex.org/W2945383760","https://openalex.org/W2990928780","https://openalex.org/W3020942960","https://openalex.org/W3023616310","https://openalex.org/W3070135556","https://openalex.org/W3109357236","https://openalex.org/W3193047480","https://openalex.org/W3196193017","https://openalex.org/W3208730645","https://openalex.org/W3209635758","https://openalex.org/W3210929991","https://openalex.org/W4205121964"],"related_works":["https://openalex.org/W2125407801","https://openalex.org/W2111449930","https://openalex.org/W2760349756","https://openalex.org/W1983370089","https://openalex.org/W2523686431","https://openalex.org/W4368373553","https://openalex.org/W298407248","https://openalex.org/W1977652399","https://openalex.org/W2920941010","https://openalex.org/W2885452644"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"the":[3,24,35],"impact":[4],"of":[5,26,47,59,63],"ground":[6,52,65],"solder":[7,53,66],"ball":[8,11],"failure":[9],"in":[10],"grid":[12],"array":[13],"(BGA)":[14],"package":[15],"on":[16,34,72],"near":[17,73],"electric":[18,74],"field":[19,43,75,81],"radiation":[20,76],"was":[21,55,77],"investigated":[22],"from":[23],"perspectives":[25],"both":[27,60],"theoretical":[28],"modelling":[29],"and":[30,37,68],"experimental":[31,87],"testing.":[32],"Based":[33],"structural":[36],"material":[38],"parameters,":[39],"a":[40],"3D":[41],"electromagnetic":[42,80],"numerical":[44],"calculation":[45],"model":[46,82],"circuit":[48],"boards":[49],"with":[50],"failed":[51,64],"balls":[54,67],"developed.":[56],"The":[57,79],"influences":[58],"different":[61,69],"number":[62],"signal":[70],"frequencies":[71],"calculated.":[78],"results":[83],"are":[84],"validated":[85],"using":[86],"tests.":[88]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}