{"id":"https://openalex.org/W4210688114","doi":"https://doi.org/10.1587/elex.19.20210559","title":"Wideband transmission optimization for heterogenous interconnection in 3D IC","display_name":"Wideband transmission optimization for heterogenous interconnection in 3D IC","publication_year":2022,"publication_date":"2022-02-02","ids":{"openalex":"https://openalex.org/W4210688114","doi":"https://doi.org/10.1587/elex.19.20210559"},"language":"en","primary_location":{"id":"doi:10.1587/elex.19.20210559","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20210559","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/5/19_19.20210559/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/19/5/19_19.20210559/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5029610013","display_name":"Xiangkun Yin","orcid":"https://orcid.org/0000-0003-2318-1257"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiangkun Yin","raw_affiliation_strings":["School of Microelectronics, Xidian University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068494785","display_name":"Jingyu Lu","orcid":"https://orcid.org/0000-0001-9777-9388"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jingyu Lu","raw_affiliation_strings":["School of Microelectronics, Xidian University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038846309","display_name":"Fengjuan Wang","orcid":"https://orcid.org/0000-0001-9331-7936"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengjuan Wang","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology"],"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology","institution_ids":["https://openalex.org/I4210131919"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5029610013"],"corresponding_institution_ids":["https://openalex.org/I149594827"],"apc_list":null,"apc_paid":null,"fwci":0.0923,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":{"value":0.37586236,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"19","issue":"5","first_page":"20210559","last_page":"20210559"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9926999807357788,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9926999807357788,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.877068042755127},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5855973958969116},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5579988956451416},{"id":"https://openalex.org/keywords/wideband","display_name":"Wideband","score":0.5164104104042053},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5065938234329224},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.48264557123184204},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.46154433488845825},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4114590883255005},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34958088397979736},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1932535469532013},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.15349620580673218},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12989288568496704},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12596601247787476}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.877068042755127},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5855973958969116},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5579988956451416},{"id":"https://openalex.org/C2780202535","wikidata":"https://www.wikidata.org/wiki/Q4524457","display_name":"Wideband","level":2,"score":0.5164104104042053},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5065938234329224},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.48264557123184204},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.46154433488845825},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4114590883255005},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34958088397979736},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1932535469532013},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.15349620580673218},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12989288568496704},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12596601247787476},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.19.20210559","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20210559","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/5/19_19.20210559/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.19.20210559","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.19.20210559","pdf_url":"https://www.jstage.jst.go.jp/article/elex/19/5/19_19.20210559/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.47999998927116394,"display_name":"Industry, innovation and infrastructure"}],"awards":[{"id":"https://openalex.org/G1340371064","display_name":null,"funder_award_id":"61804112","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G1527739835","display_name":null,"funder_award_id":"61774127","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5733390078","display_name":null,"funder_award_id":"Grant nos.","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5807296184","display_name":null,"funder_award_id":"171112","funder_id":"https://openalex.org/F4320326297","funder_display_name":"Fok Ying Tung Education Foundation"},{"id":"https://openalex.org/G879591710","display_name":null,"funder_award_id":"1774127","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320326297","display_name":"Fok Ying Tung Education Foundation","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4210688114.pdf","grobid_xml":"https://content.openalex.org/works/W4210688114.grobid-xml"},"referenced_works_count":29,"referenced_works":["https://openalex.org/W2090387348","https://openalex.org/W2138803188","https://openalex.org/W2551052146","https://openalex.org/W2765562362","https://openalex.org/W2772584875","https://openalex.org/W2791791757","https://openalex.org/W2803788456","https://openalex.org/W2807824227","https://openalex.org/W2809409773","https://openalex.org/W2810085148","https://openalex.org/W2817164196","https://openalex.org/W2903102426","https://openalex.org/W2905712167","https://openalex.org/W2941027712","https://openalex.org/W2958051993","https://openalex.org/W2971153205","https://openalex.org/W2979746556","https://openalex.org/W3000539986","https://openalex.org/W3001290849","https://openalex.org/W3039712994","https://openalex.org/W3116243700","https://openalex.org/W3128945442","https://openalex.org/W3139740192","https://openalex.org/W3140564856","https://openalex.org/W3153438342","https://openalex.org/W3163583059","https://openalex.org/W3173005936","https://openalex.org/W3182709461","https://openalex.org/W3195377783"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W4237709086"],"abstract_inverted_index":{"Through-silicon":[0],"via":[1],"(TSV)":[2],"is":[3,62],"proved":[4],"to":[5,64,82],"have":[6],"great":[7,74],"potential":[8],"in":[9,26,46,68],"high":[10,12],"density,":[11],"performance":[13],"integrated":[14,28],"circuit.":[15],"This":[16],"work":[17],"aims":[18],"at":[19,77],"reducing":[20],"the":[21,66],"loss":[22],"of":[23,36],"heterogeneous":[24],"interconnection":[25],"three-dimensional":[27],"circuit":[29,34],"(3D":[30],"IC).":[31],"The":[32,71],"equivalent":[33],"models":[35],"TSV":[37],"and":[38],"redistribution":[39],"layer":[40],"(RDL)":[41],"are":[42,45],"established,":[43],"they":[44],"good":[47],"agreement":[48],"with":[49,59],"finite":[50],"element":[51,61],"method":[52],"(FEM)":[53],"simulation":[54,72],"results.":[55],"An":[56],"optimized":[57],"structure":[58],"capacitive":[60],"proposed":[63],"improve":[65],"transmission":[67,75],"heterogenous":[69],"interconnection.":[70],"indicates":[73],"improvement":[76],"wide":[78],"band":[79],"from":[80],"DC":[81],"70GHz.":[83]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-04-21T08:09:41.155169","created_date":"2025-10-10T00:00:00"}