{"id":"https://openalex.org/W4206289451","doi":"https://doi.org/10.1587/elex.18.20210453","title":"Research on Ni<sub>3</sub>Sn<sub>4</sub> intermetallic compound for 5\u03bcm diameter Cu/Ni/Sn-3.0Ag micro bumps","display_name":"Research on Ni<sub>3</sub>Sn<sub>4</sub> intermetallic compound for 5\u03bcm diameter Cu/Ni/Sn-3.0Ag micro bumps","publication_year":2021,"publication_date":"2021-12-14","ids":{"openalex":"https://openalex.org/W4206289451","doi":"https://doi.org/10.1587/elex.18.20210453"},"language":"en","primary_location":{"id":"doi:10.1587/elex.18.20210453","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210453","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_18.20210453/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_18.20210453/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102113678","display_name":"Fengwei Dai","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"funder","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Fengwei Dai","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences","School of Microelectronics, Fudan University"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences","institution_ids":["https://openalex.org/I19820366"]},{"raw_affiliation_string":"School of Microelectronics, Fudan University","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044907599","display_name":"David Wei Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"David Wei Zhang","raw_affiliation_strings":["School of Microelectronics, Fudan University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Fudan University","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101904994","display_name":"Yangyang Yan","orcid":"https://orcid.org/0000-0002-3945-6684"},"institutions":[{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yangyang Yan","raw_affiliation_strings":["The National Center for Advanced Packaging"],"affiliations":[{"raw_affiliation_string":"The National Center for Advanced Packaging","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100386726","display_name":"Guojun Wang","orcid":"https://orcid.org/0000-0001-9875-4182"},"institutions":[{"id":"https://openalex.org/I4210151511","display_name":"National Center for Advanced Packaging (China)","ror":"https://ror.org/04rgjq668","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210151511"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guojun Wang","raw_affiliation_strings":["The National Center for Advanced Packaging"],"affiliations":[{"raw_affiliation_string":"The National Center for Advanced Packaging","institution_ids":["https://openalex.org/I4210151511"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083314215","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-0859-1437"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"funder","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences","institution_ids":["https://openalex.org/I19820366"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5102113678"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I24943067","https://openalex.org/I4210132426"],"apc_list":null,"apc_paid":null,"fwci":0.1011,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.46659334,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":"19","issue":"2","first_page":"20210453","last_page":"20210453"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.9545999765396118,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.9330999851226807,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/intermetallic","display_name":"Intermetallic","score":0.9430124163627625},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7113003134727478},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.5408954620361328},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.49659138917922974},{"id":"https://openalex.org/keywords/grain-boundary","display_name":"Grain boundary","score":0.49039363861083984},{"id":"https://openalex.org/keywords/melting-point","display_name":"Melting point","score":0.47994425892829895},{"id":"https://openalex.org/keywords/grain-boundary-diffusion-coefficient","display_name":"Grain boundary diffusion coefficient","score":0.4580901563167572},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.44111573696136475},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4019482135772705},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.28439566493034363},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.1904124617576599},{"id":"https://openalex.org/keywords/alloy","display_name":"Alloy","score":0.06449228525161743},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06016632914543152}],"concepts":[{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.9430124163627625},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7113003134727478},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.5408954620361328},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.49659138917922974},{"id":"https://openalex.org/C47908070","wikidata":"https://www.wikidata.org/wiki/Q900515","display_name":"Grain boundary","level":3,"score":0.49039363861083984},{"id":"https://openalex.org/C13530604","wikidata":"https://www.wikidata.org/wiki/Q15318","display_name":"Melting point","level":2,"score":0.47994425892829895},{"id":"https://openalex.org/C183808158","wikidata":"https://www.wikidata.org/wiki/Q5593506","display_name":"Grain boundary diffusion coefficient","level":4,"score":0.4580901563167572},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.44111573696136475},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4019482135772705},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.28439566493034363},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1904124617576599},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.06449228525161743},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06016632914543152}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.18.20210453","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210453","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_18.20210453/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.18.20210453","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210453","pdf_url":"https://www.jstage.jst.go.jp/article/elex/advpub/0/advpub_18.20210453/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2087396116","display_name":null,"funder_award_id":"China","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3085993365","display_name":null,"funder_award_id":"(Grant No.","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3214160367","display_name":null,"funder_award_id":"No. 11","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3317480652","display_name":null,"funder_award_id":"Science","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5167091242","display_name":null,"funder_award_id":"No. 1","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5994120800","display_name":null,"funder_award_id":"Natural","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6258415954","display_name":null,"funder_award_id":"Chinese","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7726157001","display_name":null,"funder_award_id":"Grant No.","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8667332181","display_name":null,"funder_award_id":"11820101005","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321133","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4206289451.pdf","grobid_xml":"https://content.openalex.org/works/W4206289451.grobid-xml"},"referenced_works_count":27,"referenced_works":["https://openalex.org/W932501314","https://openalex.org/W1482059361","https://openalex.org/W1515364274","https://openalex.org/W2057801901","https://openalex.org/W2077064010","https://openalex.org/W2094163940","https://openalex.org/W2104386725","https://openalex.org/W2296178786","https://openalex.org/W2461030690","https://openalex.org/W2483196149","https://openalex.org/W2546914633","https://openalex.org/W2557270081","https://openalex.org/W2564353128","https://openalex.org/W2743542620","https://openalex.org/W2747102502","https://openalex.org/W2749199255","https://openalex.org/W2790600103","https://openalex.org/W2893324673","https://openalex.org/W2896757621","https://openalex.org/W2904182158","https://openalex.org/W2970440754","https://openalex.org/W2989992351","https://openalex.org/W2994680358","https://openalex.org/W2999866968","https://openalex.org/W3039974217","https://openalex.org/W3129949557","https://openalex.org/W4205104987"],"related_works":["https://openalex.org/W2745063064","https://openalex.org/W2079422425","https://openalex.org/W1635986310","https://openalex.org/W4239199100","https://openalex.org/W1589848137","https://openalex.org/W1986123087","https://openalex.org/W2127393273","https://openalex.org/W2027768855","https://openalex.org/W2054700932","https://openalex.org/W4294552762"],"abstract_inverted_index":{"for":[0,141],"5":[1],"\u03bcm":[2],"diameter":[3,37],"micro":[4,17,38,62,146],"bumps,":[5,63],"the":[6,13,25,28,56,60,69,72,80,86,92,101,106,124,129,134,142],"interfacial":[7],"intermetallic":[8],"compounds":[9],"(IMCs)":[10],"seriously":[11],"affects":[12],"interconnection":[14],"performance":[15],"of":[16,27,33,35,50,59,71,89,112,128,133,144],"bumps.":[18,147],"In":[19],"this":[20],"paper,":[21],"we":[22,137],"focused":[23],"on":[24,123],"discussion":[26],"growth":[29,46,99,108,130],"and":[30,43,48,97,109,114,126,131],"control":[31],"mechanism":[32,47],"IMCs":[34],"5um":[36],"bumps":[39],"at":[40],"different":[41],"temperatures":[42],"durations.":[44],"The":[45],"morphology":[49],"Ni3Sn4":[51,135],"IMC":[52,76,93,107],"was":[53,77,83],"studied.":[54],"Through":[55],"EDS":[57],"analysis":[58],"cross-sectional":[61],"it":[64],"could":[65],"be":[66],"determined":[67],"that":[68],"composition":[70],"slender":[73],"columnar":[74],"crystal":[75],"Ni3Sn4.":[78],"When":[79],"heating":[81],"temperature":[82,125],"higher":[84],"than":[85],"melting":[87],"point":[88],"Sn-3.0wt%Ag":[90],"solder,":[91],"would":[94],"exhibit":[95],"uneven":[96],"abnormal":[98],"along":[100],"Sn":[102],"grain":[103],"boundary.":[104],"Furthermore,":[105],"diffusion":[110],"mechanisms":[111],"solid-solid":[113],"solid-liquid":[115],"interface":[116],"reaction":[117],"were":[118],"discussed":[119],"respectively.":[120],"Finally,":[121],"based":[122],"duration":[127],"evolution":[132],"IMC,":[136],"gave":[138],"appropriate":[139],"suggestions":[140],"use":[143],"small-sized":[145]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2026-03-18T14:38:29.013473","created_date":"2025-10-10T00:00:00"}