{"id":"https://openalex.org/W3165453788","doi":"https://doi.org/10.1587/elex.18.20210196","title":"A miniaturized and self-packaged Gysel power divider with embedded metamaterials in SISL platform","display_name":"A miniaturized and self-packaged Gysel power divider with embedded metamaterials in SISL platform","publication_year":2021,"publication_date":"2021-05-24","ids":{"openalex":"https://openalex.org/W3165453788","doi":"https://doi.org/10.1587/elex.18.20210196","mag":"3165453788"},"language":"en","primary_location":{"id":"doi:10.1587/elex.18.20210196","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210196","pdf_url":"https://www.jstage.jst.go.jp/article/elex/18/12/18_18.20210196/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/18/12/18_18.20210196/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047830183","display_name":"Junjie Luo","orcid":"https://orcid.org/0000-0002-7112-3759"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Junjie Luo","raw_affiliation_strings":["School of Microelectronics, Tianjin University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University","institution_ids":["https://openalex.org/I162868743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087906386","display_name":"Haipeng Fu","orcid":"https://orcid.org/0000-0002-9809-1830"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haipeng Fu","raw_affiliation_strings":["School of Microelectronics, Tianjin University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University","institution_ids":["https://openalex.org/I162868743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030141198","display_name":"Kaixue Ma","orcid":"https://orcid.org/0000-0001-8657-2920"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kaixue Ma","raw_affiliation_strings":["School of Microelectronics, Tianjin University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University","institution_ids":["https://openalex.org/I162868743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025025575","display_name":"Ningning Yan","orcid":"https://orcid.org/0000-0001-7155-4789"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ningning Yan","raw_affiliation_strings":["School of Microelectronics, Tianjin University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University","institution_ids":["https://openalex.org/I162868743"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100770698","display_name":"Xiong Chen","orcid":"https://orcid.org/0000-0003-3008-2847"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiong Chen","raw_affiliation_strings":["School of Microelectronics, Tianjin University"],"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University","institution_ids":["https://openalex.org/I162868743"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5047830183"],"corresponding_institution_ids":["https://openalex.org/I162868743"],"apc_list":null,"apc_paid":null,"fwci":0.4011,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.59540889,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"18","issue":"12","first_page":"20210196","last_page":"20210196"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/metamaterial","display_name":"Metamaterial","score":0.8896669149398804},{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.596528172492981},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5950626730918884},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5460671186447144},{"id":"https://openalex.org/keywords/split-ring-resonator","display_name":"Split-ring resonator","score":0.5135502815246582},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4836898446083069},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4680594801902771},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.41830888390541077},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.36763912439346313},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.355849027633667},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3527960181236267},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1874658465385437},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.17943114042282104}],"concepts":[{"id":"https://openalex.org/C110367647","wikidata":"https://www.wikidata.org/wiki/Q497166","display_name":"Metamaterial","level":2,"score":0.8896669149398804},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.596528172492981},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5950626730918884},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5460671186447144},{"id":"https://openalex.org/C73862843","wikidata":"https://www.wikidata.org/wiki/Q4992522","display_name":"Split-ring resonator","level":3,"score":0.5135502815246582},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4836898446083069},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4680594801902771},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.41830888390541077},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.36763912439346313},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.355849027633667},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3527960181236267},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1874658465385437},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17943114042282104}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.18.20210196","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210196","pdf_url":"https://www.jstage.jst.go.jp/article/elex/18/12/18_18.20210196/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.18.20210196","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.18.20210196","pdf_url":"https://www.jstage.jst.go.jp/article/elex/18/12/18_18.20210196/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3165453788.pdf","grobid_xml":"https://content.openalex.org/works/W3165453788.grobid-xml"},"referenced_works_count":29,"referenced_works":["https://openalex.org/W606472541","https://openalex.org/W1643257620","https://openalex.org/W1771609198","https://openalex.org/W1976370585","https://openalex.org/W1981522995","https://openalex.org/W2005978936","https://openalex.org/W2011857805","https://openalex.org/W2013063718","https://openalex.org/W2013349079","https://openalex.org/W2015841122","https://openalex.org/W2016252824","https://openalex.org/W2071069755","https://openalex.org/W2071547084","https://openalex.org/W2077402815","https://openalex.org/W2088079267","https://openalex.org/W2115767228","https://openalex.org/W2121369978","https://openalex.org/W2138986644","https://openalex.org/W2140488409","https://openalex.org/W2147770891","https://openalex.org/W2556884235","https://openalex.org/W2730578319","https://openalex.org/W2734221258","https://openalex.org/W2755000989","https://openalex.org/W2767341478","https://openalex.org/W2775419623","https://openalex.org/W2883821940","https://openalex.org/W2921927809","https://openalex.org/W4205866191"],"related_works":["https://openalex.org/W635615565","https://openalex.org/W2068098957","https://openalex.org/W2520775183","https://openalex.org/W2010118559","https://openalex.org/W2094241994","https://openalex.org/W1555872197","https://openalex.org/W75536252","https://openalex.org/W2017082258","https://openalex.org/W1479671069","https://openalex.org/W2034486684"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,23,52,93],"self-packaged":[4],"Gysel":[5,61],"power":[6],"divider":[7],"(PD)":[8],"with":[9,83,92,103],"embedded":[10,84],"metamaterials":[11,85,107],"in":[12,39,72],"substrate":[13],"integrated":[14],"suspended":[15],"Line":[16],"(SISL)":[17],"platform.":[18],"Metamaterials":[19],"are":[20,37,108],"formed":[21],"by":[22,50,116],"periodic":[24],"arrangement":[25],"of":[26,67,75,95],"I-shaped":[27],"electrical":[28],"resonators":[29],"that":[30],"can":[31,77],"produce":[32],"high":[33],"dielectric":[34],"constants":[35],"and":[36],"encapsulated":[38],"the":[40,46,59,68,73,104,111],"multi-layer":[41],"SISL":[42],"structure":[43,66],"to":[44,89],"reduce":[45],"circuit":[47,55,112],"size.":[48],"Fabricated":[49],"using":[51],"standard":[53],"printed":[54],"board":[56],"(PCB)":[57],"process,":[58],"proposed":[60],"PD":[62,76,82],"is":[63,114],"self-packaged.":[64],"The":[65,80],"meandering":[69],"line":[70],"introduced":[71],"layout":[74],"be":[78],"downsized.":[79],"designed":[81],"operates":[86],"from":[87],"3.3":[88],"3.6":[90],"GHz":[91],"bandwidth":[94],"14.8%":[96],"for":[97],"S11":[98],"<":[99],"-20":[100],"dB.":[101],"Compared":[102],"case":[105],"where":[106],"not":[109],"embedded,":[110],"area":[113],"reduced":[115],"about":[117],"61%.":[118]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}