{"id":"https://openalex.org/W3000212629","doi":"https://doi.org/10.1587/elex.17.20190737","title":"Thermal placement on PCB of components including 3D ICs","display_name":"Thermal placement on PCB of components including 3D ICs","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3000212629","doi":"https://doi.org/10.1587/elex.17.20190737","mag":"3000212629"},"language":"en","primary_location":{"id":"doi:10.1587/elex.17.20190737","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.17.20190737","pdf_url":"https://www.jstage.jst.go.jp/article/elex/17/3/17_17.20190737/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/17/3/17_17.20190737/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058038331","display_name":"Yuuta Satomi","orcid":null},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuuta Satomi","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009587783","display_name":"Koutaro Hachiya","orcid":"https://orcid.org/0000-0002-2736-4002"},"institutions":[{"id":"https://openalex.org/I131632401","display_name":"Teikyo Heisei University","ror":"https://ror.org/034zkkc78","country_code":"JP","type":"education","lineage":["https://openalex.org/I131632401"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koutaro Hachiya","raw_affiliation_strings":["Graduate Program in Environmental Information Science, Teikyo Heisei University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate Program in Environmental Information Science, Teikyo Heisei University","institution_ids":["https://openalex.org/I131632401"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067005883","display_name":"Toshiki Kanamoto","orcid":"https://orcid.org/0000-0002-6326-6960"},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Toshiki Kanamoto","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044949131","display_name":"Ryosuke Watanabe","orcid":"https://orcid.org/0000-0003-4083-6876"},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ryosuke Watanabe","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108528404","display_name":"Atsushi Kurokawa","orcid":null},"institutions":[{"id":"https://openalex.org/I146516829","display_name":"Hirosaki University","ror":"https://ror.org/02syg0q74","country_code":"JP","type":"education","lineage":["https://openalex.org/I146516829"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Atsushi Kurokawa","raw_affiliation_strings":["Graduate School of Science and Technology, Hirosaki University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Science and Technology, Hirosaki University","institution_ids":["https://openalex.org/I146516829"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.0406,"has_fulltext":true,"cited_by_count":19,"citation_normalized_percentile":{"value":0.75806452,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"17","issue":"3","first_page":"20190737","last_page":"20190737"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11975","display_name":"Evolutionary Algorithms and Applications","score":0.9782000184059143,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.9101133346557617},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6555362939834595},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.6031333804130554},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5603604912757874},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5601194500923157},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.544409453868866},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5360332727432251},{"id":"https://openalex.org/keywords/simple","display_name":"Simple (philosophy)","score":0.5104802846908569},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4574820399284363},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4383019506931305},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3587105870246887},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32432442903518677},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3001220226287842},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24551209807395935},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07913452386856079}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.9101133346557617},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6555362939834595},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.6031333804130554},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5603604912757874},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5601194500923157},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.544409453868866},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5360332727432251},{"id":"https://openalex.org/C2780586882","wikidata":"https://www.wikidata.org/wiki/Q7520643","display_name":"Simple (philosophy)","level":2,"score":0.5104802846908569},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4574820399284363},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4383019506931305},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3587105870246887},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32432442903518677},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3001220226287842},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24551209807395935},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07913452386856079},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.17.20190737","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.17.20190737","pdf_url":"https://www.jstage.jst.go.jp/article/elex/17/3/17_17.20190737/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.17.20190737","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.17.20190737","pdf_url":"https://www.jstage.jst.go.jp/article/elex/17/3/17_17.20190737/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.7099999785423279}],"awards":[],"funders":[{"id":"https://openalex.org/F4320309545","display_name":"Synopsys","ror":"https://ror.org/013by2m91"},{"id":"https://openalex.org/F4320322832","display_name":"University of Tokyo","ror":"https://ror.org/057zh3y96"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3000212629.pdf","grobid_xml":"https://content.openalex.org/works/W3000212629.grobid-xml"},"referenced_works_count":39,"referenced_works":["https://openalex.org/W93461835","https://openalex.org/W1541633348","https://openalex.org/W1574483502","https://openalex.org/W1579614998","https://openalex.org/W1922167881","https://openalex.org/W1976923760","https://openalex.org/W1992171695","https://openalex.org/W1995053109","https://openalex.org/W2021517442","https://openalex.org/W2026734753","https://openalex.org/W2041644560","https://openalex.org/W2044627312","https://openalex.org/W2055008360","https://openalex.org/W2060315097","https://openalex.org/W2062763943","https://openalex.org/W2076334571","https://openalex.org/W2098219569","https://openalex.org/W2101080472","https://openalex.org/W2101252893","https://openalex.org/W2103751315","https://openalex.org/W2108239118","https://openalex.org/W2122245206","https://openalex.org/W2124301944","https://openalex.org/W2129782853","https://openalex.org/W2135276056","https://openalex.org/W2147110552","https://openalex.org/W2152965341","https://openalex.org/W2160849628","https://openalex.org/W2164568153","https://openalex.org/W2178215049","https://openalex.org/W2293911448","https://openalex.org/W2326709068","https://openalex.org/W2346293981","https://openalex.org/W2743026413","https://openalex.org/W2811000352","https://openalex.org/W2886941676","https://openalex.org/W3141221909","https://openalex.org/W4214919055","https://openalex.org/W4232892799"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2188146187","https://openalex.org/W4372294755","https://openalex.org/W2036494154","https://openalex.org/W2379772394","https://openalex.org/W3123114176","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W16482907","https://openalex.org/W2364791190"],"abstract_inverted_index":{"In":[0,44],"this":[1],"letter,":[2],"we":[3],"propose":[4],"a":[5,20,26,76],"method":[6],"for":[7,94],"optimizing":[8],"the":[9,31,35,38,45,86,96],"thermal":[10,78],"placement":[11,87],"of":[12,34,58,67,88],"heat":[13],"and":[14,37],"non-heat":[15],"generating":[16],"electronic":[17],"components":[18,89],"on":[19],"printed":[21],"circuit":[22,73,79],"board":[23],"(PCB).":[24],"Use":[25],"genetic":[27],"algorithm":[28],"to":[29],"optimize":[30],"maximum":[32,97],"temperature":[33,66,98],"PCB":[36],"total":[39],"wire":[40,101],"length":[41],"between":[42],"components.":[43],"case":[46],"that":[47,85],"chips":[48],"stacked":[49],"in":[50],"3D":[51,59],"ICs":[52,60],"are":[53],"reconfigurable,":[54],"each":[55,68],"chip":[56],"construction":[57],"is":[61,70],"also":[62],"changed":[63],"simultaneously.":[64],"The":[65,81],"component":[69],"obtained":[71],"by":[72],"simulation":[74],"using":[75],"simple":[77],"model.":[80],"experimental":[82],"results":[83],"demonstrate":[84],"can":[90],"be":[91],"optimized":[92],"well":[93],"lowering":[95],"with":[99],"shorter":[100],"lengths.":[102]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}