{"id":"https://openalex.org/W2462307229","doi":"https://doi.org/10.1587/elex.13.20160441","title":"Systematic experimental study on stitching techniques of CMOS image sensors","display_name":"Systematic experimental study on stitching techniques of CMOS image sensors","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2462307229","doi":"https://doi.org/10.1587/elex.13.20160441","mag":"2462307229"},"language":"en","primary_location":{"id":"doi:10.1587/elex.13.20160441","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20160441","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/15/13_13.20160441/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/13/15/13_13.20160441/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047585931","display_name":"Jun Zhu","orcid":"https://orcid.org/0000-0003-1824-7610"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4391767673","display_name":"State Key Laboratory of ASIC and System","ror":"https://ror.org/01mamgv83","country_code":null,"type":"facility","lineage":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Zhu","raw_affiliation_strings":["State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University","institution_ids":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104159216","display_name":"Donghua Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4391767673","display_name":"State Key Laboratory of ASIC and System","ror":"https://ror.org/01mamgv83","country_code":null,"type":"facility","lineage":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Donghua Liu","raw_affiliation_strings":["State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University","institution_ids":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100618890","display_name":"Wei Zhang","orcid":"https://orcid.org/0000-0001-7607-9235"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4391767673","display_name":"State Key Laboratory of ASIC and System","ror":"https://ror.org/01mamgv83","country_code":null,"type":"facility","lineage":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Zhang","raw_affiliation_strings":["State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University","institution_ids":["https://openalex.org/I24943067","https://openalex.org/I4391767673"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100434837","display_name":"Qing Wang","orcid":"https://orcid.org/0000-0002-5339-941X"},"institutions":[{"id":"https://openalex.org/I4210147014","display_name":"Shanghai Huali Microelectronics (China)","ror":"https://ror.org/054deg252","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210147014"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qing Wang","raw_affiliation_strings":["Shanghai Huali Microelectronics Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Huali Microelectronics Corporation","institution_ids":["https://openalex.org/I4210147014"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100359871","display_name":"Wenliang Li","orcid":"https://orcid.org/0000-0002-0864-0358"},"institutions":[{"id":"https://openalex.org/I4210147014","display_name":"Shanghai Huali Microelectronics (China)","ror":"https://ror.org/054deg252","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210147014"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenliang Li","raw_affiliation_strings":["Shanghai Huali Microelectronics Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Huali Microelectronics Corporation","institution_ids":["https://openalex.org/I4210147014"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100398637","display_name":"Lijun Chen","orcid":"https://orcid.org/0000-0003-4530-2566"},"institutions":[{"id":"https://openalex.org/I4210147014","display_name":"Shanghai Huali Microelectronics (China)","ror":"https://ror.org/054deg252","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210147014"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lijun Chen","raw_affiliation_strings":["Shanghai Huali Microelectronics Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Huali Microelectronics Corporation","institution_ids":["https://openalex.org/I4210147014"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100369790","display_name":"Chen Li","orcid":"https://orcid.org/0000-0001-9839-6100"},"institutions":[{"id":"https://openalex.org/I2802974365","display_name":"Shanghai Innovative Research Center of Traditional Chinese Medicine","ror":"https://ror.org/01gnagj68","country_code":"CN","type":"facility","lineage":["https://openalex.org/I2802974365"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chen Li","raw_affiliation_strings":["Shanghai Integrated Circuit Research and Development Center Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Integrated Circuit Research and Development Center Ltd","institution_ids":["https://openalex.org/I2802974365"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101756800","display_name":"Yuhang Zhao","orcid":"https://orcid.org/0000-0002-9598-5687"},"institutions":[{"id":"https://openalex.org/I2802974365","display_name":"Shanghai Innovative Research Center of Traditional Chinese Medicine","ror":"https://ror.org/01gnagj68","country_code":"CN","type":"facility","lineage":["https://openalex.org/I2802974365"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuhang Zhao","raw_affiliation_strings":["Shanghai Integrated Circuit Research and Development Center Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Integrated Circuit Research and Development Center Ltd","institution_ids":["https://openalex.org/I2802974365"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.1467,"has_fulltext":true,"cited_by_count":7,"citation_normalized_percentile":{"value":0.58024139,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"13","issue":"15","first_page":"20160441","last_page":"20160441"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10627","display_name":"Advanced Image and Video Retrieval Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/image-stitching","display_name":"Image stitching","score":0.9721046686172485},{"id":"https://openalex.org/keywords/reticle","display_name":"Reticle","score":0.8115366101264954},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7935556173324585},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7875494360923767},{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.6733250617980957},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.6668468713760376},{"id":"https://openalex.org/keywords/cmos-sensor","display_name":"CMOS sensor","score":0.41489169001579285},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40330174565315247},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3960547149181366},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3561936020851135},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.24964621663093567},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24783417582511902},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.24435526132583618}],"concepts":[{"id":"https://openalex.org/C29081049","wikidata":"https://www.wikidata.org/wiki/Q1364242","display_name":"Image stitching","level":2,"score":0.9721046686172485},{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.8115366101264954},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7935556173324585},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7875494360923767},{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.6733250617980957},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.6668468713760376},{"id":"https://openalex.org/C155512908","wikidata":"https://www.wikidata.org/wiki/Q210745","display_name":"CMOS sensor","level":3,"score":0.41489169001579285},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40330174565315247},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3960547149181366},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3561936020851135},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.24964621663093567},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24783417582511902},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.24435526132583618}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.13.20160441","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20160441","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/15/13_13.20160441/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.13.20160441","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20160441","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/15/13_13.20160441/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321851","display_name":"Fudan University","ror":"https://ror.org/013q1eq08"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2462307229.pdf","grobid_xml":"https://content.openalex.org/works/W2462307229.grobid-xml"},"referenced_works_count":13,"referenced_works":["https://openalex.org/W1501397062","https://openalex.org/W1507666265","https://openalex.org/W1755572302","https://openalex.org/W1978012811","https://openalex.org/W2021246533","https://openalex.org/W2041410784","https://openalex.org/W2052827816","https://openalex.org/W2080214472","https://openalex.org/W2090353392","https://openalex.org/W2099015120","https://openalex.org/W2318859126","https://openalex.org/W2474001777","https://openalex.org/W2533581637"],"related_works":["https://openalex.org/W2167630859","https://openalex.org/W1966119149","https://openalex.org/W2466718138","https://openalex.org/W2347245756","https://openalex.org/W2351312630","https://openalex.org/W2028671992","https://openalex.org/W3139631222","https://openalex.org/W2367429071","https://openalex.org/W2020270528","https://openalex.org/W2099015120"],"abstract_inverted_index":{"On":[0],"the":[1,4,64],"basis":[2],"of":[3,7,46,68],"systematic":[5],"study":[6],"stitching":[8],"techniques,":[9],"a":[10,34,41,44,70],"large":[11],"area,":[12],"28.3":[13],"mm":[14,72],"\u00d7":[15,73],"38.8":[16],"mm,":[17,75],"42":[18],"Mega":[19],"pixels":[20,78],"CMOS":[21,37],"Imaging":[22],"Sensor":[23],"(CIS)":[24],"had":[25],"been":[26],"demonstrated":[27],"on":[28],"12":[29],"inch":[30],"silicon":[31],"wafer":[32,45],"in":[33,60],"0.055":[35],"\u00b5m":[36],"process.":[38],"By":[39],"scanning":[40],"reticle":[42],"across":[43],"silicon,":[47],"smaller":[48],"arrays":[49],"can":[50],"be":[51],"stitched":[52],"together":[53],"to":[54,62],"construct":[55],"larger":[56],"area":[57],"sensors.":[58],"Meanwhile,":[59],"order":[61],"verify":[63],"feasibility":[65],"and":[66],"capability":[67],"stitching,":[69],"203":[71],"179":[74],"1.8":[76],"Billion":[77],"CIS":[79],"was":[80],"also":[81],"created":[82],"without":[83],"any":[84],"performance":[85],"deficiency.":[86]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-08-05T07:39:15.569665","created_date":"2025-10-10T00:00:00"}