{"id":"https://openalex.org/W2294475654","doi":"https://doi.org/10.1587/elex.13.20151047","title":"Transient thermal analysis of packaged SiC SBDs for high temperature operation","display_name":"Transient thermal analysis of packaged SiC SBDs for high temperature operation","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2294475654","doi":"https://doi.org/10.1587/elex.13.20151047","mag":"2294475654"},"language":"en","primary_location":{"id":"doi:10.1587/elex.13.20151047","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20151047","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/6/13_13.20151047/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/13/6/13_13.20151047/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5039458033","display_name":"Taehwa Kim","orcid":"https://orcid.org/0000-0003-3722-0261"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Taehwa Kim","raw_affiliation_strings":["Osaka University, Division of Electrical, Electronic and Information Engineering, Graduate School of Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka University, Division of Electrical, Electronic and Information Engineering, Graduate School of Engineering","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059950859","display_name":"Tsuyoshi Funaki","orcid":"https://orcid.org/0000-0001-8776-5118"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tsuyoshi Funaki","raw_affiliation_strings":["Osaka University, Division of Electrical, Electronic and Information Engineering, Graduate School of Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka University, Division of Electrical, Electronic and Information Engineering, Graduate School of Engineering","institution_ids":["https://openalex.org/I98285908"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I98285908"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.00768836,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"13","issue":"6","first_page":"20151047","last_page":"20151047"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8505388498306274},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.776240348815918},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.6981289386749268},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6553037166595459},{"id":"https://openalex.org/keywords/atmospheric-temperature-range","display_name":"Atmospheric temperature range","score":0.5724326372146606},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5115381479263306},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.4723442792892456},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.41803622245788574},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.33840373158454895},{"id":"https://openalex.org/keywords/nuclear-engineering","display_name":"Nuclear engineering","score":0.3311932384967804},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.14459294080734253},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.141382098197937},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.07977545261383057}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8505388498306274},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.776240348815918},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.6981289386749268},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6553037166595459},{"id":"https://openalex.org/C39353612","wikidata":"https://www.wikidata.org/wiki/Q5283759","display_name":"Atmospheric temperature range","level":2,"score":0.5724326372146606},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5115381479263306},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.4723442792892456},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.41803622245788574},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.33840373158454895},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.3311932384967804},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.14459294080734253},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.141382098197937},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07977545261383057},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.13.20151047","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20151047","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/6/13_13.20151047/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.13.20151047","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.13.20151047","pdf_url":"https://www.jstage.jst.go.jp/article/elex/13/6/13_13.20151047/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.5600000023841858,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320912","display_name":"Ministry of Education, Culture, Sports, Science and Technology","ror":"https://ror.org/048rj2z13"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2294475654.pdf","grobid_xml":"https://content.openalex.org/works/W2294475654.grobid-xml"},"referenced_works_count":7,"referenced_works":["https://openalex.org/W1489767088","https://openalex.org/W2065272531","https://openalex.org/W2067199758","https://openalex.org/W2072414015","https://openalex.org/W2082570068","https://openalex.org/W2097550317","https://openalex.org/W2136631982"],"related_works":["https://openalex.org/W2057619737","https://openalex.org/W2016485274","https://openalex.org/W2328209056","https://openalex.org/W2369767695","https://openalex.org/W2165370268","https://openalex.org/W2360935846","https://openalex.org/W1135062604","https://openalex.org/W3009432609","https://openalex.org/W1902410098","https://openalex.org/W4294622179"],"abstract_inverted_index":{"SiC":[0,18,37,53,69,96],"power":[1,11],"devices":[2,19],"have":[3],"high":[4,26,40],"temperature":[5,27,41,104],"operation":[6],"capability":[7],"compared":[8],"to":[9,108],"Si":[10],"devices.":[12],"The":[13,43],"thermal":[14,23,32,48,64,81,91],"characteristics":[15,33],"of":[16,34,50,66,83,93],"packaged":[17,36,52,68,95],"are":[20,55,76],"important":[21],"for":[22,39],"management":[24],"in":[25,102],"range.":[28],"This":[29],"study":[30],"investigates":[31],"a":[35],"device":[38],"operation.":[42],"transient":[44],"and":[45],"steady":[46],"state":[47],"resistances":[49],"the":[51,62,67,87,90,94,103],"SBDs":[54,70],"measured":[56],"using":[57,71],"JESD51-1":[58],"standard.":[59],"In":[60,86],"addition,":[61],"numerical":[63],"simulation":[65],"finite":[72],"difference":[73],"method":[74],"(FDM)":[75],"carried":[77],"out":[78],"considering":[79],"nonlinear":[80],"properties":[82],"package":[84],"materials.":[85],"current":[88],"research,":[89],"resistance":[92],"SBD":[97],"increases":[98],"by":[99],"about":[100],"10%":[101],"rise":[105],"from":[106],"27\u00b0C":[107],"250\u00b0C.":[109]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2022,"cited_by_count":1}],"updated_date":"2026-08-06T08:24:18.245995","created_date":"2025-10-10T00:00:00"}