{"id":"https://openalex.org/W2139320851","doi":"https://doi.org/10.1587/elex.11.20140876","title":"H-cluster: a hybrid architecture for three-dimensional many-core chips","display_name":"H-cluster: a hybrid architecture for three-dimensional many-core chips","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W2139320851","doi":"https://doi.org/10.1587/elex.11.20140876","mag":"2139320851"},"language":"en","primary_location":{"id":"doi:10.1587/elex.11.20140876","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140876","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/22/11_11.20140876/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/11/22/11_11.20140876/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5000156924","display_name":"Huafeng Sun","orcid":null},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huafeng Sun","raw_affiliation_strings":["State Key Laboratory of ISN, Shenzhen CU-Xidian Joint Center, Xidian University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of ISN, Shenzhen CU-Xidian Joint Center, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049448415","display_name":"Huaxi Gu","orcid":"https://orcid.org/0000-0002-6409-2229"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huaxi Gu","raw_affiliation_strings":["State Key Laboratory of ISN, Shenzhen CU-Xidian Joint Center, Xidian University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of ISN, Shenzhen CU-Xidian Joint Center, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100402361","display_name":"Yintang Yang","orcid":"https://orcid.org/0000-0001-9745-5404"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yintang Yang","raw_affiliation_strings":["Institute of Microelectronics, Xidian University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Xidian University","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036631872","display_name":"Jian Qun Zhu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210105229","display_name":"City University of Hong Kong, Shenzhen Research Institute","ror":"https://ror.org/00xc0ma20","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210105229"]},{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Jian Zhu","raw_affiliation_strings":["Shenzhen Research Institute, CUHK"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shenzhen Research Institute, CUHK","institution_ids":["https://openalex.org/I4210105229","https://openalex.org/I889458895"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.1770459,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":95},"biblio":{"volume":"11","issue":"22","first_page":"20140876","last_page":"20140876"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9876000285148621,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7280179262161255},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.6555705666542053},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6026152968406677},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5737819671630859},{"id":"https://openalex.org/keywords/cluster","display_name":"Cluster (spacecraft)","score":0.5568417906761169},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5473905801773071},{"id":"https://openalex.org/keywords/network-on-a-chip","display_name":"Network on a chip","score":0.5249512195587158},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.49484628438949585},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.42606785893440247},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.39423924684524536},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3641427159309387},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2667018175125122},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.23038464784622192},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.20550602674484253},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1942174732685089},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11540371179580688},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09875950217247009},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.09631267189979553},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.06133714318275452}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7280179262161255},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.6555705666542053},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6026152968406677},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5737819671630859},{"id":"https://openalex.org/C164866538","wikidata":"https://www.wikidata.org/wiki/Q367351","display_name":"Cluster (spacecraft)","level":2,"score":0.5568417906761169},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5473905801773071},{"id":"https://openalex.org/C128519102","wikidata":"https://www.wikidata.org/wiki/Q339554","display_name":"Network on a chip","level":2,"score":0.5249512195587158},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.49484628438949585},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.42606785893440247},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.39423924684524536},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3641427159309387},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2667018175125122},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.23038464784622192},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.20550602674484253},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1942174732685089},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11540371179580688},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09875950217247009},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.09631267189979553},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.06133714318275452}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.11.20140876","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140876","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/22/11_11.20140876/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.11.20140876","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140876","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/22/11_11.20140876/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1474490597","display_name":null,"funder_award_id":"111 Project","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G1595715893","display_name":null,"funder_award_id":"B08038","funder_id":"https://openalex.org/F4320327912","funder_display_name":"Higher Education Discipline Innovation Project"},{"id":"https://openalex.org/G4553755634","display_name":null,"funder_award_id":"61472300 and 61334003","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4917983707","display_name":null,"funder_award_id":"No. B08038","funder_id":"https://openalex.org/F4320327912","funder_display_name":"Higher Education Discipline Innovation Project"},{"id":"https://openalex.org/G592831559","display_name":"\u5149\u7247\u4e0a\u7f51\u7edc\u5173\u952e\u95ee\u9898\u7684\u7814\u7a76","funder_award_id":"61472300","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6868587578","display_name":null,"funder_award_id":"Grant No. 61472300","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8295092359","display_name":"\u57fa\u4e8eTSV\u7684\u4e09\u7ef4\u96c6\u6210\u5173\u952e\u6280\u672f\u7814\u7a76","funder_award_id":"61334003","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8500871024","display_name":null,"funder_award_id":"B08038","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320327912","display_name":"Higher Education Discipline Innovation Project","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2139320851.pdf","grobid_xml":"https://content.openalex.org/works/W2139320851.grobid-xml"},"referenced_works_count":6,"referenced_works":["https://openalex.org/W2040486315","https://openalex.org/W2077505860","https://openalex.org/W2129296059","https://openalex.org/W2159218826","https://openalex.org/W3146108645","https://openalex.org/W3150214344"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2748443500","https://openalex.org/W2089377260","https://openalex.org/W2549021975","https://openalex.org/W2046139226","https://openalex.org/W2333804548","https://openalex.org/W2513353273","https://openalex.org/W2535331497","https://openalex.org/W2040486315"],"abstract_inverted_index":{"With":[0],"more":[1,3,53],"and":[2,59,75,117],"cores":[4,36],"integrated":[5],"in":[6],"a":[7,19,70,85,119],"single":[8],"chip,":[9],"three-dimensional":[10],"network-on-chip":[11],"(3D":[12],"NoC)":[13],"based":[14],"on":[15],"through-silicon-via":[16],"(TSV)":[17],"is":[18,66],"good":[20],"way":[21],"to":[22,38,55,68],"deal":[23],"with":[24],"the":[25,33,44,56,92,108,112],"problem":[26],"of":[27,35,47,62,94,114],"large":[28,45],"network":[29],"diameter.":[30],"But":[31],"if":[32],"number":[34,46,93],"increase":[37],"several":[39],"hundreds":[40],"or":[41],"even":[42],"thousands,":[43],"TSV":[48,95],"cannot":[49],"be":[50],"neglected":[51],"any":[52],"due":[54],"low":[57],"yield":[58,113],"high":[60],"overhead":[61],"TSV.":[63],"Therefore,":[64],"it":[65],"necessary":[67],"obtain":[69],"balance":[71],"point":[72],"between":[73],"cost":[74],"performance.":[76,121],"In":[77],"this":[78],"letter,":[79],"we":[80],"propose":[81],"H-cluster":[82,109],"that":[83,107],"applies":[84],"hybrid":[86],"vertical":[87,98,101],"interconnect":[88],"scheme.":[89],"It":[90],"minimizes":[91],"by":[96],"sharing":[97],"links":[99],"through":[100],"routers.":[102],"The":[103],"simulation":[104],"results":[105],"shows":[106],"can":[110],"improve":[111],"many-cores":[115],"chip":[116],"provide":[118],"better":[120]},"counts_by_year":[{"year":2021,"cited_by_count":2}],"updated_date":"2026-07-19T07:52:34.831488","created_date":"2025-10-10T00:00:00"}