{"id":"https://openalex.org/W2035479514","doi":"https://doi.org/10.1587/elex.11.20140256","title":"Optimization of flip-chip transitions for 60-GHz packages","display_name":"Optimization of flip-chip transitions for 60-GHz packages","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W2035479514","doi":"https://doi.org/10.1587/elex.11.20140256","mag":"2035479514"},"language":"en","primary_location":{"id":"doi:10.1587/elex.11.20140256","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140256","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/12/11_11.20140256/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/elex/11/12/11_11.20140256/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103063189","display_name":"Dong Gun Kam","orcid":"https://orcid.org/0000-0001-8882-567X"},"institutions":[{"id":"https://openalex.org/I57664883","display_name":"Ajou University","ror":"https://ror.org/03tzb2h73","country_code":"KR","type":"education","lineage":["https://openalex.org/I57664883"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Dong Gun Kam","raw_affiliation_strings":["Ajou University","[Ajou University]"],"affiliations":[{"raw_affiliation_string":"Ajou University","institution_ids":["https://openalex.org/I57664883"]},{"raw_affiliation_string":"[Ajou University]","institution_ids":["https://openalex.org/I57664883"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5103063189"],"corresponding_institution_ids":["https://openalex.org/I57664883"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":{"value":0.08969845,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"11","issue":"12","first_page":"20140256","last_page":"20140256"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9890999794006348,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9707000255584717,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.890489935874939},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.553778886795044},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5356872081756592},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4619951546192169},{"id":"https://openalex.org/keywords/flip","display_name":"Flip","score":0.4141031503677368},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4055517315864563},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.38768288493156433},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18781358003616333},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17981824278831482},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15376922488212585},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.07692164182662964}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.890489935874939},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.553778886795044},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5356872081756592},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4619951546192169},{"id":"https://openalex.org/C2776591724","wikidata":"https://www.wikidata.org/wiki/Q5459651","display_name":"Flip","level":3,"score":0.4141031503677368},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4055517315864563},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.38768288493156433},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18781358003616333},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17981824278831482},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15376922488212585},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.07692164182662964},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C190283241","wikidata":"https://www.wikidata.org/wiki/Q14599311","display_name":"Apoptosis","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1587/elex.11.20140256","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140256","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/12/11_11.20140256/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1587/elex.11.20140256","is_oa":true,"landing_page_url":"https://doi.org/10.1587/elex.11.20140256","pdf_url":"https://www.jstage.jst.go.jp/article/elex/11/12/11_11.20140256/_pdf","source":{"id":"https://openalex.org/S207433681","display_name":"IEICE Electronics Express","issn_l":"1349-2543","issn":["1349-2543","1349-9467"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4320800604","host_organization_name":"Institute of Electronics, Information and Communication Engineers","host_organization_lineage":["https://openalex.org/P4320800604"],"host_organization_lineage_names":["Institute of Electronics, Information and Communication Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEICE Electronics Express","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.6100000143051147,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G3927129353","display_name":null,"funder_award_id":"2012R1A2A2A01019150","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G4742417055","display_name":null,"funder_award_id":"2012R1A2A2A010","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G757400492","display_name":null,"funder_award_id":"2012R1A2A2A010","funder_id":"https://openalex.org/F4320320671","funder_display_name":"National Research Foundation"}],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2035479514.pdf","grobid_xml":"https://content.openalex.org/works/W2035479514.grobid-xml"},"referenced_works_count":6,"referenced_works":["https://openalex.org/W2047411474","https://openalex.org/W2096316670","https://openalex.org/W2107883202","https://openalex.org/W2107907423","https://openalex.org/W2126562357","https://openalex.org/W2137329916"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W4232272518","https://openalex.org/W2261056475","https://openalex.org/W2151795613","https://openalex.org/W2046757767"],"abstract_inverted_index":{"Although":[0],"flip-chip":[1,21,46],"transitions":[2],"have":[3],"smaller":[4],"parasitics":[5],"than":[6],"bonding":[7],"wires,":[8],"they":[9],"should":[10],"be":[11],"carefully":[12],"designed":[13],"at":[14,19],"60":[15],"GHz.":[16],"Insertion":[17],"loss":[18],"a":[20,39],"transition":[22],"may":[23],"differ":[24],"as":[25,27],"much":[26],"2":[28],"dB":[29],"depending":[30],"on":[31],"design":[32],"parameters.":[33],"In":[34],"this":[35],"paper":[36],"we":[37],"present":[38],"comprehensive":[40],"sensitivity":[41],"analysis":[42],"to":[43],"optimize":[44],"the":[45],"transition.":[47]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2026-04-10T15:06:20.359241","created_date":"2025-10-10T00:00:00"}