{"id":"https://openalex.org/W2030990973","doi":"https://doi.org/10.1364/ofc.2015.tu3i.1","title":"400-Gb/s Operation of Flip-chip Interconnection EADFB Laser Array Module","display_name":"400-Gb/s Operation of Flip-chip Interconnection EADFB Laser Array Module","publication_year":2015,"publication_date":"2015-01-01","ids":{"openalex":"https://openalex.org/W2030990973","doi":"https://doi.org/10.1364/ofc.2015.tu3i.1","mag":"2030990973"},"language":"en","primary_location":{"id":"doi:10.1364/ofc.2015.tu3i.1","is_oa":false,"landing_page_url":"https://doi.org/10.1364/ofc.2015.tu3i.1","pdf_url":null,"source":{"id":"https://openalex.org/S4306420648","display_name":"Optical Fiber Communication Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical Fiber Communication Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022205967","display_name":"Shigeru Kanazawa","orcid":"https://orcid.org/0000-0001-7606-6215"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Shigeru Kanazawa","raw_affiliation_strings":["NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001128299","display_name":"Takeshi Fujisawa","orcid":"https://orcid.org/0000-0002-1901-5531"},"institutions":[{"id":"https://openalex.org/I4210105847","display_name":"NTT Basic Research Laboratories","ror":"https://ror.org/01m2pas06","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210105847"]},{"id":"https://openalex.org/I205349734","display_name":"Hokkaido University","ror":"https://ror.org/02e16g702","country_code":"JP","type":"education","lineage":["https://openalex.org/I205349734"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takeshi Fujisawa","raw_affiliation_strings":["NTT Photonics Laboratories (currently: Hokkaido University), 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","NTT Photonics Laboratories, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Photonics Laboratories (currently: Hokkaido University), 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I4210105847","https://openalex.org/I205349734"]},{"raw_affiliation_string":"NTT Photonics Laboratories, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112243909","display_name":"Kiyoto Takahata","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kiyoto Takahata","raw_affiliation_strings":["NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052838072","display_name":"Hiroaki Sanjoh","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroaki Sanjoh","raw_affiliation_strings":["NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110506123","display_name":"R. Iga","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ryuzo Iga","raw_affiliation_strings":["NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]},{"raw_affiliation_string":"NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061354145","display_name":"Yuta Ueda","orcid":"https://orcid.org/0000-0003-0978-5126"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuta Ueda","raw_affiliation_strings":["NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069039507","display_name":"Wataru Kobayashi","orcid":"https://orcid.org/0009-0005-3993-1739"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Wataru Kobayashi","raw_affiliation_strings":["NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]},{"raw_affiliation_string":"NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101450886","display_name":"Hiroyuki Ishii","orcid":"https://orcid.org/0000-0002-1743-9197"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroyuki Ishii","raw_affiliation_strings":["NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan"],"affiliations":[{"raw_affiliation_string":"NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]},{"raw_affiliation_string":"NTT Device Technology Laboratories,, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi City, Kanagawa, Japan","institution_ids":["https://openalex.org/I2251713219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5022205967"],"corresponding_institution_ids":["https://openalex.org/I2251713219"],"apc_list":null,"apc_paid":null,"fwci":3.0634,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.91262729,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"Tu3I.1","last_page":"Tu3I.1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9884999990463257,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10232","display_name":"Optical Network Technologies","score":0.9460999965667725,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8108166456222534},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7184277176856995},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4871484935283661},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.45917844772338867},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.390264093875885},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37109994888305664},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37044358253479004},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18892884254455566},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11987730860710144}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8108166456222534},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7184277176856995},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4871484935283661},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.45917844772338867},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.390264093875885},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37109994888305664},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37044358253479004},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18892884254455566},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11987730860710144},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1364/ofc.2015.tu3i.1","is_oa":false,"landing_page_url":"https://doi.org/10.1364/ofc.2015.tu3i.1","pdf_url":null,"source":{"id":"https://openalex.org/S4306420648","display_name":"Optical Fiber Communication Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical Fiber Communication Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5899999737739563,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1964115162","https://openalex.org/W1988573052","https://openalex.org/W2011321271","https://openalex.org/W2025970967","https://openalex.org/W2028945843","https://openalex.org/W2137656600"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W1018338587","https://openalex.org/W2134878430","https://openalex.org/W4251140533","https://openalex.org/W2018755015"],"abstract_inverted_index":{"The":[0,10],"flip-chip":[1,11],"interconnection":[2,12],"8-channel":[3],"EADFB":[4],"laser":[5],"array":[6],"module":[7],"is":[8,23],"developed.":[9],"technique":[13],"provides":[14],"low":[15],"crosstalk.":[16],"After":[17],"10-km":[18],"transmission,":[19],"clear":[20],"eye":[21],"opening":[22],"obtained":[24],"for":[25],"all":[26],"eight":[27],"lanes":[28],"under":[29],"8":[30],"x":[31],"50-Gb/s":[32],"simultaneous":[33],"operation.":[34]},"counts_by_year":[{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}