{"id":"https://openalex.org/W2048730181","doi":"https://doi.org/10.1155/2014/470320","title":"Optimization of Process Parameters of Stamping Forming of the Automotive Lower Floor Board","display_name":"Optimization of Process Parameters of Stamping Forming of the Automotive Lower Floor Board","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W2048730181","doi":"https://doi.org/10.1155/2014/470320","mag":"2048730181"},"language":"en","primary_location":{"id":"doi:10.1155/2014/470320","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2014/470320","pdf_url":"https://downloads.hindawi.com/journals/jam/2014/470320.pdf","source":{"id":"https://openalex.org/S190082376","display_name":"Journal of Applied Mathematics","issn_l":"1110-757X","issn":["1110-757X","1687-0042"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Mathematics","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://downloads.hindawi.com/journals/jam/2014/470320.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101888229","display_name":"Guoying Ma","orcid":"https://orcid.org/0000-0001-8903-6365"},"institutions":[{"id":"https://openalex.org/I80143920","display_name":"Shandong University of Science and Technology","ror":"https://ror.org/04gtjhw98","country_code":"CN","type":"education","lineage":["https://openalex.org/I80143920"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guoying Ma","raw_affiliation_strings":["College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, China","institution_ids":["https://openalex.org/I80143920"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101581226","display_name":"Binbing Huang","orcid":"https://orcid.org/0000-0001-9011-7752"},"institutions":[{"id":"https://openalex.org/I80143920","display_name":"Shandong University of Science and Technology","ror":"https://ror.org/04gtjhw98","country_code":"CN","type":"education","lineage":["https://openalex.org/I80143920"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Binbing Huang","raw_affiliation_strings":["College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, China"],"raw_orcid":"https://orcid.org/0000-0001-9011-7752","affiliations":[{"raw_affiliation_string":"College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, China","institution_ids":["https://openalex.org/I80143920"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5101581226"],"corresponding_institution_ids":["https://openalex.org/I80143920"],"apc_list":{"value":1025,"currency":"USD","value_usd":1025},"apc_paid":{"value":1025,"currency":"USD","value_usd":1025},"fwci":1.1165,"has_fulltext":true,"cited_by_count":21,"citation_normalized_percentile":{"value":0.79303606,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"2014","issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10700","display_name":"Metal Forming Simulation Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10700","display_name":"Metal Forming Simulation Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13965","display_name":"Laser and Thermal Forming Techniques","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stamping","display_name":"Stamping","score":0.7720361948013306},{"id":"https://openalex.org/keywords/blank","display_name":"Blank","score":0.7506875395774841},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.6726129651069641},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.668170154094696},{"id":"https://openalex.org/keywords/research-object","display_name":"Research Object","score":0.6103386878967285},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5858408808708191},{"id":"https://openalex.org/keywords/forming-processes","display_name":"Forming processes","score":0.5364530682563782},{"id":"https://openalex.org/keywords/radius","display_name":"RADIUS","score":0.518207848072052},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.501763105392456},{"id":"https://openalex.org/keywords/process-optimization","display_name":"Process optimization","score":0.4811207354068756},{"id":"https://openalex.org/keywords/production-rate","display_name":"Production rate","score":0.4301064610481262},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.41958850622177124},{"id":"https://openalex.org/keywords/thickening","display_name":"Thickening","score":0.4170839190483093},{"id":"https://openalex.org/keywords/process-variable","display_name":"Process variable","score":0.41248786449432373},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.39155930280685425},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.36849290132522583},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3214643895626068},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.2921221852302551},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23865360021591187},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.19751140475273132}],"concepts":[{"id":"https://openalex.org/C144444463","wikidata":"https://www.wikidata.org/wiki/Q9363879","display_name":"Stamping","level":2,"score":0.7720361948013306},{"id":"https://openalex.org/C2778089247","wikidata":"https://www.wikidata.org/wiki/Q368951","display_name":"Blank","level":2,"score":0.7506875395774841},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.6726129651069641},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.668170154094696},{"id":"https://openalex.org/C2778631480","wikidata":"https://www.wikidata.org/wiki/Q17143022","display_name":"Research Object","level":2,"score":0.6103386878967285},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5858408808708191},{"id":"https://openalex.org/C139321929","wikidata":"https://www.wikidata.org/wiki/Q1363994","display_name":"Forming processes","level":2,"score":0.5364530682563782},{"id":"https://openalex.org/C178635117","wikidata":"https://www.wikidata.org/wiki/Q747499","display_name":"RADIUS","level":2,"score":0.518207848072052},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.501763105392456},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.4811207354068756},{"id":"https://openalex.org/C3020597237","wikidata":"https://www.wikidata.org/wiki/Q7798498","display_name":"Production rate","level":2,"score":0.4301064610481262},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.41958850622177124},{"id":"https://openalex.org/C2779559920","wikidata":"https://www.wikidata.org/wiki/Q911138","display_name":"Thickening","level":2,"score":0.4170839190483093},{"id":"https://openalex.org/C93228742","wikidata":"https://www.wikidata.org/wiki/Q7247312","display_name":"Process variable","level":3,"score":0.41248786449432373},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.39155930280685425},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.36849290132522583},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3214643895626068},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2921221852302551},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23865360021591187},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.19751140475273132},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C126348684","wikidata":"https://www.wikidata.org/wiki/Q3456979","display_name":"Polymer science","level":1,"score":0.0},{"id":"https://openalex.org/C87717796","wikidata":"https://www.wikidata.org/wiki/Q146326","display_name":"Environmental engineering","level":1,"score":0.0},{"id":"https://openalex.org/C148383697","wikidata":"https://www.wikidata.org/wiki/Q1781695","display_name":"Regional science","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1155/2014/470320","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2014/470320","pdf_url":"https://downloads.hindawi.com/journals/jam/2014/470320.pdf","source":{"id":"https://openalex.org/S190082376","display_name":"Journal of Applied Mathematics","issn_l":"1110-757X","issn":["1110-757X","1687-0042"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Mathematics","raw_type":"journal-article"},{"id":"pmh:oai:CULeuclid:euclid.jam/1425305982","is_oa":false,"landing_page_url":"https://projecteuclid.org/euclid.jam/1425305982","pdf_url":null,"source":{"id":"https://openalex.org/S4306400787","display_name":"Project Euclid (Cornell University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"},{"id":"pmh:oai:RePEc:hin:jnljam:470320","is_oa":false,"landing_page_url":"http://downloads.hindawi.com/journals/JAM/2014/470320.xml","pdf_url":null,"source":{"id":"https://openalex.org/S4306401271","display_name":"RePEc: Research Papers in Economics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I77793887","host_organization_name":"Federal Reserve Bank of St. Louis","host_organization_lineage":["https://openalex.org/I77793887"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article"},{"id":"pmh:oai:doaj.org/article:b319defe841b4ab48cb0151f6179e40d","is_oa":true,"landing_page_url":"https://doaj.org/article/b319defe841b4ab48cb0151f6179e40d","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Journal of Applied Mathematics, Vol 2014 (2014)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1155/2014/470320","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2014/470320","pdf_url":"https://downloads.hindawi.com/journals/jam/2014/470320.pdf","source":{"id":"https://openalex.org/S190082376","display_name":"Journal of Applied Mathematics","issn_l":"1110-757X","issn":["1110-757X","1687-0042"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Mathematics","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320311026","display_name":"Shandong University","ror":"https://ror.org/0207yh398"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2048730181.pdf","grobid_xml":"https://content.openalex.org/works/W2048730181.grobid-xml"},"referenced_works_count":16,"referenced_works":["https://openalex.org/W59672380","https://openalex.org/W2001580740","https://openalex.org/W2005312433","https://openalex.org/W2031929544","https://openalex.org/W2063027757","https://openalex.org/W2070827636","https://openalex.org/W2072091014","https://openalex.org/W2076303144","https://openalex.org/W2083999538","https://openalex.org/W2086692388","https://openalex.org/W2094742632","https://openalex.org/W2097492483","https://openalex.org/W2109333464","https://openalex.org/W2364972840","https://openalex.org/W2374113823","https://openalex.org/W2390200852"],"related_works":["https://openalex.org/W178007415","https://openalex.org/W4205304553","https://openalex.org/W4386517039","https://openalex.org/W2637413830","https://openalex.org/W4360908919","https://openalex.org/W2791938227","https://openalex.org/W2809566464","https://openalex.org/W1964414983","https://openalex.org/W1996895502","https://openalex.org/W2349334963"],"abstract_inverted_index":{"There":[0],"are":[1,94],"many":[2],"process":[3,34,48,145],"parameters":[4,49,105],"which":[5],"have":[6],"great":[7],"effect":[8],"on":[9,63,76,91],"the":[10,29,32,64,69,83,92,100,103,110,117,133,137,140,143,152,157,162],"forming":[11,19,33,144],"quality":[12,112],"of":[13,45,85,88,102,142],"parts":[14],"during":[15],"automobile":[16],"panel":[17],"stamping":[18],"process.":[20],"This":[21],"paper":[22],"took":[23],"automotive":[24],"lower":[25],"floor":[26],"board":[27],"as":[28],"research":[30],"object;":[31],"was":[35,106,114],"analyzed":[36],"by":[37],"finite":[38],"element":[39],"simulation":[40,134],"using":[41],"Dynaform.":[42],"The":[43,79,128],"influences":[44,84],"four":[46,104],"main":[47],"including":[50],"BHF":[51],"(blank":[52],"holder":[53],"force),":[54],"die":[55,61,153],"corner":[56],"radius,":[57],"friction":[58],"coefficient,":[59],"and":[60,68,109,116,121,147,160],"clearance":[62],"maximum":[65,70,118,122],"thinning":[66,119],"rate":[67,72,120,124],"thickening":[71,123],"were":[73,125],"researched":[74],"based":[75],"orthogonal":[77],"experiment.":[78],"results":[80,129],"show":[81,131],"that":[82,132],"each":[86],"value":[87],"various":[89],"factors":[90],"target":[93],"not":[95],"identical.":[96],"On":[97],"this":[98],"basis,":[99],"optimization":[101,141],"carried":[107],"out,":[108],"high":[111],"product":[113],"obtained":[115],"effectively":[126],"controlled.":[127],"also":[130],"analysis":[135],"provides":[136],"basis":[138],"for":[139],"parameters,":[146],"it":[148],"can":[149],"greatly":[150],"shorten":[151],"manufacturing":[154],"cycles,":[155],"reduce":[156],"production":[158,163],"costs,":[159],"improve":[161],"efficiency.":[164]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":6},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2025-10-10T00:00:00"}