{"id":"https://openalex.org/W2566815628","doi":"https://doi.org/10.1155/2016/2897541","title":"Embeddable Advanced Sensors for Harsh Environment Sensing Applications","display_name":"Embeddable Advanced Sensors for Harsh Environment Sensing Applications","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2566815628","doi":"https://doi.org/10.1155/2016/2897541","mag":"2566815628"},"language":"en","primary_location":{"id":"doi:10.1155/2016/2897541","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2016/2897541","pdf_url":"http://downloads.hindawi.com/journals/js/2016/2897541.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"http://downloads.hindawi.com/journals/js/2016/2897541.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100633051","display_name":"Lei Yuan","orcid":null},"institutions":[{"id":"https://openalex.org/I8078737","display_name":"Clemson University","ror":"https://ror.org/037s24f05","country_code":"US","type":"education","lineage":["https://openalex.org/I8078737"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Lei Yuan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634, USA"],"raw_orcid":"https://orcid.org/0000-0003-0826-648X","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634, USA","institution_ids":["https://openalex.org/I8078737"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100426670","display_name":"Yinan Zhang","orcid":"https://orcid.org/0000-0003-3450-6555"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yinan Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO 65409, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO 65409, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yan Lu","orcid":"https://orcid.org/0000-0002-3479-4385"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yan Lu","raw_affiliation_strings":["Research Center of Nondestructive Testing & Evaluation, Beijing University of Technology, Beijing 100124, China"],"raw_orcid":"https://orcid.org/0000-0002-3479-4385","affiliations":[{"raw_affiliation_string":"Research Center of Nondestructive Testing & Evaluation, Beijing University of Technology, Beijing 100124, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068812571","display_name":"Xiaobei Zhang","orcid":"https://orcid.org/0000-0002-9228-8720"},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaobei Zhang","raw_affiliation_strings":["School of Communication and Information Engineering, Shanghai University, Shanghai 200072, China"],"raw_orcid":"https://orcid.org/0000-0002-9228-8720","affiliations":[{"raw_affiliation_string":"School of Communication and Information Engineering, Shanghai University, Shanghai 200072, China","institution_ids":["https://openalex.org/I113940042"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100429673","display_name":"Mengmeng Wang","orcid":"https://orcid.org/0000-0002-8148-905X"},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mengmeng Wang","raw_affiliation_strings":["Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100633051"],"corresponding_institution_ids":["https://openalex.org/I8078737"],"apc_list":{"value":2100,"currency":"USD","value_usd":2100},"apc_paid":{"value":2100,"currency":"USD","value_usd":2100},"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1492722,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2016","issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10461","display_name":"Gas Sensing Nanomaterials and Sensors","score":0.7921000123023987,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10461","display_name":"Gas Sensing Nanomaterials and Sensors","score":0.7921000123023987,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3740229606628418},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.37115198373794556},{"id":"https://openalex.org/keywords/remote-sensing","display_name":"Remote sensing","score":0.32847368717193604},{"id":"https://openalex.org/keywords/geography","display_name":"Geography","score":0.09874242544174194}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3740229606628418},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.37115198373794556},{"id":"https://openalex.org/C62649853","wikidata":"https://www.wikidata.org/wiki/Q199687","display_name":"Remote sensing","level":1,"score":0.32847368717193604},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.09874242544174194}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1155/2016/2897541","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2016/2897541","pdf_url":"http://downloads.hindawi.com/journals/js/2016/2897541.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},{"id":"pmh:oai:digitalcommons.unl.edu:electricalengineeringfacpub-1467","is_oa":false,"landing_page_url":"https://digitalcommons.unl.edu/electricalengineeringfacpub/465","pdf_url":null,"source":{"id":"https://openalex.org/S4306513441","display_name":"Insecta mundi","issn_l":"0749-6737","issn":["0749-6737","1942-1354","1942-1362"],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310316217","host_organization_name":"Center for Systematic Entomology","host_organization_lineage":["https://openalex.org/P4310316217"],"host_organization_lineage_names":["Center for Systematic Entomology"],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Faculty Publications from the Department of Electrical and Computer Engineering","raw_type":"text"},{"id":"pmh:oai:doaj.org/article:34096f1cba5e4a8690e266493cc58afb","is_oa":true,"landing_page_url":"https://doaj.org/article/34096f1cba5e4a8690e266493cc58afb","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Journal of Sensors, Vol 2016 (2016)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1155/2016/2897541","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2016/2897541","pdf_url":"http://downloads.hindawi.com/journals/js/2016/2897541.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2566815628.pdf","grobid_xml":"https://content.openalex.org/works/W2566815628.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Research":[0],"and":[1,32,52,78,99,108],"development":[2,74],"in":[3,14,22,44,61,67],"advanced":[4,86,94],"sensors":[5,38,95],"with":[6,36,39],"embedded":[7],"monitoring":[8],"capability":[9],"have":[10],"experienced":[11],"significant":[12],"growth":[13],"recent":[15,42],"years,":[16],"fueled":[17],"by":[18],"their":[19],"broad":[20],"applications":[21],"real-time":[23],"measurement":[24],"of":[25,29,64,75,84,92],"a":[26,58],"wide":[27],"variety":[28],"physical,":[30],"chemical,":[31],"biological":[33],"quantities.":[34],"Compared":[35],"conventional":[37],"bulky":[40],"assemblies,":[41],"progress":[43],"3D":[45],"manufacturing":[46,87],"technologies":[47],"(e.g.,":[48],"ultrafast":[49],"laser":[50],"micromachining":[51],"additive":[53],"manufacturing)":[54],"has":[55],"opened":[56],"up":[57],"new":[59],"avenue":[60],"one-step":[62],"fabrication":[63],"assembly-freemicro":[65],"devices":[66],"various":[68],"materials":[69],"as":[70,72],"well":[71],"the":[73,90],"compact,":[76],"customized,":[77],"intricate":[79],"smart":[80,97],"structures/components.":[81],"The":[82],"merits":[83],"these":[85],"techniques":[88],"enable":[89],"integration":[91],"embeddable":[93],"into":[96],"structures":[98],"components":[100],"for":[101],"improved":[102],"robustness,":[103],"enriched":[104],"functionality,":[105],"enhanced":[106],"intelligence,":[107],"unprecedented":[109],"performance.":[110]},"counts_by_year":[],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}