{"id":"https://openalex.org/W1985453392","doi":"https://doi.org/10.1155/2010/625325","title":"A Novel Manufacturing Technology for RF MEMS Devices on Ceramic Substrates","display_name":"A Novel Manufacturing Technology for RF MEMS Devices on Ceramic Substrates","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W1985453392","doi":"https://doi.org/10.1155/2010/625325","mag":"1985453392"},"language":"en","primary_location":{"id":"doi:10.1155/2010/625325","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2010/625325","pdf_url":"https://downloads.hindawi.com/journals/js/2010/625325.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://downloads.hindawi.com/journals/js/2010/625325.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5018658255","display_name":"V. Schirosi","orcid":"https://orcid.org/0000-0002-0380-7876"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"V. Schirosi","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028263522","display_name":"G. Del Re","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"G. Del Re","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047258457","display_name":"L. Ferrari","orcid":"https://orcid.org/0000-0002-5251-7138"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Ferrari","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035271248","display_name":"Priscilla Caliandro","orcid":"https://orcid.org/0000-0002-6819-5057"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"P. Caliandro","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037825196","display_name":"Leonardo Rizzi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Rizzi","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068929569","display_name":"G. Melone","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"G. Melone","raw_affiliation_strings":["Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca, S.S. 7 Km 7.3, 72100 Brindisi, Italy","institution_ids":["https://openalex.org/I4210165120"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5018658255"],"corresponding_institution_ids":["https://openalex.org/I4210165120"],"apc_list":{"value":2100,"currency":"USD","value_usd":2100},"apc_paid":{"value":2100,"currency":"USD","value_usd":2100},"fwci":0.0,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.07070053,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":97},"biblio":{"volume":"2010","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8210005760192871},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.7678197622299194},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7350005507469177},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.5177306532859802},{"id":"https://openalex.org/keywords/reproducibility","display_name":"Reproducibility","score":0.511989414691925},{"id":"https://openalex.org/keywords/isolation","display_name":"Isolation (microbiology)","score":0.48084768652915955},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4196825623512268},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3718099594116211},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3666437864303589},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.35704630613327026},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3485877513885498},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3401736617088318},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2645392417907715},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.057753801345825195},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.05132672190666199}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8210005760192871},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.7678197622299194},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7350005507469177},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.5177306532859802},{"id":"https://openalex.org/C9893847","wikidata":"https://www.wikidata.org/wiki/Q1425625","display_name":"Reproducibility","level":2,"score":0.511989414691925},{"id":"https://openalex.org/C2775941552","wikidata":"https://www.wikidata.org/wiki/Q25212305","display_name":"Isolation (microbiology)","level":2,"score":0.48084768652915955},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4196825623512268},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3718099594116211},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3666437864303589},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35704630613327026},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3485877513885498},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3401736617088318},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2645392417907715},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.057753801345825195},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.05132672190666199},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C89423630","wikidata":"https://www.wikidata.org/wiki/Q7193","display_name":"Microbiology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1155/2010/625325","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2010/625325","pdf_url":"https://downloads.hindawi.com/journals/js/2010/625325.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:401a9d864ea1436c9b77327cd0bf917c","is_oa":true,"landing_page_url":"https://doaj.org/article/401a9d864ea1436c9b77327cd0bf917c","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Journal of Sensors, Vol 2010 (2010)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1155/2010/625325","is_oa":true,"landing_page_url":"https://doi.org/10.1155/2010/625325","pdf_url":"https://downloads.hindawi.com/journals/js/2010/625325.pdf","source":{"id":"https://openalex.org/S96783963","display_name":"Journal of Sensors","issn_l":"1687-725X","issn":["1687-725X","1687-7268"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Sensors","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321873","display_name":"Ministero dell\u2019Istruzione, dell\u2019Universit\u00e0 e della Ricerca","ror":"https://ror.org/0166hxq48"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1985453392.pdf","grobid_xml":"https://content.openalex.org/works/W1985453392.grobid-xml"},"referenced_works_count":7,"referenced_works":["https://openalex.org/W1571022510","https://openalex.org/W1619518041","https://openalex.org/W1987425437","https://openalex.org/W2018150592","https://openalex.org/W2103344824","https://openalex.org/W2115307551","https://openalex.org/W2168822292"],"related_works":["https://openalex.org/W2413717610","https://openalex.org/W1973270181","https://openalex.org/W2417696084","https://openalex.org/W2368782778","https://openalex.org/W2087830269","https://openalex.org/W3106281778","https://openalex.org/W2003643616","https://openalex.org/W638612878","https://openalex.org/W4324138256","https://openalex.org/W2140154150"],"abstract_inverted_index":{"Microelectromechanical":[0],"systems":[1],"are":[2,27],"often":[3],"used":[4],"for":[5,16],"their":[6,30],"enormous":[7],"capability":[8],"and":[9,22,40,43,50],"good":[10,48],"qualities":[11],"in":[12],"T/R":[13],"modules":[14],"especially":[15],"space":[17],"modular":[18],"applications.":[19],"High":[20],"isolation":[21],"very":[23,37],"low":[24],"insertion":[25],"loss":[26],"guaranteed":[28],"by":[29],"intrinsic":[31],"working":[32],"principle.":[33],"This":[34],"is":[35],"a":[36],"robust,":[38],"flexible,":[39],"low-cost":[41],"technology,":[42],"it":[44],"provides":[45],"high":[46],"reliability,":[47],"reproducibility,":[49],"complete":[51],"fulfillment":[52],"of":[53],"technical":[54],"requirements.":[55]},"counts_by_year":[{"year":2016,"cited_by_count":3}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2025-10-10T00:00:00"}