{"id":"https://openalex.org/W4247466972","doi":"https://doi.org/10.1155/1998/42156","title":"Guest Editorial","display_name":"Guest Editorial","publication_year":1998,"publication_date":"1998-01-01","ids":{"openalex":"https://openalex.org/W4247466972","doi":"https://doi.org/10.1155/1998/42156"},"language":"en","primary_location":{"id":"doi:10.1155/1998/42156","is_oa":true,"landing_page_url":"http://doi.org/10.1155/1998/42156","pdf_url":"https://downloads.hindawi.com/archive/1998/042156.pdf","source":{"id":"https://openalex.org/S81291924","display_name":"VLSI design","issn_l":"1026-7123","issn":["1026-7123","1065-514X","1563-5171"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"VLSI Design","raw_type":"journal-article"},"type":"editorial","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://downloads.hindawi.com/archive/1998/042156.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089881278","display_name":"Farid N. Najm","orcid":"https://orcid.org/0000-0001-5393-7794"},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Farid N. Najm","raw_affiliation_strings":["aDepartment of Electrical/Computer Engineering, University of Illinois, Urbana-Champaign, lllinois 61801; bMotorola Tempe, Arizona 85284"],"affiliations":[{"raw_affiliation_string":"aDepartment of Electrical/Computer Engineering, University of Illinois, Urbana-Champaign, lllinois 61801; bMotorola Tempe, Arizona 85284","institution_ids":["https://openalex.org/I157725225","https://openalex.org/I1333370159"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110117527","display_name":"Gary Yeap","orcid":"https://orcid.org/0000-0001-7080-4416"},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]},{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gary Yeap","raw_affiliation_strings":["aDepartment of Electrical/Computer Engineering, University of Illinois, Urbana-Champaign, lllinois 61801; bMotorola Tempe, Arizona 85284"],"affiliations":[{"raw_affiliation_string":"aDepartment of Electrical/Computer Engineering, University of Illinois, Urbana-Champaign, lllinois 61801; bMotorola Tempe, Arizona 85284","institution_ids":["https://openalex.org/I157725225","https://openalex.org/I1333370159"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5089881278"],"corresponding_institution_ids":["https://openalex.org/I1333370159","https://openalex.org/I157725225"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.94304203,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":null,"biblio":{"volume":"7","issue":"3","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13638","display_name":"Human auditory perception and evaluation","score":0.003000000026077032,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13638","display_name":"Human auditory perception and evaluation","score":0.003000000026077032,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13370","display_name":"Diverse Scientific and Economic Studies","score":0.0024999999441206455,"subfield":{"id":"https://openalex.org/subfields/2002","display_name":"Economics and Econometrics"},"field":{"id":"https://openalex.org/fields/20","display_name":"Economics, Econometrics and Finance"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T12705","display_name":"Educational Reforms and Innovations","score":0.002099999925121665,"subfield":{"id":"https://openalex.org/subfields/2307","display_name":"Health, Toxicology and Mutagenesis"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46655982732772827}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46655982732772827}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1155/1998/42156","is_oa":true,"landing_page_url":"http://doi.org/10.1155/1998/42156","pdf_url":"https://downloads.hindawi.com/archive/1998/042156.pdf","source":{"id":"https://openalex.org/S81291924","display_name":"VLSI design","issn_l":"1026-7123","issn":["1026-7123","1065-514X","1563-5171"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"VLSI Design","raw_type":"journal-article"},{"id":"pmh:oai:hindawi.com:10.1155/1998/42156","is_oa":true,"landing_page_url":"https://doi.org/10.1155/1998/42156","pdf_url":null,"source":{"id":"https://openalex.org/S4306400340","display_name":"Hindawi Journal of Chemistry (Hindawi)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210126990","host_organization_name":"Hindawi (United Kingdom)","host_organization_lineage":["https://openalex.org/I4210126990"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""}],"best_oa_location":{"id":"doi:10.1155/1998/42156","is_oa":true,"landing_page_url":"http://doi.org/10.1155/1998/42156","pdf_url":"https://downloads.hindawi.com/archive/1998/042156.pdf","source":{"id":"https://openalex.org/S81291924","display_name":"VLSI design","issn_l":"1026-7123","issn":["1026-7123","1065-514X","1563-5171"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319869","host_organization_name":"Hindawi Publishing Corporation","host_organization_lineage":["https://openalex.org/P4310319869"],"host_organization_lineage_names":["Hindawi Publishing Corporation"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"VLSI Design","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4247466972.pdf","grobid_xml":"https://content.openalex.org/works/W4247466972.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052","https://openalex.org/W2382290278","https://openalex.org/W4395014643"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-03-03T08:47:05.690250","created_date":"2022-05-12T00:00:00"}