{"id":"https://openalex.org/W2071003187","doi":"https://doi.org/10.1147/rd.504.0491","title":"Three-dimensional integrated circuits","display_name":"Three-dimensional integrated circuits","publication_year":2006,"publication_date":"2006-07-01","ids":{"openalex":"https://openalex.org/W2071003187","doi":"https://doi.org/10.1147/rd.504.0491","mag":"2071003187"},"language":"en","primary_location":{"id":"doi:10.1147/rd.504.0491","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.504.0491","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058389051","display_name":"Anna W. Topol","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"A. W. Topol","raw_affiliation_strings":["IBM Systems and Technology Group, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085613015","display_name":"Douglas Charles La Tulipe","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. C. La Tulipe","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":null,"display_name":"L. Shi","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. Shi","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103165193","display_name":"D.J. Frank","orcid":"https://orcid.org/0009-0004-2536-4086"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. J. Frank","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110939296","display_name":"K. Bernstein","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Bernstein","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077527432","display_name":"S.E. Steen","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. E. Steen","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101937651","display_name":"Amitesh Kumar","orcid":"https://orcid.org/0000-0002-9439-5714"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Kumar","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024239201","display_name":"G. Singco","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. U. Singco","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026102128","display_name":"Anthony Young","orcid":"https://orcid.org/0000-0001-8485-2056"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. M. Young","raw_affiliation_strings":["IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM Research Division, Thomas J. Watson Research Center, P, O. Box 218, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062015814","display_name":"K.W. Guarini","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. W. Guarini","raw_affiliation_strings":["IBM Corporate Division, 294 Route 100, Somers, New York 10598, USA"],"affiliations":[{"raw_affiliation_string":"IBM Corporate Division, 294 Route 100, Somers, New York 10598, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113520233","display_name":"M. Ieong","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Ieong","raw_affiliation_strings":["IBM Research Division, 2070 Route 52, Hopewell Junction, New York 12533, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Division, 2070 Route 52, Hopewell Junction, New York 12533, USA","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5058389051"],"corresponding_institution_ids":["https://openalex.org/I4210114115"],"apc_list":null,"apc_paid":null,"fwci":43.283,"has_fulltext":false,"cited_by_count":700,"citation_normalized_percentile":{"value":0.9993788,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":99,"max":100},"biblio":{"volume":"50","issue":"4.5","first_page":"491","last_page":"506"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.65028315782547},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6385791301727295},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5584233999252319},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.5209616422653198},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.516300618648529},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5061768889427185},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.47562816739082336},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4577537775039673},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4566452205181122},{"id":"https://openalex.org/keywords/ibm","display_name":"IBM","score":0.4564724862575531},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4459284245967865},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4102594256401062},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.39942222833633423},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37426501512527466},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.296508252620697},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.24148046970367432},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23549139499664307},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22019225358963013},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10207438468933105}],"concepts":[{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.65028315782547},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6385791301727295},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5584233999252319},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.5209616422653198},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.516300618648529},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5061768889427185},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.47562816739082336},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4577537775039673},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4566452205181122},{"id":"https://openalex.org/C70388272","wikidata":"https://www.wikidata.org/wiki/Q5968558","display_name":"IBM","level":2,"score":0.4564724862575531},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4459284245967865},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4102594256401062},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39942222833633423},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37426501512527466},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.296508252620697},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.24148046970367432},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23549139499664307},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22019225358963013},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10207438468933105},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1147/rd.504.0491","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.504.0491","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5199999809265137,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":51,"referenced_works":["https://openalex.org/W1001481394","https://openalex.org/W1480241814","https://openalex.org/W1488158583","https://openalex.org/W1490517899","https://openalex.org/W1511925244","https://openalex.org/W1512475422","https://openalex.org/W1531690277","https://openalex.org/W1531707220","https://openalex.org/W1559076114","https://openalex.org/W1563992694","https://openalex.org/W1605711829","https://openalex.org/W1678873434","https://openalex.org/W1707477887","https://openalex.org/W1827061992","https://openalex.org/W1831416269","https://openalex.org/W1858595867","https://openalex.org/W1946979721","https://openalex.org/W2005389841","https://openalex.org/W2027918523","https://openalex.org/W2049884414","https://openalex.org/W2069183011","https://openalex.org/W2082882799","https://openalex.org/W2101609668","https://openalex.org/W2102081731","https://openalex.org/W2104084234","https://openalex.org/W2106190230","https://openalex.org/W2107398534","https://openalex.org/W2118608821","https://openalex.org/W2120149280","https://openalex.org/W2122596846","https://openalex.org/W2132729131","https://openalex.org/W2137390828","https://openalex.org/W2137711607","https://openalex.org/W2144149750","https://openalex.org/W2162301048","https://openalex.org/W2197333336","https://openalex.org/W2207279993","https://openalex.org/W2219989615","https://openalex.org/W2301567394","https://openalex.org/W2404556792","https://openalex.org/W2460731484","https://openalex.org/W2532146322","https://openalex.org/W2536886358","https://openalex.org/W2538857334","https://openalex.org/W2539427017","https://openalex.org/W2540017021","https://openalex.org/W2540160898","https://openalex.org/W2772321513","https://openalex.org/W2992356171","https://openalex.org/W3004436853","https://openalex.org/W3102158487"],"related_works":["https://openalex.org/W2534942874","https://openalex.org/W1988354418","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2376702355","https://openalex.org/W3093450488","https://openalex.org/W4385062230","https://openalex.org/W4237709086"],"abstract_inverted_index":{"Three-dimensional":[0],"(3D)":[1],"integrated":[2],"circuits":[3,65],"(ICs),":[4],"which":[5],"contain":[6],"multiple":[7,67],"layers":[8,68,217],"of":[9,36,52,69,113,143,159,195],"active":[10,70],"devices,":[11,39],"have":[12,122],"the":[13,34,60,110,128,141,157,193,211,215,220],"potential":[14],"to":[15,63,139,165],"dramatically":[16],"enhance":[17],"chip":[18],"performance,":[19],"functionality,":[20],"and":[21,31,40,92,116,119,131,173,185,189,233],"device":[22,145,206],"packing":[23],"density.":[24],"They":[25],"also":[26,84],"provide":[27],"for":[28,104,178,192],"microchip":[29],"architecture":[30],"may":[32],"facilitate":[33],"integration":[35],"heterogeneous":[37],"materials,":[38],"signals.":[41],"However,":[42],"before":[43],"these":[44,97],"advantages":[45],"can":[46],"be":[47,56,73],"realized,":[48],"key":[49],"technology":[50],"challenges":[51],"3D":[53,106],"ICs":[54,107],"must":[55,72,83],"addressed.":[57],"More":[58],"specifically,":[59],"processes":[61,82],"required":[62],"build":[64],"with":[66,75],"devices":[71],"compatible":[74],"current":[76],"state-of-the-art":[77],"silicon":[78],"processing":[79],"technology.":[80],"These":[81],"show":[85],"manufacturability,":[86],"i.e.,":[87],"reliability,":[88],"good":[89],"yield,":[90],"maturity,":[91],"reasonable":[93],"cost.":[94],"To":[95],"meet":[96],"requirements,":[98],"IBM":[99,138],"has":[100],"introduced":[101],"a":[102,161,186],"scheme":[103],"building":[105],"based":[108],"on":[109],"layer":[111,151],"transfer":[112,152],"functional":[114],"circuits,":[115],"many":[117],"process":[118,129,153,164,209],"design":[120,132],"innovations":[121],"been":[123],"implemented.":[124],"This":[125,208],"paper":[126],"reviews":[127],"steps":[130],"aspects":[133],"that":[134],"were":[135],"developed":[136],"at":[137],"enable":[140,166],"formation":[142],"stacked":[144,205,216],"layers.":[146,207],"Details":[147],"regarding":[148],"an":[149],"optimized":[150],"are":[154],"presented,":[155],"including":[156],"descriptions":[158],"1)":[160],"glass":[162],"substrate":[163],"through-wafer":[167],"alignment;":[168],"2)":[169],"oxide":[170],"fusion":[171],"bonding":[172],"wafer":[174],"bow":[175],"compensation":[176],"methods":[177],"improved":[179],"alignment":[180,237],"tolerance":[181],"during":[182],"bonding;":[183],"3)":[184],"single-damascene":[187],"patterning":[188],"metallization":[190],"method":[191],"creation":[194],"high-aspect-ratio":[196],"(6:1":[197],"<":[198,200],"AR":[199],"11:1)":[201],"contacts":[202],"between":[203,214],"two":[204],"provides":[210],"shortest":[212],"distance":[213],"(<2":[218],"\u00b5m),":[219],"highest":[221],"interconnection":[222],"density":[223],"(>10":[224],"<sup":[225,229],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[226,230],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">8</sup>":[227],"vias/cm":[228],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[231],"),":[232],"extremely":[234],"aggressive":[235],"wafer-to-wafer":[236],"(submicron)":[238],"capability.":[239]},"counts_by_year":[{"year":2026,"cited_by_count":4},{"year":2025,"cited_by_count":20},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":20},{"year":2022,"cited_by_count":16},{"year":2021,"cited_by_count":19},{"year":2020,"cited_by_count":25},{"year":2019,"cited_by_count":22},{"year":2018,"cited_by_count":32},{"year":2017,"cited_by_count":37},{"year":2016,"cited_by_count":41},{"year":2015,"cited_by_count":44},{"year":2014,"cited_by_count":53},{"year":2013,"cited_by_count":64},{"year":2012,"cited_by_count":62}],"updated_date":"2026-04-21T08:09:41.155169","created_date":"2025-10-10T00:00:00"}