{"id":"https://openalex.org/W2003388450","doi":"https://doi.org/10.1147/rd.464.0397","title":"First- and second-level packaging for the IBM eServer z900","display_name":"First- and second-level packaging for the IBM eServer z900","publication_year":2002,"publication_date":"2002-07-01","ids":{"openalex":"https://openalex.org/W2003388450","doi":"https://doi.org/10.1147/rd.464.0397","mag":"2003388450"},"language":"en","primary_location":{"id":"doi:10.1147/rd.464.0397","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.464.0397","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043779621","display_name":"H. Harrer","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210095996","display_name":"IBM (Germany)","ror":"https://ror.org/00pm7rm97","country_code":"DE","type":"company","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210095996"]}],"countries":["DE","US"],"is_corresponding":true,"raw_author_name":"H. Harrer","raw_affiliation_strings":["IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","IBM Deutschland Entwicklung GmbH, Boeblingen, Germany#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM Deutschland Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","institution_ids":["https://openalex.org/I4210095996"]},{"raw_affiliation_string":"IBM Deutschland Entwicklung GmbH, Boeblingen, Germany#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080192149","display_name":"H. Pross","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095996","display_name":"IBM (Germany)","ror":"https://ror.org/00pm7rm97","country_code":"DE","type":"company","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210095996"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"H. Pross","raw_affiliation_strings":["IBM Enterprise Server Group, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","IBM Enterprise Server Group, Boeblingen, Germany#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM Enterprise Server Group, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","institution_ids":["https://openalex.org/I4210095996"]},{"raw_affiliation_string":"IBM Enterprise Server Group, Boeblingen, Germany#TAB#","institution_ids":["https://openalex.org/I4210095996"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109871809","display_name":"T.-M. Winkel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095996","display_name":"IBM (Germany)","ror":"https://ror.org/00pm7rm97","country_code":"DE","type":"company","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210095996"]},{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"T.-M. Winkel","raw_affiliation_strings":["IBM System/390 Division, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","IBM System, Boeblingen, Germany"],"affiliations":[{"raw_affiliation_string":"IBM System/390 Division, Schoenaicherstrasse 220, 71032 Boeblingen, Germany","institution_ids":["https://openalex.org/I4210095996"]},{"raw_affiliation_string":"IBM System, Boeblingen, Germany","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061478328","display_name":"Dale Becker","orcid":"https://orcid.org/0000-0003-2266-3123"},"institutions":[{"id":"https://openalex.org/I4210091433","display_name":"Poughkeepsie Public Library District","ror":"https://ror.org/001vaag74","country_code":"US","type":"archive","lineage":["https://openalex.org/I4210091433"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. D. Becker","raw_affiliation_strings":["IBM System/390 Division, 2455 South Road, Poughkeepsie, New York 12601, USA","IBM System, Poughkeepsie, New York"],"affiliations":[{"raw_affiliation_string":"IBM System/390 Division, 2455 South Road, Poughkeepsie, New York 12601, USA","institution_ids":["https://openalex.org/I4210091433"]},{"raw_affiliation_string":"IBM System, Poughkeepsie, New York","institution_ids":["https://openalex.org/I4210091433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086704656","display_name":"H. Stoller","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. I. Stoller","raw_affiliation_strings":["IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA","IBM Microelectronics Division, Hopewell Junction, New York"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM Microelectronics Division, Hopewell Junction, New York","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075759971","display_name":"M. Yamamoto","orcid":"https://orcid.org/0000-0003-1936-8131"},"institutions":[{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Yamamoto","raw_affiliation_strings":["Hitachi Enterprise Server Division, Horiyamashita 1, Hadano, Kanagawa 259-1392, Japan","Hitachi Enterprise Server Division, Kanagawa, Japan#TAB#"],"affiliations":[{"raw_affiliation_string":"Hitachi Enterprise Server Division, Horiyamashita 1, Hadano, Kanagawa 259-1392, Japan","institution_ids":["https://openalex.org/I65143321"]},{"raw_affiliation_string":"Hitachi Enterprise Server Division, Kanagawa, Japan#TAB#","institution_ids":["https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017496507","display_name":"Shigeo Abe","orcid":"https://orcid.org/0000-0002-6070-0338"},"institutions":[{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Abe","raw_affiliation_strings":["Hitachi Enterprise Server Division, Horiyamashita 1, Hadano, Kanagawa 259-1392, Japan","Hitachi Enterprise Server Division, Kanagawa, Japan#TAB#"],"affiliations":[{"raw_affiliation_string":"Hitachi Enterprise Server Division, Horiyamashita 1, Hadano, Kanagawa 259-1392, Japan","institution_ids":["https://openalex.org/I65143321"]},{"raw_affiliation_string":"Hitachi Enterprise Server Division, Kanagawa, Japan#TAB#","institution_ids":["https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037027040","display_name":"B. J. Chamberlin","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. J. Chamberlin","raw_affiliation_strings":["IBM Microelectronics Division, 1701 North Street, Endicott, New York 13760, USA","IBM Microelectronics Division, Endicott, New York"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics Division, 1701 North Street, Endicott, New York 13760, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM Microelectronics Division, Endicott, New York","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010154852","display_name":"G. Katopis","orcid":null},"institutions":[{"id":"https://openalex.org/I4210091433","display_name":"Poughkeepsie Public Library District","ror":"https://ror.org/001vaag74","country_code":"US","type":"archive","lineage":["https://openalex.org/I4210091433"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. A. Katopis","raw_affiliation_strings":["IBM System/390 Division, 2455 South Road, Poughkeepsie, New York 12601, USA","IBM System, Poughkeepsie, New York"],"affiliations":[{"raw_affiliation_string":"IBM System/390 Division, 2455 South Road, Poughkeepsie, New York 12601, USA","institution_ids":["https://openalex.org/I4210091433"]},{"raw_affiliation_string":"IBM System, Poughkeepsie, New York","institution_ids":["https://openalex.org/I4210091433"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5043779621"],"corresponding_institution_ids":["https://openalex.org/I1341412227","https://openalex.org/I4210095996"],"apc_list":null,"apc_paid":null,"fwci":2.7155,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.90108845,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"46","issue":"4.5","first_page":"397","last_page":"420"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ibm","display_name":"IBM","score":0.8768630027770996},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.6654027104377747},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6122415065765381},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5303210616111755},{"id":"https://openalex.org/keywords/packaging-engineering","display_name":"Packaging engineering","score":0.5168526768684387},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4552423655986786},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.42905133962631226},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34539759159088135},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33134961128234863},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.28243288397789},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11444330215454102},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.07303464412689209}],"concepts":[{"id":"https://openalex.org/C70388272","wikidata":"https://www.wikidata.org/wiki/Q5968558","display_name":"IBM","level":2,"score":0.8768630027770996},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.6654027104377747},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6122415065765381},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5303210616111755},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.5168526768684387},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4552423655986786},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.42905133962631226},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34539759159088135},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33134961128234863},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.28243288397789},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11444330215454102},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.07303464412689209},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1147/rd.464.0397","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.464.0397","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2015568297","https://openalex.org/W2026928832","https://openalex.org/W2066755813","https://openalex.org/W2099170772","https://openalex.org/W2101195691","https://openalex.org/W2131722625","https://openalex.org/W2163351243","https://openalex.org/W2407417899","https://openalex.org/W2567245607"],"related_works":["https://openalex.org/W3126131865","https://openalex.org/W2044344400","https://openalex.org/W4253186488","https://openalex.org/W1996938127","https://openalex.org/W2083611981","https://openalex.org/W2043380045","https://openalex.org/W4231814374","https://openalex.org/W1543593092","https://openalex.org/W2099533998","https://openalex.org/W1996508635"],"abstract_inverted_index":{"This":[0,15,61],"paper":[1,96],"describes":[2],"the":[3,7,11,18,50,53,80,107,117,120,125,132,172,184],"system":[4,133],"packaging":[5],"of":[6,29,36,52,58,119,127,140,147],"processor":[8],"cage":[9],"for":[10,116,150,155,176],"IBM":[12],"eServer":[13],"z900.":[14],"server":[16],"contains":[17,46],"world's":[19],"most":[20],"complex":[21,56],"multichip":[22],"module":[23],"(MCM),":[24],"with":[25,88],"a":[26,33,40,82,159],"wiring":[27,91,173],"length":[28],"1":[30],"km":[31],"and":[32,77,79,102,124,152,163],"maximum":[34],"power":[35],"1300":[37],"W":[38],"on":[39,106,131],"glass-ceramic":[41,68],"substrate.":[42],"The":[43,137,168],"z900":[44],"MCM":[45,62,108],"35":[47],"chips":[48],"comprising":[49],"heart":[51],"central":[54],"electronic":[55],"(CEC)":[57],"this":[59,95,141],"server.":[60],"was":[63],"implemented":[64],"using":[65],"two":[66,100,112],"different":[67,113],"technologies:":[69],"one":[70],"an":[71],"MCM-D":[72],"technology":[73,85],"(using":[74,86],"thin":[75],"film":[76],"glass-ceramic)":[78,87],"other":[81],"pure":[83],"MCM-C":[84],"more":[89],"aggressive":[90],"ground":[92],"rules.":[93],"In":[94],"we":[97],"compare":[98],"these":[99],"technologies":[101,115],"describe":[103],"their":[104,128],"impact":[105,126],"electrical":[109,129,165],"design.":[110],"Similarly,":[111],"board":[114],"housing":[118],"CEC":[121],"are":[122],"discussed,":[123],"properties":[130],"design":[134,142,161,169],"is":[135,179],"described.":[136],"high-frequency":[138],"requirements":[139],"due":[143],"to":[144],"operating":[145],"frequencies":[146],"918":[148],"MHz":[149,154],"on-chip":[151],"459":[153],"off-chip":[156],"interconnects":[157],"make":[158],"comprehensive":[160],"methodology":[162],"post-routing":[164],"verification":[166],"necessary.":[167],"methodology,":[170],"including":[171],"strategy":[174],"needed":[175],"its":[177],"success,":[178],"described":[180],"in":[181,183],"detail":[182],"paper.":[185]},"counts_by_year":[{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}