{"id":"https://openalex.org/W2064355374","doi":"https://doi.org/10.1147/jrd.2009.5429025","title":"Thermally induced wrinkling in thin-film stacks on patterned substrates","display_name":"Thermally induced wrinkling in thin-film stacks on patterned substrates","publication_year":2009,"publication_date":"2009-05-01","ids":{"openalex":"https://openalex.org/W2064355374","doi":"https://doi.org/10.1147/jrd.2009.5429025","mag":"2064355374"},"language":"en","primary_location":{"id":"doi:10.1147/jrd.2009.5429025","is_oa":false,"landing_page_url":"https://doi.org/10.1147/jrd.2009.5429025","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052517352","display_name":"K. Srinivasan","orcid":"https://orcid.org/0000-0002-3346-4165"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Srinivasan","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","School of Mechanical Engineering, Purdue University , West Lafayette, Indiana"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , West Lafayette, Indiana","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002107960","display_name":"Sanjay Goyal","orcid":"https://orcid.org/0000-0003-4455-0007"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Goyal","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","School of Mechanical Engineering, Purdue University , West Lafayette, Indiana"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , West Lafayette, Indiana","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051511388","display_name":"Thomas Siegmund","orcid":"https://orcid.org/0000-0001-8162-9609"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I4210132140","display_name":"Lafayette School Corporation","ror":"https://ror.org/03ywb2q15","country_code":"US","type":"education","lineage":["https://openalex.org/I4210132140"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Siegmund","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","School of Mechanical Engineering, West Lafayette, Indiana#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, West Lafayette, Indiana#TAB#","institution_ids":["https://openalex.org/I4210132140"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080314217","display_name":"Ganesh Subbarayan","orcid":"https://orcid.org/0000-0003-0462-1130"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I4210132140","display_name":"Lafayette School Corporation","ror":"https://ror.org/03ywb2q15","country_code":"US","type":"education","lineage":["https://openalex.org/I4210132140"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Subbarayan","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","School of Mechanical Engineering, West Lafayette, Indiana#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, West Lafayette, Indiana#TAB#","institution_ids":["https://openalex.org/I4210132140"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051915862","display_name":"Qinghuang Lin","orcid":"https://orcid.org/0000-0001-5759-5832"},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Q. Lin","raw_affiliation_strings":["IBM Research Division, IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA","[IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Research Division, IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"[IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York]","institution_ids":["https://openalex.org/I4210114115"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5707,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.72886966,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"53","issue":"3","first_page":"12:1","last_page":"12:10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11870","display_name":"Structural Analysis and Optimization","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8548306822776794},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.7090495824813843},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.6833814978599548},{"id":"https://openalex.org/keywords/blanket","display_name":"Blanket","score":0.6684306263923645},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.657504677772522},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.6206626892089844},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5677489042282104},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5247530937194824},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4717999994754791},{"id":"https://openalex.org/keywords/amplitude","display_name":"Amplitude","score":0.46422430872917175},{"id":"https://openalex.org/keywords/planar","display_name":"Planar","score":0.4326504170894623},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2848988175392151},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.26474523544311523},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.21422100067138672},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.08240845799446106}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8548306822776794},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.7090495824813843},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.6833814978599548},{"id":"https://openalex.org/C2779261148","wikidata":"https://www.wikidata.org/wiki/Q5852","display_name":"Blanket","level":2,"score":0.6684306263923645},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.657504677772522},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6206626892089844},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5677489042282104},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5247530937194824},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4717999994754791},{"id":"https://openalex.org/C180205008","wikidata":"https://www.wikidata.org/wiki/Q159190","display_name":"Amplitude","level":2,"score":0.46422430872917175},{"id":"https://openalex.org/C134786449","wikidata":"https://www.wikidata.org/wiki/Q3391255","display_name":"Planar","level":2,"score":0.4326504170894623},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2848988175392151},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.26474523544311523},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.21422100067138672},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.08240845799446106},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1147/jrd.2009.5429025","is_oa":false,"landing_page_url":"https://doi.org/10.1147/jrd.2009.5429025","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1588835142","https://openalex.org/W1612694341","https://openalex.org/W1976295772","https://openalex.org/W1982850149","https://openalex.org/W1985974591","https://openalex.org/W1990284496","https://openalex.org/W1995586302","https://openalex.org/W2009882024","https://openalex.org/W2014516678","https://openalex.org/W2027862459","https://openalex.org/W2031567600","https://openalex.org/W2036135182","https://openalex.org/W2037187069","https://openalex.org/W2053797609","https://openalex.org/W2057325530","https://openalex.org/W2066185429","https://openalex.org/W2068220247","https://openalex.org/W2085503899","https://openalex.org/W2105090530","https://openalex.org/W2118020929","https://openalex.org/W2144133027","https://openalex.org/W2144237170","https://openalex.org/W2156778471","https://openalex.org/W2160468306","https://openalex.org/W2160555344","https://openalex.org/W2164875840","https://openalex.org/W2313824732","https://openalex.org/W2821216027"],"related_works":["https://openalex.org/W2078628341","https://openalex.org/W1990427537","https://openalex.org/W2073004376","https://openalex.org/W2019826257","https://openalex.org/W2976412857","https://openalex.org/W1547324859","https://openalex.org/W2604125360","https://openalex.org/W2612326559","https://openalex.org/W1977214202","https://openalex.org/W2064355374"],"abstract_inverted_index":{"Thermally":[0],"induced":[1],"film":[2,17,27],"wrinkling":[3,28,41,72,96,107,110],"is":[4,29,48,68,89],"a":[5,15,20,60,65,74,78,117,121],"fabrication":[6],"and":[7,101,135],"reliability":[8],"challenge":[9],"for":[10,116],"thin-film":[11,33,43,118],"stacks":[12,34,44],"consisting":[13],"of":[14,26,40,49,132],"compliant":[16],"capped":[18],"by":[19],"stiffer":[21],"film.":[22],"The":[23],"current":[24],"understanding":[25,39],"largely":[30],"restricted":[31],"to":[32,53,70,91,126],"on":[35,45,64,77,120,129],"blanket":[36],"substrates.":[37],"An":[38],"in":[42,73,85,106],"patterned":[46,80,99,112,122],"substrates":[47],"greater":[50],"practical":[51],"relevance":[52],"the":[54,86,93,130,133],"microelectronic":[55],"industry.":[56],"Toward":[57],"this":[58],"goal,":[59],"numerical":[61],"technique":[62],"based":[63],"spectral":[66],"method":[67],"employed":[69],"simulate":[71],"stiff-film/compliant-film":[75],"system":[76],"rigid":[79],"substrate.":[81],"A":[82],"coupling":[83,105],"term":[84],"Fourier":[87],"space":[88],"introduced":[90],"capture":[92],"interaction":[94],"between":[95],"amplitudes":[97,108,115],"above":[98,111],"regions":[100],"surrounding":[102],"regions.":[103,113],"This":[104],"suppresses":[109],"Wrinkling":[114],"stack":[119],"substrate":[123],"are":[124],"shown":[125],"be":[127],"dependent":[128],"size":[131],"patterns":[134],"their":[136],"relative":[137],"spacing.":[138]},"counts_by_year":[{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}